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Author :
Publisher :
ISBN 13 :
Total Pages : 100 pages
Book Rating : 4.3/5 (91 download)
Download or read book Mechanics and Materials for Electronic Packaging: Coupled field behavior in materials written by and published by . This book was released on 1994 with total page 100 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mckeown
Publisher : CRC Press
ISBN 13 : 9780824770334
Total Pages : 382 pages
Book Rating : 4.7/5 (73 download)
Download or read book Mechanical Analysis of Electronic Packaging Systems written by Mckeown and published by CRC Press. This book was released on 1999-04-06 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
Author :
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (94 download)
Download or read book Mechanics and Materials for Electronic Packaging: Design and process issues in electronic packaging written by and published by . This book was released on 1994 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Avram Bar-Cohen
Publisher : World Scientific
ISBN 13 : 9811209634
Total Pages : 1079 pages
Book Rating : 4.8/5 (112 download)
Download or read book Encyclopedia of Packaging Materials, Processes, and Mechanics written by Avram Bar-Cohen and published by World Scientific. This book was released on 2019 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website
Author : American Society of Mechanical Engineers. Applied Mechanics Division
Publisher :
ISBN 13 :
Total Pages : 244 pages
Book Rating : 4.3/5 (91 download)
Download or read book Mechanics and Materials for Electronic Packaging: Design and process issues in electronic packaging written by American Society of Mechanical Engineers. Applied Mechanics Division and published by . This book was released on 1994 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 244 pages
Book Rating : 4.3/5 (91 download)
Download or read book Mechanics and Materials for Electronic Packaging: Thermal and mechanical behavior and modeling written by and published by . This book was released on 1994 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : W. T. Chen
Publisher :
ISBN 13 : 9780791814277
Total Pages : 0 pages
Book Rating : 4.8/5 (142 download)
Download or read book Mechanics and Materials for Electronic Packaging written by W. T. Chen and published by . This book was released on 1994 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : International Mechanical Engineering Congress and Exposition (1994, Chicago, Ill.)
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (614 download)
Download or read book Mechanics and Materials for Electronic Packaging written by International Mechanical Engineering Congress and Exposition (1994, Chicago, Ill.) and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ali Jamnia
Publisher : CRC Press
ISBN 13 : 1439870926
Total Pages : 336 pages
Book Rating : 4.4/5 (398 download)
Download or read book Practical Guide to the Packaging of Electronics, Second Edition written by Ali Jamnia and published by CRC Press. This book was released on 2008-11-20 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Author : William T. Chen
Publisher :
ISBN 13 : 9780791814499
Total Pages : 0 pages
Book Rating : 4.8/5 (144 download)
Download or read book Mechanics and Materials for Electronic Packaging written by William T. Chen and published by . This book was released on 1994 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Michael Pecht
Publisher : CRC Press
ISBN 13 : 1498730868
Total Pages : 120 pages
Book Rating : 4.4/5 (987 download)
Download or read book Electronic Packaging Materials and Their Properties written by Michael Pecht and published by CRC Press. This book was released on 2017-12-19 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Download or read book Mechanics and Materials for Electronic Packaging written by and published by . This book was released on 1994 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Glenn R. Blackwell
Publisher : CRC Press
ISBN 13 : 1420049844
Total Pages : 638 pages
Book Rating : 4.4/5 (2 download)
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 638 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Author : Yong Liu
Publisher : Springer Science & Business Media
ISBN 13 : 1461410533
Total Pages : 606 pages
Book Rating : 4.4/5 (614 download)
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author : Michael A. Schen
Publisher :
ISBN 13 : 9780791814277
Total Pages : 0 pages
Book Rating : 4.8/5 (142 download)
Download or read book Mechanics and Materials for Electronic Packaging written by Michael A. Schen and published by . This book was released on 1994 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ephraim Suhir
Publisher : Springer Science & Business Media
ISBN 13 : 0387329897
Total Pages : 1471 pages
Book Rating : 4.3/5 (873 download)
Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author :
Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
