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Electronic Packaging Of High Speed Circuitry
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Book Synopsis Electronic Packaging of High Speed Circuitry by : Stephen G. Konsowski
Download or read book Electronic Packaging of High Speed Circuitry written by Stephen G. Konsowski and published by McGraw-Hill Professional Publishing. This book was released on 1997 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.
Book Synopsis High-Frequency Characterization of Electronic Packaging by : Luc Martens
Download or read book High-Frequency Characterization of Electronic Packaging written by Luc Martens and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 169 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
Book Synopsis Advances in Electronic Circuit Packaging by : Gerald A. Walker
Download or read book Advances in Electronic Circuit Packaging written by Gerald A. Walker and published by Springer. This book was released on 2013-12-11 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Packaging for High Reliability, Low Cost Electronics by : R.R. Tummala
Download or read book Electronic Packaging for High Reliability, Low Cost Electronics written by R.R. Tummala and published by Springer. This book was released on 2010-12-03 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Book Synopsis Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by : Xing-Chang Wei
Download or read book Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Book Synopsis Advances in Electronic Circuit Packaging by : Lawrence L. Rosine
Download or read book Advances in Electronic Circuit Packaging written by Lawrence L. Rosine and published by Springer. This book was released on 2013-12-01 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by : Xing-Chang Wei
Download or read book Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Book Synopsis Materials for High-Density Electronic Packaging and Interconnection by : National Research Council
Download or read book Materials for High-Density Electronic Packaging and Interconnection written by National Research Council and published by National Academies Press. This book was released on 1990-02-01 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrical Performance of Electronic Packaging by :
Download or read book Electrical Performance of Electronic Packaging written by and published by . This book was released on 2003 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis High Temperature Electronics by : F. Patrick McCluskey
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 2018-05-04 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Book Synopsis Solder Paste in Electronics Packaging by : Jennie Hwang
Download or read book Solder Paste in Electronics Packaging written by Jennie Hwang and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
Book Synopsis High-Speed Circuits for Lightwave Communications by : Keh-Chung Wang
Download or read book High-Speed Circuits for Lightwave Communications written by Keh-Chung Wang and published by World Scientific. This book was released on 1999-01-25 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: High speed circuits are crucial for increasing the bandwidth of transmission and switching of voice/video/data over optical fiber networks. The ever-increasing demand for bit rates higher than those available due to the explosion of Internet traffic has driven engineers to develop integrated circuits of performance approaching 100 Gb/s. Commercial lightwave products using high speed circuits of 10 Gb/s and beyond are readily available. High Speed Circuits for Lightwave Communications presents the latest information on circuit design, measured results, applications, and product development. It covers electronic and opto-electronic circuits for transmission, receiving, and cross-point switching. These circuits were implemented with various state-of-the-art IC technologies, including Si BJT, GaAs MESFET, HEMT, HBT, as well as InP HEMT and HBT. The book, written by more than 50 experts, will benefit graduate students, researchers, and engineers who are interested in or work in this exciting and challenging field of optical communications. Contents:High Speed Circuits for Lightwave Communications (K Pedrotti)Si and SiGe Bipolar ICs for 10 to 40 Gb/s Optical-Fiber TDM Links (H-M Rein)Low Transimpedance-Fluctuation Design for 10-GHz Si-Bipolar Preamplifier in 10 Gb/s Optical Transmission Systems (T Masuda et al.)20–40-Gbit/s-Class GaAs MESFET Digital ICs for Future Optical Fiber Communications Systems (T Otsuji et al.)20–40 Gbit/s GaAs-HEMT Chip Set for Optical Data Receiver (Z Lao et al.)AlGaAs/GaAs HBT Circuits for Optical TDM Communications (K Runge et al.)High Speed Cross-Point Switches (C E Chang et al.)HBT ICs for OC-192 Equipment (J Sitch & R Surridge)Present Status and Future Prospects of High-Speed Lightwave IC's Based on InP (E Sano et al.)InP HBT ICs for 40 Gb/s Optical Links (M Mokhtari et al.)A Review of Recent Progress in InP-Based Optoelectronic Integrated Circuit Receiver Front-Ends (R H Walden)Ultrahigh fmax AlInAs/GaInAs Transferred-Substrate Heterojunction Bipolar Transistors for Integrated Circuits Applications (B Agarwal et al.) Readership: Researchers in the field of semiconductors and high speed transmission over optic fibres. Keywords:IC;Circuit;Optical-Fiber Communications;Lightwave Communications;10Gb;40Gb;OEIC;Transceiver;Crosspoint Switch;GaAs;InP
Book Synopsis Electronic Packaging Science and Technology by : King-Ning Tu
Download or read book Electronic Packaging Science and Technology written by King-Ning Tu and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.
Book Synopsis Handbook of Electronic Package Design by : Michael Pecht
Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 1991-08-16 with total page 910 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Book Synopsis Machine Learning-based Design and Optimization of High-Speed Circuits by : Vazgen Melikyan
Download or read book Machine Learning-based Design and Optimization of High-Speed Circuits written by Vazgen Melikyan and published by Springer Nature. This book was released on 2024-01-31 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes machine learning-based new principles, methods of design and optimization of high-speed integrated circuits, included in one electronic system, which can exchange information between each other up to 128/256/512 Gbps speed. The efficiency of methods has been proven and is described on the examples of practical designs. This will enable readers to use them in similar electronic system designs. The author demonstrates newly developed principles and methods to accelerate communication between ICs, working in non-standard operating conditions, considering signal deviation compensation with linearity self-calibration. The observed circuit types also include but are not limited to mixed-signal, high performance heterogeneous integrated circuits as well as digital cores.
Book Synopsis EMC and the Printed Circuit Board by : Mark I. Montrose
Download or read book EMC and the Printed Circuit Board written by Mark I. Montrose and published by John Wiley & Sons. This book was released on 2004-04-05 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: This accessible, new reference work shows how and why RF energy iscreated within a printed circuit board and the manner in whichpropagation occurs. With lucid explanations, this book enablesengineers to grasp both the fundamentals of EMC theory and signalintegrity and the mitigation process needed to prevent an EMCevent. Author Montrose also shows the relationship between time andfrequency domains to help you meet mandatory compliancerequirements placed on printed circuit boards. Using real-world examples the book features: Clear discussions, without complex mathematical analysis, offlux minimization concepts Extensive analysis of capacitor usage for variousapplications Detailed examination of components characteristics with variousgrounding methodologies, including implementation techniques An in-depth study of transmission line theory A careful look at signal integrity, crosstalk, andtermination
