Finite Element Stress Analysis Of A Surface Mount Solder Joint With Automatic Mesh Generation

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Masters Theses in the Pure and Applied Sciences

Author : Wade H. Shafer
Publisher : Springer Science & Business Media
ISBN 13 : 1461524539
Total Pages : 391 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Masters Theses in the Pure and Applied Sciences by : Wade H. Shafer

Download or read book Masters Theses in the Pure and Applied Sciences written by Wade H. Shafer and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the though that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemi nation. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 37 (thesis year 1992) a total of 12,549 thesis titles from 25 Canadian and 153 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 37 reports theses submitted in 1992, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.

Masters Theses in the Pure and Applied Sciences

Author : W. H. Shafer
Publisher : Springer Science & Business Media
ISBN 13 : 9780306447112
Total Pages : 410 pages
Book Rating : 4.4/5 (471 download)

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Book Synopsis Masters Theses in the Pure and Applied Sciences by : W. H. Shafer

Download or read book Masters Theses in the Pure and Applied Sciences written by W. H. Shafer and published by Springer Science & Business Media. This book was released on 1994 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 37 (thesis year 1992) reports a total of 12,549 thesis titles from 25 Canadian and 153 US universities (theses submitted in previous years but only now reported are indicated by the thesis year shown in parenthesis). The organization, like that of past years, consists of thesis titles arrange

Structural Analysis in Microelectronics and Fiber Optic Systems

Author :
Publisher :
ISBN 13 :
Total Pages : 98 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Structural Analysis in Microelectronics and Fiber Optic Systems by :

Download or read book Structural Analysis in Microelectronics and Fiber Optic Systems written by and published by . This book was released on 1994 with total page 98 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings of the Technical Program

Author :
Publisher :
ISBN 13 :
Total Pages : 792 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Proceedings of the Technical Program by :

Download or read book Proceedings of the Technical Program written by and published by . This book was released on 1991 with total page 792 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Mechanics and Materials for Electronic Packaging: Design and process issues in electronic packaging

Author : American Society of Mechanical Engineers. Applied Mechanics Division
Publisher :
ISBN 13 :
Total Pages : 244 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Mechanics and Materials for Electronic Packaging: Design and process issues in electronic packaging by : American Society of Mechanical Engineers. Applied Mechanics Division

Download or read book Mechanics and Materials for Electronic Packaging: Design and process issues in electronic packaging written by American Society of Mechanical Engineers. Applied Mechanics Division and published by . This book was released on 1994 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Solder Joint Reliability

Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 1461539102
Total Pages : 649 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Solder Joint Reliability by : John H. Lau

Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Engineering Analysis with ANSYS Software

Author : Tadeusz Stolarski
Publisher : Butterworth-Heinemann
ISBN 13 : 0081021658
Total Pages : 564 pages
Book Rating : 4.0/5 (81 download)

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Book Synopsis Engineering Analysis with ANSYS Software by : Tadeusz Stolarski

Download or read book Engineering Analysis with ANSYS Software written by Tadeusz Stolarski and published by Butterworth-Heinemann. This book was released on 2018-01-02 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Engineering Analysis with ANSYS Software, Second Edition, provides a comprehensive introduction to fundamental areas of engineering analysis needed for research or commercial engineering projects. The book introduces the principles of the finite element method, presents an overview of ANSYS technologies, then covers key application areas in detail. This new edition updates the latest version of ANSYS, describes how to use FLUENT for CFD FEA, and includes more worked examples. With detailed step-by-step explanations and sample problems, this book develops the reader's understanding of FEA and their ability to use ANSYS software tools to solve a range of analysis problems. - Uses detailed and clear step-by-step instructions, worked examples and screen-by-screen illustrative problems to reinforce learning - Updates the latest version of ANSYS, using FLUENT instead of FLOWTRAN - Includes instructions for use of WORKBENCH - Features additional worked examples to show engineering analysis in a broader range of practical engineering applications

The Engineering Index Annual

Author :
Publisher :
ISBN 13 :
Total Pages : 2264 pages
Book Rating : 4.:/5 (319 download)

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Book Synopsis The Engineering Index Annual by :

Download or read book The Engineering Index Annual written by and published by . This book was released on 1992 with total page 2264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since its creation in 1884, Engineering Index has covered virtually every major engineering innovation from around the world. It serves as the historical record of virtually every major engineering innovation of the 20th century. Recent content is a vital resource for current awareness, new production information, technological forecasting and competitive intelligence. The world?s most comprehensive interdisciplinary engineering database, Engineering Index contains over 10.7 million records. Each year, over 500,000 new abstracts are added from over 5,000 scholarly journals, trade magazines, and conference proceedings. Coverage spans over 175 engineering disciplines from over 80 countries. Updated weekly.

Proceedings of the Technical Conference

Author :
Publisher :
ISBN 13 :
Total Pages : 754 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Proceedings of the Technical Conference by :

Download or read book Proceedings of the Technical Conference written by and published by . This book was released on 1989 with total page 754 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Science Abstracts

Author :
Publisher :
ISBN 13 :
Total Pages : 1990 pages
Book Rating : 4.3/5 (243 download)

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Book Synopsis Science Abstracts by :

Download or read book Science Abstracts written by and published by . This book was released on 1995 with total page 1990 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Resonant MEMS

Author : Oliver Brand
Publisher : John Wiley & Sons
ISBN 13 : 352767635X
Total Pages : 512 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Resonant MEMS by : Oliver Brand

Download or read book Resonant MEMS written by Oliver Brand and published by John Wiley & Sons. This book was released on 2015-04-22 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Part of the AMN book series, this book covers the principles, modeling and implementation as well as applications of resonant MEMS from a unified viewpoint. It starts out with the fundamental equations and phenomena that govern the behavior of resonant MEMS and then gives a detailed overview of their implementation in capacitive, piezoelectric, thermal and organic devices, complemented by chapters addressing the packaging of the devices and their stability. The last part of the book is devoted to the cutting-edge applications of resonant MEMS such as inertial, chemical and biosensors, fluid properties sensors, timing devices and energy harvesting systems.

Reflow Soldering Processes

Author : Ning-Cheng Lee
Publisher : Newnes
ISBN 13 : 0750672188
Total Pages : 282 pages
Book Rating : 4.7/5 (56 download)

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Book Synopsis Reflow Soldering Processes by : Ning-Cheng Lee

Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Analysis and Design of Machine Elements

Author : Wei Jiang
Publisher : John Wiley & Sons
ISBN 13 : 1119276101
Total Pages : 558 pages
Book Rating : 4.1/5 (192 download)

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Book Synopsis Analysis and Design of Machine Elements by : Wei Jiang

Download or read book Analysis and Design of Machine Elements written by Wei Jiang and published by John Wiley & Sons. This book was released on 2019-01-30 with total page 558 pages. Available in PDF, EPUB and Kindle. Book excerpt: Incorporating Chinese, European, and International standards and units of measurement, this book presents a classic subject in an up-to-date manner with a strong emphasis on failure analysis and prevention-based machine element design. It presents concepts, principles, data, analyses, procedures, and decision-making techniques necessary to design safe, efficient, and workable machine elements. Design-centric and focused, the book will help students develop the ability to conceptualize designs from written requirements and to translate these design concepts into models and detailed manufacturing drawings. Presents a consistent approach to the design of different machine elements from failure analysis through strength analysis and structural design, which facilitates students’ understanding, learning, and integration of analysis with design Fundamental theoretical topics such as mechanics, friction, wear and lubrication, and fluid mechanics are embedded in each chapter to illustrate design in practice Includes examples, exercises, review questions, design and practice problems, and CAD examples in each self-contained chapter to enhance learning Analysis and Design of Machine Elements is a design-centric textbook for advanced undergraduates majoring in Mechanical Engineering. Advanced students and engineers specializing in product design, vehicle engineering, power machinery, and engineering will also find it a useful reference and practical guide.

Power Electronic Packaging

Author : Yong Liu
Publisher : Springer Science & Business Media
ISBN 13 : 1461410533
Total Pages : 606 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Power Electronic Packaging by : Yong Liu

Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Microwave Circuit Modeling Using Electromagnetic Field Simulation

Author : Daniel G. Swanson
Publisher : Artech House
ISBN 13 : 9781580536882
Total Pages : 508 pages
Book Rating : 4.5/5 (368 download)

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Book Synopsis Microwave Circuit Modeling Using Electromagnetic Field Simulation by : Daniel G. Swanson

Download or read book Microwave Circuit Modeling Using Electromagnetic Field Simulation written by Daniel G. Swanson and published by Artech House. This book was released on 2003 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation This practical "how to" book is an ideal introduction to electromagnetic field-solvers. Where most books in this area are strictly theoretical, this unique resource provides engineers with helpful advice on selecting the right tools for their RF (radio frequency) and high-speed digital circuit design work

The Potentiometer Handbook

Author : Carl David Todd
Publisher : McGraw-Hill Companies
ISBN 13 :
Total Pages : 324 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis The Potentiometer Handbook by : Carl David Todd

Download or read book The Potentiometer Handbook written by Carl David Todd and published by McGraw-Hill Companies. This book was released on 1975 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Assembly and Reliability of Lead-Free Solder Joints

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811539200
Total Pages : 545 pages
Book Rating : 4.8/5 (115 download)

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Book Synopsis Assembly and Reliability of Lead-Free Solder Joints by : John H. Lau

Download or read book Assembly and Reliability of Lead-Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.