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Development Of An Experimental And Analytical Model Of An Active Cooling Method For High Power Three Dimensional Integrated Circuit 3d Ic Utilizing Multidimensional Configured Thermoelectric Modules
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Book Synopsis Development of an Experimental and Analytical Model of an Active Cooling Method for High-power Three- Dimensional Integrated Circuit (3D-IC) Utilizing Multidimensional Configured Thermoelectric Modules by : Huy Phan
Download or read book Development of an Experimental and Analytical Model of an Active Cooling Method for High-power Three- Dimensional Integrated Circuit (3D-IC) Utilizing Multidimensional Configured Thermoelectric Modules written by Huy Phan and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: An increase in demand for more functionality and capacity of microelectronic components within the same logistic footprint drives the growth of three-dimensional integrated circuit (3D-IC) packaging technologies in recent years. However, the reduction in size and an increase in transistors density also intensify the heat flux of stacked-dice, which introduces many thermal challenges at both the package and cooling levels. Traditional passive cooling systems such as forced air convection cooling, phase change materials cooling and passive or active heat sinks will become inadequate to cool future processors and cannot accommodate the demand of future sub-ambient cooling of 3D-ICs. Within the past 10 years, major microprocessor manufactures have shifted their focuses toward higher bandwidth rather than frequency; however, the heat flux of current high-end CPU and GPU on the same die with parallel sequential computation is still in the order of 70 to 75 W/cm2 with local heat flux exceeding 1.5W/mm2 and growing. Today, stack-dice are used widely as low-powered memory applications because thermal management of such 3D architectures as high-powered processors inherits many thermal challenges and is very costly. Heat dissipation of 3D-IC is highly non-uniform and non-unidirectional due to many factors such as material properties, power architectures, power leakage, transistor packing density, and real estate available on the processor. Inadequate thermal management of these systems leads to reduction in reliability, performance and ultimately a system's catastrophic failure. In this study, an experimental, an analytical, and a thermal cycling of an active cooling method for three-dimensional integrated circuits utilizing a multidimensional configured thermoelectric cooler were investigated. In addition, an alternative method to analyze thermoelectric cooling system employing a Modified-Graphical-Method (MGM) to eliminate the need of using proprietary fabrication information was also studied.
Book Synopsis Experimental/computational Analysis of Active Cooling of Stacked Device Using Multidimensional Configured Thermoelectric Modules by : Vaidehi Bharat Patel
Download or read book Experimental/computational Analysis of Active Cooling of Stacked Device Using Multidimensional Configured Thermoelectric Modules written by Vaidehi Bharat Patel and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Stacked devices are currently used widely because of their smaller footprint and corresponding ability to accommodate heterogeneous devices such as memory and logic and enable a silicon efficiency greater than 100%. This configuration will results in thermal management challenges due to the torturous heat dissipation path. In addition, the non-uniformity in chip power distribution results in an increased spreading resistance as well as temperature gradient at the device level that can degrade performance and reliability. In this study the Thermoelectric Modules were configured in a multidimensional form surrounding a three dimensional cold core. The corresponding Computational Fluid Dynamics model is validated using the experimental data.
Book Synopsis Analytical and Experimental Investigation of Thermal Transport in Three-dimensional Integrated Circuits (3D ICs) by : Leila Choobineh
Download or read book Analytical and Experimental Investigation of Thermal Transport in Three-dimensional Integrated Circuits (3D ICs) written by Leila Choobineh and published by . This book was released on 2014 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal management of three-dimensional integrated circuits (3D ICs) is recognized to be one of the foremost technological and research challenges currently blocking the widespread adoption of this promising technology. The computation of steady-state temperature fields in a 3D IC is critical for determining the thermal characteristics of a 3D IC and for evaluating any candidate thermal management technology. An analytical solution for the three-dimensional temperature field in a 3D IC based on solution of the governing energy equations using Fourier series expansion for steady-state temperature fields is studied. Comparison of the predicted temperature fields with finite-element simulation shows excellent agreement. The model is used to compute the temperature field in a 3D IC, and it is shown that by utilizing a thermalfriendly floorplanning approach, the maximum temperature of the 3D IC is reduced significantly. Several 3D IC manufacturing and packaging approaches require adjacent die sizes to be different from one another since this enables differentiated manufacturing and design. However, it is expected that unequally-sized die may cause deteriorated thermal performance due to heat spreading and constriction. Heat transfer model for predicting the three-dimensional temperature field in a multi-die 3D IC with unequally-sized die is studied. The model is used to compare the thermal performance of unequally-sized die stacks with a uniformly-sized die stack. Results indicate that the greater the degree of non-uniformity in the die stack, the greater in the peak temperature rise. An analytical modeling of heat transfer in interposer-based microelectronic systems is described. The analytical model is developed to study the effect of various parameters on the temperature field in an interposer system. A non-iterative, analytical heat transfer model for computing three-dimensional temperature fields in a 3D IC has been proposed. The governing energy equations with appropriate boundary conditions for N-die stack with different values of N are solved by first writing the solution in terms of infinite series, followed by deriving and solving ordinary differential equations for the coefficients in the series. Steady-state temperature fields predicted by the model compare well with FEM-based simulation results and previously developed iterative models. In addition, temperature computation based on the proposed models is much faster than numerical simulations or iterative approach. Expressions for the temperature field are derived for perfect contact between layers as well as for non-zero thermal resistance between layers. Several applications of the model are also discussed. These include temperature computation for a 3D IC with a large number of strata, as well as the effect of inter-die thermal contact resistance. The results may find applications in development of tools for rapid thermal computation for 3D ICs. Experimental measurements help validate thermal models for predicting the temperature field in a 3D IC. Experimental results on thermal performance of a two-die 3D IC are presented. Heaters and temperature sensor circuits embedded in each layer are utilized to generate heat and measure temperature rise in each layer respectively. Both steadystate and transient data are reported. The experimental setup and theoretical model for measuring thermal contact resistance between two adjacent die introduced and the experimental value of thermal contact resistance compere well with theoretical model result. The experimental setup and procedure are described and the results used to determine inter-die thermal resistance of two-die stack.
Book Synopsis Thermal Management of Three-dimensional Integrated Circuits Using Inter-layer Liquid Cooling by : Calvin R. King (Jr)
Download or read book Thermal Management of Three-dimensional Integrated Circuits Using Inter-layer Liquid Cooling written by Calvin R. King (Jr) and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat removal technologies are among the most critical needs for three-dimensional (3D) stacking of high-performance microprocessors. This research reports a 3D integration platform that can support the heat removal requirements for 3D integrated circuits that contain high-performance microprocessors in the 3D stack. :This work shows the use of wafer-level batch fabrication to develop advanced electrical and fluidic three-dimensional interconnect networks in a 3D stack. Fabrication results are shown for the integration of microchannels and electrical through-silicon vias (TSVs). A compact physical model is developed to determine the design trade-offs for microchannel heat sink and electrical TSV integration. An experimental thermal measurement test-bed for evaluating a 3D inter-layer liquid cooling platform is developed. Experimental thermal testing results for an air-cooled chip and a liquid-cooled chip are compared. Microchannel heat sink cooling shows a significant junction temperature and heat sink thermal resistance reduction compared to air-cooling. The on-chip integrated microchannel heat sink, which has a thermal resistance of 0.229 °C/W, enables cooling of>100W/cm2 of each high-power density chip, while maintaining an average junction temperature of less than 50°C. Cooling liquid is circulated through the 3D stack (two layers) at flow rates of up to 100 ml/min. :The ability to assemble chips with integrated electrical and fluidic I/Os and seal fluidic interconnections at each strata interface is demonstrated using three assembly and fluidic sealing techniques. Assembly results show the stacking of up to four chips that contain integrated electrical and fluidic I/O interconnects, with an electrical I/O density of ~1600/cm2.
Book Synopsis Electrical-thermal Modeling and Simulation for Three-dimensional Integrated Systems by : Jianyong Xie
Download or read book Electrical-thermal Modeling and Simulation for Three-dimensional Integrated Systems written by Jianyong Xie and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuous miniaturization of electronic systems using the three-dimensional (3D) integration technique has brought in new challenges for the computer-aided design and modeling of 3D integrated circuits (ICs) and systems. The major challenges for the modeling and analysis of 3D integrated systems mainly stem from four aspects: (a) the interaction between the electrical and thermal domains in an integrated system, (b) the increasing modeling complexity arising from 3D systems requires the development of multiscale techniques for the modeling and analysis of DC voltage drop, thermal gradients, and electromagnetic behaviors, (c) efficient modeling of microfluidic cooling, and (d) the demand of performing fast thermal simulation with varying design parameters. Addressing these challenges for the electrical/thermal modeling and analysis of 3D systems necessitates the development of novel numerical modeling methods. This dissertation mainly focuses on developing efficient electrical and thermal numerical modeling and co-simulation methods for 3D integrated systems. The developed numerical methods can be classified into three categories. The first category aims to investigate the interaction between electrical and thermal characteristics for power delivery networks (PDNs) in steady state and the thermal effect on characteristics of through-silicon via (TSV) arrays at high frequencies. The steady-state electrical-thermal interaction for PDNs is addressed by developing a voltage drop-thermal co-simulation method while the thermal effect on TSV characteristics is studied by proposing a thermal-electrical analysis approach for TSV arrays. The second category of numerical methods focuses on developing multiscale modeling approaches for the voltage drop and thermal analysis. A multiscale modeling method based on the finite-element non-conformal domain decomposition technique has been developed for the voltage drop and thermal analysis of 3D systems. The proposed method allows the modeling of a 3D multiscale system using independent mesh grids in sub-domains. As a result, the system unknowns can be greatly reduced. In addition, to improve the simulation efficiency, the cascadic multigrid solving approach has been adopted for the voltage drop-thermal co-simulation with a large number of unknowns. The focus of the last category is to develop fast thermal simulation methods using compact models and model order reduction (MOR). To overcome the computational cost using the computational fluid dynamics simulation, a finite-volume compact thermal model has been developed for the microchannel-based fluidic cooling. This compact thermal model enables the fast thermal simulation of 3D ICs with a large number of microchannels for early-stage design. In addition, a system-level thermal modeling method using domain decomposition and model order reduction is developed for both the steady-state and transient thermal analysis. The proposed approach can efficiently support thermal modeling with varying design parameters without using parameterized MOR techniques.
Book Synopsis Piezoelectric Energy Harvesting by : Alper Erturk
Download or read book Piezoelectric Energy Harvesting written by Alper Erturk and published by John Wiley & Sons. This book was released on 2011-04-04 with total page 377 pages. Available in PDF, EPUB and Kindle. Book excerpt: The transformation of vibrations into electric energy through the use of piezoelectric devices is an exciting and rapidly developing area of research with a widening range of applications constantly materialising. With Piezoelectric Energy Harvesting, world-leading researchers provide a timely and comprehensive coverage of the electromechanical modelling and applications of piezoelectric energy harvesters. They present principal modelling approaches, synthesizing fundamental material related to mechanical, aerospace, civil, electrical and materials engineering disciplines for vibration-based energy harvesting using piezoelectric transduction. Piezoelectric Energy Harvesting provides the first comprehensive treatment of distributed-parameter electromechanical modelling for piezoelectric energy harvesting with extensive case studies including experimental validations, and is the first book to address modelling of various forms of excitation in piezoelectric energy harvesting, ranging from airflow excitation to moving loads, thus ensuring its relevance to engineers in fields as disparate as aerospace engineering and civil engineering. Coverage includes: Analytical and approximate analytical distributed-parameter electromechanical models with illustrative theoretical case studies as well as extensive experimental validations Several problems of piezoelectric energy harvesting ranging from simple harmonic excitation to random vibrations Details of introducing and modelling piezoelectric coupling for various problems Modelling and exploiting nonlinear dynamics for performance enhancement, supported with experimental verifications Applications ranging from moving load excitation of slender bridges to airflow excitation of aeroelastic sections A review of standard nonlinear energy harvesting circuits with modelling aspects.
Book Synopsis Advanced Flip Chip Packaging by : Ho-Ming Tong
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Book Synopsis Electronics Cooling by : S. M. Sohel Murshed
Download or read book Electronics Cooling written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2016-06-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Book Synopsis Advanced Thermoelectric Materials for Energy Harvesting Applications by : Saim Memon
Download or read book Advanced Thermoelectric Materials for Energy Harvesting Applications written by Saim Memon and published by BoD – Books on Demand. This book was released on 2019-10-30 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Thermoelectric Materials for Energy Harvesting Applications is a research-intensive textbook covering the fundamentals of thermoelectricity and the process of converting heat energy into electrical energy. It covers the design, implementation, and performance of existing and advanced thermoelectric materials. Chapters examine such topics as organic/inorganic thermoelectric materials, performance and behaviors of thermoelectric devices, and energy harvesting applications of thermoelectric devices.
Download or read book Heat Transfer written by Younes Shabany and published by CRC Press. This book was released on 2009-12-17 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Book Synopsis Thermal Management of Electronic Systems II by : E. Beyne
Download or read book Thermal Management of Electronic Systems II written by E. Beyne and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Book Synopsis The IGBT Device by : B. Jayant Baliga
Download or read book The IGBT Device written by B. Jayant Baliga and published by William Andrew. This book was released on 2015-03-06 with total page 733 pages. Available in PDF, EPUB and Kindle. Book excerpt: The IGBT device has proved to be a highly important Power Semiconductor, providing the basis for adjustable speed motor drives (used in air conditioning and refrigeration and railway locomotives), electronic ignition systems for gasolinepowered motor vehicles and energy-saving compact fluorescent light bulbs. Recent applications include plasma displays (flat-screen TVs) and electric power transmission systems, alternative energy systems and energy storage. This book is the first available to cover the applications of the IGBT, and provide the essential information needed by applications engineers to design new products using the device, in sectors including consumer, industrial, lighting, transportation, medical and renewable energy. The author, B. Jayant Baliga, invented the IGBT in 1980 while working for GE. His book will unlock IGBT for a new generation of engineering applications, making it essential reading for a wide audience of electrical engineers and design engineers, as well as an important publication for semiconductor specialists. Essential design information for applications engineers utilizing IGBTs in the consumer, industrial, lighting, transportation, medical and renewable energy sectors. Readers will learn the methodology for the design of IGBT chips including edge terminations, cell topologies, gate layouts, and integrated current sensors. The first book to cover applications of the IGBT, a device manufactured around the world by more than a dozen companies with sales exceeding $5 Billion; written by the inventor of the device.
Book Synopsis Thermal and Power Management of Integrated Circuits by : Arman Vassighi
Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer Science & Business Media. This book was released on 2006-06-01 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Book Synopsis Introduction to Thermoelectricity by : H. Julian Goldsmid
Download or read book Introduction to Thermoelectricity written by H. Julian Goldsmid and published by Springer Science & Business Media. This book was released on 2009-10-03 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Introduction to Thermoelectricity is the latest work by Professor Julian Goldsmid drawing on his 55 years experience in the field. The theory of the thermoelectric and related phenomena is presented in sufficient detail to enable researchers to understand their observations and develop improved thermoelectric materials. The methods for the selection of materials and their improvement are discussed. Thermoelectric materials for use in refrigeration and electrical generation are reviewed. Experimental techniques for the measurement of properties and for the production of thermoelements are described. Special emphasis is placed on nanotechnology which promises to yield great improvements in the efficiency of thermoelectric devices. Chapters are also devoted to transverse thermoelectric effects and thermionic energy conversion, both techniques offering the promise of important applications in the future.
Book Synopsis NUREG/CR. by : U.S. Nuclear Regulatory Commission
Download or read book NUREG/CR. written by U.S. Nuclear Regulatory Commission and published by . This book was released on 1977 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Fundamentals of Semiconductor Manufacturing and Process Control by : Gary S. May
Download or read book Fundamentals of Semiconductor Manufacturing and Process Control written by Gary S. May and published by John Wiley & Sons. This book was released on 2006-05-26 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
Download or read book Thermal Design written by H. S. Lee and published by John Wiley & Sons. This book was released on 2010-11-17 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Design: Heat Sinks, Thermoelectrics, Heat Pipes, Compact Heat Exchangers, and Solar Cells, Second Edition, is a significantly updated new edition which now includes a chapter on thermoelectrics It covers thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space. The underlying concepts in this book cover the understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and also the design of the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. This new edition includes more examples, problems and tutorials, and a solutions manual is available on a companion website.
