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Fabrication And Characterization Of Aluminum Nitride Thin Films Deposited By Rf Magnetron Sputtering
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Book Synopsis Fabrication and Characterization of Aluminum Nitride Thin Films Deposited by RF Magnetron Sputtering by : William A. Carrington
Download or read book Fabrication and Characterization of Aluminum Nitride Thin Films Deposited by RF Magnetron Sputtering written by William A. Carrington and published by . This book was released on 1991 with total page 146 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Aluminum Nitride Thin Films - Deposition for Fabrication, Characterization and Fabrication of Surface Acoustic Wave Devices by : Charlee Fansler
Download or read book Aluminum Nitride Thin Films - Deposition for Fabrication, Characterization and Fabrication of Surface Acoustic Wave Devices written by Charlee Fansler and published by . This book was released on 2008 with total page 124 pages. Available in PDF, EPUB and Kindle. Book excerpt: Aluminum Nitride (AlN) thin films can be used for many device applications; for example, Surface Acoustic Wave (SAW) devices, microelectromechanical systems (MEMS) applications, and packaging applications. In this work, AlN is the critical layer in the fabrication process. One challenge is reliable deposition over wafer size substrates. The method of interest for deposition is pulsed DC sputtering. The (002) plane is the desired plane for its piezoelectric properties. The surface roughness of the deposited AlN is low and adheres well to the substrate. An AlN layer was deposited on a UNCD/Si substrate. Al was deposited on the AlN layer to form the IDTs (interdigital transducers) for SAW devices. SAW devices were fabricated on quartz - ST substrate. To verify the SAW devices work, they were tested using a network analyzer. This book discusses these results and parameters for AlN film deposition, film properties and implications for devices. This book would be beneficial for professionals, scientists, engineers, and graduate students in science and engineering working in the areas of wide bandgap semi-conductors, nitrides and piezoelectric materials and various acoustic wave devices.
Book Synopsis Fabrication and Characterization of Silicon Nitride Thin Film Planar Waveguides Produced by RF Magnetron Sputtering Technique by : Uzair Majeed
Download or read book Fabrication and Characterization of Silicon Nitride Thin Film Planar Waveguides Produced by RF Magnetron Sputtering Technique written by Uzair Majeed and published by . This book was released on 2016 with total page 125 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Aluminum Nitride Thin Films for MEMS Resonators by : Vanni Lughi
Download or read book Aluminum Nitride Thin Films for MEMS Resonators written by Vanni Lughi and published by . This book was released on 2006 with total page 530 pages. Available in PDF, EPUB and Kindle. Book excerpt: High quality aluminum nitride films, meeting all the requirements for the fabrication of the resonators, were deposited at low temperature (
Book Synopsis Fabrication and Characterization of Ni-Mn-Ga Thin Films from Binder Jetting Additive Manufactured Sputtering Target by : Christopher Yaw Bansah
Download or read book Fabrication and Characterization of Ni-Mn-Ga Thin Films from Binder Jetting Additive Manufactured Sputtering Target written by Christopher Yaw Bansah and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ni-Mn-Ga thin films have attracted significant attention over the past two decades due to its multifunctional properties, leveraging these characteristics in applications such as actuators, sensors, and micro-electromechanical systems (MEMS). The most favorable deposition technique for making Ni-Mn-Ga thin films is magnetron sputtering where the target used is near stoichiometric Ni2MnGa alloy. Ni-Mn-Ga alloy target manufacturing has been challenging and costly due to design constraints, process optimization issues and inefficient target utilization resulting in compounded negative economics. To address these problems, this research aimed at investigating and demonstrating the viability of a cost-effective, modern technology known as binder jetting additive manufacturing (BJAM) technique to produce targets with excellent target consumption efficiency based on proposed target design. The additive manufactured Ni-Mn-Ga alloy target process began with ball-milled Ni-Mn-Ga powder having bimodal particle distribution to ensure an increased packing density and mechanical strength after the determination of optimized 3D printing parameters. The printed targets were post-processed through curing, de-binding and sintering. Sintering was conducted in an inert/argon atmosphere to safeguard essential material properties which were benchmarked through characterization. Backscattered electron (BSE) micrographs showed AM targets were homogenous with martensitic twin microstructures necessary for shape memory behavior. The XRD results showed that the martensitic twin microstructures were mostly tetragonal and monoclinic crystal structures. The martensitic transformation temperatures for Ni-Mn-Ga targets ranged from 79.3 to 148.1°C and possessed a maximum density of 87.18%. Using the direct current (DC) magnetron sputtering, Ni-Mn-Ga thin films were deposited on Si (100) substrates at discharge currents ranging from 0.05 to 0.15 A and substrate temperatures 20°C to 700°C. The effect of discharge current and substrate temperature on surface morphology, composition, crystal structure of Ni-Mn-Ga thin films on silicon substrates were investigated. As the discharge current increased, the film showed increased grain size. The grain morphology, as appeared from the investigation of the film planar surface was of elongated grains. The film crystallinity also increased with increased discharge current, as proved by XRD investigations. The most important effect of maintaining the discharge current value constant and increasing the substrate temperature was the change in chemistry and crystallography of the obtained Ni-Mn-Ga thin films. The film deposited at 700°C showed the closest chemical composition to the target composition. For the other substrate temperatures, the high oxygen contamination, due perhaps to not-so-optimum deposition conditions, drastically altered the film composition. By increasing the substrate temperature, the film crystal structure changed from Heusler L2I cubic (high temperature phase) to monoclinic (low temperature phase). It was also demonstrated that, 3D printed sputtering targets of different geometrical designs are potential for improving target utilization efficiency and film properties.
Book Synopsis Synthesis, Optimization, and Characterization of ALN-TIN Thin Film Heterostructures by : Cynthia Kornegay Waters
Download or read book Synthesis, Optimization, and Characterization of ALN-TIN Thin Film Heterostructures written by Cynthia Kornegay Waters and published by . This book was released on 2004 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Investigates the hardnesses, elastic moduli, and fracture mechanic properties of aluminum nitride and titanium nitride thin film multilayers when deposited in various thicknesses on silicon. Utilized pulsed laser deposition to grow the thin films.
Book Synopsis Fabrication and device application of ferroelectric thin films deposited by RF-magnetron sputtering process by :
Download or read book Fabrication and device application of ferroelectric thin films deposited by RF-magnetron sputtering process written by and published by . This book was released on 1997 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Reactive Ion Enhanced Magnetron Sputtering of Nitride Thin Films by : Al-Ahsan Talukder
Download or read book Reactive Ion Enhanced Magnetron Sputtering of Nitride Thin Films written by Al-Ahsan Talukder and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Magnetron sputtering is a popular vacuum plasma coating technique used for depositing metals, dielectrics, semiconductors, alloys, and compounds onto a wide range of substrates. In this work, we present two popular types of magnetron sputtering, i.e., pulsed DC and RF magnetron sputtering, for depositing piezoelectric aluminum nitride (AlN) thin films with high Young's modulus. The effects of important process parameters on the plasma I-V characteristics, deposition rate, and the properties of the deposited AlN films, are studied comprehensively. The effects of these process parameters on Young's modulus of the deposited films are also presented. Scanning electron microscope imaging revealed a c-axis oriented columnar growth of AlN. Performance of surface acoustic devices, utilizing the AlN films deposited by magnetron sputtering, are also presented, which confirms the differences in qualities and microstructures of the pulsed DC and RF sputtered films. The RF sputtered AlN films showed a denser microstructure with smaller grains and a smoother surface than the pulsed DC sputtered films. However, the deposition rate of RF sputtering is about half of the pulsed DC sputtering process. We also present a novel ion source enhanced pulsed DC magnetron sputtering for depositing high-quality nitrogen-doped zinc telluride (ZnTe:N) thin films. This ion source enhanced magnetron sputtering provides an increased deposition rate, efficient N-doping, and improved electrical, structural, and optical properties than the traditional magnetron sputtering. Ion source enhanced deposition leads to ZnTe:N films with smaller lattice spacing and wider X-ray diffraction peak, which indicates denser films with smaller crystallites embedded in an amorphous matrix.
Download or read book Chemical Abstracts written by and published by . This book was released on 2002 with total page 2692 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis RF Magnetron Sputtered YSZ Thin Films: Fabrication and Characterization by : Shahrul Razi bin Meskon
Download or read book RF Magnetron Sputtered YSZ Thin Films: Fabrication and Characterization written by Shahrul Razi bin Meskon and published by . This book was released on 2011 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Fabrication and Characterization of Iron Nitride Thin Films and Nanopore Devices by : 顏嘉男
Download or read book Fabrication and Characterization of Iron Nitride Thin Films and Nanopore Devices written by 顏嘉男 and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Strategies in Thin Film Engineering by Magnetron Sputtering by : Alberto Palmero
Download or read book Advanced Strategies in Thin Film Engineering by Magnetron Sputtering written by Alberto Palmero and published by MDPI. This book was released on 2020-12-10 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent years have witnessed the flourishing of numerous novel strategies based on the magnetron sputtering technique aimed at the advanced engineering of thin films, such as HiPIMS, combined vacuum processes, the implementation of complex precursor gases or the inclusion of particle guns in the reactor, among others. At the forefront of these approaches, investigations focused on nanostructured coatings appear today as one of the priorities in many scientific and technological communities: The science behind them appears in most of the cases as a "terra incognita", fascinating both the fundamentalist, who imagines new concepts, and the experimenter, who is able to create and study new films with as of yet unprecedented performances. These scientific and technological challenges, along with the existence of numerous scientific issues that have yet to be clarified in classical magnetron sputtering depositions (e.g., process control and stability, nanostructuration mechanisms, connection between film morphology and properties or upscaling procedures from the laboratory to industrial scales) have motivated us to edit a specialized volume containing the state-of-the art that put together these innovative fundamental and applied research topics. These include, but are not limited to: • Nanostructure-related properties; • Atomistic processes during film growth; • Process control, process stability, and in situ diagnostics; • Fundamentals and applications of HiPIMS; • Thin film nanostructuration phenomena; • Tribological, anticorrosion, and mechanical properties; • Combined procedures based on the magnetron sputtering technique; • Industrial applications; • Devices.
Book Synopsis Design, Fabrication, and Characterization of a Compact Magnetron Sputtering System for Micro/nano Fabrication by : Mitchell David Hsing
Download or read book Design, Fabrication, and Characterization of a Compact Magnetron Sputtering System for Micro/nano Fabrication written by Mitchell David Hsing and published by . This book was released on 2019 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: A general rule of thumb for new semiconductor fabrication facilities (fabs) is that revenues from the first year of production must match the capital cost of building the fab itself. With modem fabs routinely exceeding $1 billion to build, this rule serves as a significant barrier to entry for groups seeking to commercialize new semiconductor devices aimed at smaller market segments which require a dedicated process. To address this gap in the industry, we are developing a I" Fab line of dedicated tools which processes small 1-2" wafers and feature the same functionality as large-scale commercial micro/nano fabrication tools, but with a significant reduction in cost and footprint. To enable the envisioned 1" Fab a reality, this thesis describes the design, development and testing of a sputtering physical vapor deposition tool, a critical tool in the 1" Fab line of tools. The tool is designed to be compatible with the 1" Fab's four-module, modular tool infrastructure, and also to allow for sharing of its peripheral equipment with other components of the 1" Fab. The modularity feature allows for multiple tools be created using an interchangeable tool platform while the shared backend equipment feature allows for a sizable cost-saving benefit, as the cost of peripheral equipment for any given tool is up to 70% of the tool's total cost. Our developed sputtering tool features the successful implementation of these two design components with a final build cost of around $25k - roughly one-seventh of the cost of a commercial tool. The sputtering tool's performance was fully characterized for both reactive and nonreactive sputtering processes. The tool's non-reactive metal depositions were examined in detail using a design of experiment response surface model. Deposition rates of up to 5.5 A/s were observed while maintaining a uniformity of ~3% across the wafer. Utilizing a direct sputter technique, this represents a deposition rate that is 4x faster than state of the practice tools while also attaining the same level of uniformity. Alongside the development of metal depositions processes, the reactive sputtering capabilities of the tool were also demonstrated through successful process development for the deposition of Aluminum Nitride (AlN). Three unique operation regions, for AlN reactive sputtering were discovered with the highest quality AlN depositions observed in transition region. Stable and repeatable depositions were achieved via the development of two control methods - voltage control and flow control. Using this optimized process, highly c-axis aligned films with columnar growth structures were observed indicating the production of high quality AlN films. This successfully developed tool alongside its optimized processes is well suited for integration into the 1" Fab, further enabling the realization of our envisioned low-cost micro/nano fabrication platform.
Book Synopsis Silicon Nitride Based Coatings Grown by Reactive Magnetron Sputtering by : Tuomas Hänninen
Download or read book Silicon Nitride Based Coatings Grown by Reactive Magnetron Sputtering written by Tuomas Hänninen and published by Linköping University Electronic Press. This book was released on 2018-02-13 with total page 73 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon nitride and silicon nitride-based ceramics have several favorable material properties, such as high hardness and good wear resistance, which makes them important materials for the coating industry. This thesis focuses the synthesis of silicon nitride, silicon oxynitride, and silicon carbonitride thin films by reactive magnetron sputtering. The films were characterized based on their chemical composition, chemical bonding structure, and mechanical properties to link the growth conditions to the film properties. Silicon nitride films were synthesized by reactive high power impulse magnetron sputtering (HiPIMS) from a Si target in Ar/N2 atmospheres, whereas silicon oxynitride films were grown by using nitrous oxide as the reactive gas. Silicon carbonitride was synthesized by two different methods. The first method was using acetylene (C2H2) in addition to N2 in a Si HiPIMS process and the other was co-sputtering of Si and C, using HiPIMS for Si and direct current magnetron sputtering (DCMS) for graphite targets in an Ar/N2 atmosphere. Langmuir probe measurements were carried out for the silicon nitride and silicon oxynitride processes and positive ion mass spectrometry for the silicon nitride processes to gain further understanding on the plasma conditions during film growth. The target current and voltage waveforms of the reactive HiPIMS processes were evaluated. The main deposition parameter affecting the nitrogen concentration of silicon nitride films was found to be the nitrogen content in the plasma. Films with nitrogen contents of 50 at.% were deposited at N2/Ar flow ratios of 0.3 and above. These films showed Si-N as the dominating component in Si 2p X-ray photoelectron spectroscopy (XPS) core level spectra and Si–Si bonds were absent. The substrate temperature and target power were found to affect the nitrogen content to a lower extent. The residual stress and hardness of the films were found to increase with the film nitrogen content. Another factors influencing the coating stress were the process pressure, negative substrate bias, substrate temperature, and HiPIMS pulse energy. Silicon nitride coatings with good adhesion and low levels of compressive residual stress were grown by using a pressure of 600 mPa, a substrate temperature below 200 °C, pulse energies below 2.5 Ws, and negative bias voltages up to 100 V. The elemental composition of silicon oxynitride films was shown to depend on the target power settings as well as on the nitrous oxide flow rate. Silicon oxide-like films were synthesized under poisoned target surface conditions, whereas films deposited in the transition regime between poisoned and metallic conditions showed higher nitrogen concentrations. The nitrogen content of the films deposited in the transition region was controlled by the applied gas flow rate. The applied target power did not affect the nitrogen concentration in the transition regime, while the oxygen content increased at decreasing target powers. The chemical composition of the films was shown to range from silicon-rich to effectively stoichiometric silicon oxynitrides, where no Si–Si contributions were found in the XPS Si 2p core level spectra. The film optical properties, namely the refractive index and extinction coefficient, were shown to depend on the film chemical bonding, with the stoichiometric films displaying optical properties falling between those of silicon oxide and silicon nitride. The properties of silicon carbonitride films were greatly influenced by the synthesis method. The films deposited by HiPIMS using acetylene as the carbon source showed silicon nitride-like mechanical properties, such as a hardness of ~ 20 GPa and compressive residual stresses of 1.7 – 1.9 GPa, up to film carbon contents of 30 at.%. At larger film carbon contents the films had increasingly amorphous carbon-like properties, such as densities below 2 g/cm3 and hardnesses below 10 GPa. The films with more than 30 at.% carbon also showed columnar morphologies in cross-sectional scanning electron microscopy, whereas films with lower carbon content showed dense morphologies. Due to the use of acetylene the carbonitride films contained hydrogen, up to ~ 15 at.%. The co-sputtered silicon carbonitride films showed a layered SiNx/CNx structure. The hardness of these films increased with the film carbon content, reaching a maximum of 18 GPa at a film carbon content of 12 at.%. Comparatively hard and low stressed films were grown by co-sputtering using a C target power of 1200 W for a C content around 12 at.%, a negative substrate bias less than 100 V, and a substrate temperature up to 340 °C.
Book Synopsis Development and Applications of Aluminum Nitride Thin Film Technology by : Cícero Cunha
Download or read book Development and Applications of Aluminum Nitride Thin Film Technology written by Cícero Cunha and published by . This book was released on 2019 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Aluminum nitride (AlN) thin films have aroused the interest of researchers due to their unique physicochemical properties. However, further studies on these semiconductor materials are still necessary to establish the manufacturing of high-performance devices for applications in various areas, such as telecommunications, microelectronics, and biomedicine. This chapter introduces AlN thin film technology that has made a wide range of applications possible. First, the main physicochemical properties of AlN, its wurtzite crystalline structure, and the incorporation of oxygen during the thin film deposition process are presented. Furthermore, the growth of AlN films by different techniques and their applications as a buffer layer and sensing layer are summarized. Special attention was given to the sputtering deposition process and the use of sputtered AlN films in SAW sensors.
Book Synopsis Nanoscale Microstructural Characterization of Aluminum and Copper Bilayer Thin Films Deposited on Silicon Substrate Using Magnetron Sputtering Technique by : Zulhelmi Alif Abdul Halim
Download or read book Nanoscale Microstructural Characterization of Aluminum and Copper Bilayer Thin Films Deposited on Silicon Substrate Using Magnetron Sputtering Technique written by Zulhelmi Alif Abdul Halim and published by . This book was released on 2014 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis The Electrical, Structural, and Optical Properties of Aluminum Nitride Thin Films Deposited by Atmospheric Pressure Metal-organic Chemical Vapor Deposition by : Akhter Uddin Ahmed
Download or read book The Electrical, Structural, and Optical Properties of Aluminum Nitride Thin Films Deposited by Atmospheric Pressure Metal-organic Chemical Vapor Deposition written by Akhter Uddin Ahmed and published by . This book was released on 1992 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt:
