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Author : Ting Y. Tsui
Publisher :
ISBN 13 :
Total Pages : 498 pages
Book Rating : 4.3/5 (91 download)
Download or read book Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects written by Ting Y. Tsui and published by . This book was released on 2006 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 624 pages
Book Rating : 4.:/5 (318 download)
Download or read book Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics written by and published by . This book was released on 2001 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : R. J. Carter
Publisher :
ISBN 13 :
Total Pages : 432 pages
Book Rating : 4.:/5 (318 download)
Download or read book Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004 written by R. J. Carter and published by . This book was released on 2004-09 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Author : Tapan Gupta
Publisher : Springer Science & Business Media
ISBN 13 : 1441900764
Total Pages : 433 pages
Book Rating : 4.4/5 (419 download)
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Author : Materials Research Society. Meeting
Publisher :
ISBN 13 :
Total Pages : 544 pages
Book Rating : 4.:/5 (318 download)
Download or read book Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics, 2003 written by Materials Research Society. Meeting and published by . This book was released on 2003 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566773799
Total Pages : 364 pages
Book Rating : 4.7/5 (737 download)
Download or read book Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics written by and published by The Electrochemical Society. This book was released on 2003 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : G. S. Mathad
Publisher : The Electrochemical Society
ISBN 13 : 9781566773935
Total Pages : 438 pages
Book Rating : 4.7/5 (739 download)
Download or read book Thin Film Materials, Processes, and Reliability written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2003 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 1119966868
Total Pages : 616 pages
Book Rating : 4.1/5 (199 download)
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author : Paul S. Ho
Publisher : Springer Science & Business Media
ISBN 13 : 3642559085
Total Pages : 323 pages
Book Rating : 4.6/5 (425 download)
Download or read book Low Dielectric Constant Materials for IC Applications written by Paul S. Ho and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 323 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for
Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 0470662549
Total Pages : 616 pages
Book Rating : 4.4/5 (76 download)
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author : Yosi Shacham-Diamand
Publisher : Springer Science & Business Media
ISBN 13 : 0387958681
Total Pages : 545 pages
Book Rating : 4.3/5 (879 download)
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Author : Dominic Schepis
Publisher : Elsevier
ISBN 13 : 044313524X
Total Pages : 428 pages
Book Rating : 4.4/5 (431 download)
Download or read book Handbook of Thin Film Deposition written by Dominic Schepis and published by Elsevier. This book was released on 2024-10-08 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fifth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry. When pursuing patents, there is a phase called 'reduction to practice' where the idea for a technology transitions from a concept to actual use. The section 'Thin Film Reduction to Practice' includes chapters that review the most relevant methods to fabricate thin films towards practical applications. Then, the latest applications of thin film deposition technologies are discussed. Handbook of Thin Film Deposition, 5th Edition is suitable for materials scientists and engineers in academia and working in semiconductor R&D. - Offers a practical survey of thin film technologies including design, fabrication, and reliability - Covers core processes and applications in the semiconductor industry and discusses latest advances in new thin film development - Features new chapters that review methods on front-end and back-end thin films
Author : Yoshio Nishi
Publisher : CRC Press
ISBN 13 : 1420017667
Total Pages : 1720 pages
Book Rating : 4.4/5 (2 download)
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author : Freddy Yin Chiang Boey
Publisher : World Scientific
ISBN 13 : 9814730718
Total Pages : 244 pages
Book Rating : 4.8/5 (147 download)
Download or read book 50 Years Of Materials Science In Singapore written by Freddy Yin Chiang Boey and published by World Scientific. This book was released on 2016-06-17 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt: 50 Years of Materials Science in Singapore describes in vivid detail how a newly independent nation like Singapore developed world-class research capabilities in materials science that helped the country make rapid progress in energy, biomedical and electronics sectors. The economy mirrored this rapid trail of progress, utilizing home-grown technology and the contribution of materials science to the various sectors is undeniable in ensuring the economic growth and stability of Singapore.
Author : Electronic Device Failure Analysis Society
Publisher : ASM International
ISBN 13 : 1615030891
Total Pages : 524 pages
Book Rating : 4.6/5 (15 download)
Download or read book ISTFA 2006 written by Electronic Device Failure Analysis Society and published by ASM International. This book was released on 2006 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : ASM International
Publisher : ASM International
ISBN 13 : 1615030905
Total Pages : 372 pages
Book Rating : 4.6/5 (15 download)
Download or read book ISTFA 2007 Proceedings of the 33rd International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2007-01-01 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Author : Mohsen Sheikholeslami Kandelousi
Publisher : BoD – Books on Demand
ISBN 13 : 1789238374
Total Pages : 246 pages
Book Rating : 4.7/5 (892 download)
Download or read book Nanofluid Flow in Porous Media written by Mohsen Sheikholeslami Kandelousi and published by BoD – Books on Demand. This book was released on 2020-08-19 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt: Studies of fluid flow and heat transfer in a porous medium have been the subject of continuous interest for the past several decades because of the wide range of applications, such as geothermal systems, drying technologies, production of thermal isolators, control of pollutant spread in groundwater, insulation of buildings, solar power collectors, design of nuclear reactors, and compact heat exchangers, etc. There are several models for simulating porous media such as the Darcy model, Non-Darcy model, and non-equilibrium model. In porous media applications, such as the environmental impact of buried nuclear heat-generating waste, chemical reactors, thermal energy transport/storage systems, the cooling of electronic devices, etc., a temperature discrepancy between the solid matrix and the saturating fluid has been observed and recognized.
