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Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research
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Book Synopsis Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research by : Madhusudan Iyengar
Download or read book Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research written by Madhusudan Iyengar and published by World Scientific. This book was released on 2014-08-25 with total page 471 pages. Available in PDF, EPUB and Kindle. Book excerpt: To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Book Synopsis Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) by :
Download or read book Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) written by and published by World Scientific. This book was released on 2014-10-23 with total page 1397 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Book Synopsis Thermoelectric Energy Conversion Devices And Systems by : Kazuaki Yazawa
Download or read book Thermoelectric Energy Conversion Devices And Systems written by Kazuaki Yazawa and published by World Scientific. This book was released on 2021-02-23 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique compendium emphasizes key factors driving the performance of thermoelectric energy conversion systems. Important design parameters such as heat transfer at the boundaries of the system, material properties, and form factors are carefully analyzed and optimized for performance including the cost-performance trade-off. Numbers of examples are provided on the applications of thermoelectric technologies, e.g., power generation, cooling of electronic components, and waste heat recovery in wearable devices.This must-have volume also includes an interactive modeling software package developed on the nanoHUB (https://nanohub.org/) platform. Professionals, researchers, academics, undergraduate and graduate students will be able to study the impact of material properties and key design parameters on the overall thermoelectric system performance as well as the large scale implementation in the society.
Book Synopsis Solder Materials by : Lin Kwang-lung
Download or read book Solder Materials written by Lin Kwang-lung and published by World Scientific. This book was released on 2001-06-21 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.
Download or read book Mems Packaging written by Yung-cheng Lee and published by World Scientific. This book was released on 2018-01-03 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Book Synopsis Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-volume Set) by : Bar-cohen Avram
Download or read book Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-volume Set) written by Bar-cohen Avram and published by World Scientific. This book was released on 2018-10-15 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) provides a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written volumes presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.Set 3: Thermal Packaging ApplicationsThe third set in the Encyclopedia includes two volumes in the planned focus on Thermal Packaging Applications and a single volume on the use of Phase Change Materials (PCM), a most important Thermal Management Technique, not previously addressed in the Encyclopedia. Set 3 opens with Heat Transfer in Avionic Equipment, authored by Dr Boris Abramzon, offering a comprehensive, in-depth treatment of compact heat exchangers and cold plates for avionics cooling, as well as discussion on recent developments in these heat transfer units that are widely used in the thermal control of military and civilian airborne electronics. Along with a detailed presentation of the relevant thermofluid physics and governing equations, and the supporting mathematical design and optimization techniques, the book offers a practical guide for thermal engineers designing avionics cooling equipment, based on the author's 20+ years of experience as a thermal analyst and a practical design engineer for Avionics and related systems.The Set continues with Thermal Management of RF Systems, which addresses sequentially the history, present practice, and future thermal management strategies for electronically-steered RF systems, in the context of the RF operational requirements, as well as device-, module-, and system-level electronic, thermal, and mechanical considerations. This unique text was written by 3 authors, Dr John D Albrecht, Mr David H Altman, Dr Joseph J Maurer, with extensive US Department of Defense and aerospace industry experience in the design, development, and fielding of RF systems. Their combined efforts have resulted in a text, which is well-grounded in the relevant past, present, and future RF systems and technologies. Thus, this volume will provide the designers of advanced radars and other electronic RF systems with the tools and the knowledge to address the thermal management challenges of today's technologies, as well as of advanced technologies, such as wide bandgap semiconductors, heterogeneously integrated devices, and 3D chipsets and stacks.The third volume in Set 3, Phase Change Materials for Thermal Management of Electronic Components, co-authored by Prof Gennady Ziskind and Dr Yoram Kozak, provides a detailed description of the numerical methods used in PCM analysis and a detailed explanation of the processes that accompany and characterize solid-liquid phase-change in popular basic and advanced geometries. These provide a foundation for an in-depth exploration of specific electronics thermal management applications of Phase Change Materials. This volume is anchored in the unique PCM knowledge and experience of the senior author and placed in the context of the extensive solid-liquid phase-change literature in such diverse fields as material science, mathematical modeling, experimental and numerical methods, and thermofluid science and engineering.
Book Synopsis Cost Analysis Of Electronic Systems (Second Edition) by : Peter Sandborn
Download or read book Cost Analysis Of Electronic Systems (Second Edition) written by Peter Sandborn and published by World Scientific. This book was released on 2016-12-15 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an introduction to the cost modeling for electronic systems that is suitable for advanced undergraduate and graduate students in electrical, mechanical and industrial engineering, and professionals involved with electronics technology development and management. This book melds elements of traditional engineering economics with manufacturing process and life-cycle cost management concepts to form a practical foundation for predicting the cost of electronic products and systems. Various manufacturing cost analysis methods are addressed including: process-flow, parametric, cost of ownership, and activity based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects are considered. Aspects of system sustainment and life-cycle cost modeling including reliability (warranty, burn-in), maintenance (sparing and availability), and obsolescence are treated. Finally, total cost of ownership of systems, return on investment, cost-benefit analysis, and real options analysis are addressed.
Book Synopsis The Evolution of Cooling Technology for Electrical, Electronic, and Microelectronic Equipment by : A. E. Bergles
Download or read book The Evolution of Cooling Technology for Electrical, Electronic, and Microelectronic Equipment written by A. E. Bergles and published by . This book was released on 1986 with total page 18 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Cooling of Electronic Systems by : Sadik Kakaç
Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Book Synopsis Air Cooling Technology for Electronic Equipment by : Sung Jin Kim
Download or read book Air Cooling Technology for Electronic Equipment written by Sung Jin Kim and published by CRC Press. This book was released on 2020-07-24 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Book Synopsis Electronics Cooling by : S. M. Sohel Murshed
Download or read book Electronics Cooling written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2016-06-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Book Synopsis Thermal Design of Liquid Cooled Microelectronic Equipment by : Lian-Tuu Yeh
Download or read book Thermal Design of Liquid Cooled Microelectronic Equipment written by Lian-Tuu Yeh and published by . This book was released on 2019 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt: "With the demands of increased system functionalities and performance, the system power density of microelectronics equipment is continuously increased at a fast pace. This is especially true for the telecommunications systems because the network traffic in the industry has grown very rapidly every year. For the high power air cooled systems, large high performance fans are becoming a must for the systems in order to provide the necessary air flow rates. Two major concerns about these large fans are the power consumption and the acoustic noise of the fans. In addition, the increase in the system power results in a significant increase in the operation cost of the equipment as well as its host facilities such as the date centers. Liquid cooling can not only resolve the above mentioned issues related to high power air-cooled systems but also enhance its system performance and reliability. For some cases, the system power is too high to be cooled by air thermally. The only solution to such situations is adopting the liquid cooling"--
Book Synopsis Cooling Technology for Electronic Equipment by : Win Aung
Download or read book Cooling Technology for Electronic Equipment written by Win Aung and published by Springer. This book was released on 1988 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt: From the preface: The papers in this proceedings volume address both fundamental and applied issues related to cooling technology. The author or authors of each paper clearly understand the need for general utility of results, yet all are mindful of design and system considerations. The materials included here have been selected from six preselected topics that deal, respectively, with natural convection air cooling, forced convection air cooling, liquid cooling, conduction and contact resistances, thermal modeling and systems problems. This volume also includes a chapter at the end that is devoted to a discussion of recommended future research. This book will serve as useful reference for system designers and researchers alike.
Book Synopsis Cooling Techniq For Computers by : W. Aung
Download or read book Cooling Techniq For Computers written by W. Aung and published by CRC Press. This book was released on 1991-02-01 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is a record of current technical progress in the fundamentals of heat transfer and thermal strategies for thermal design in cooling electronic equipment. Seven chapters are derived from speeches at the International Symposium on Cooling Technology for Electronic Equipment in 1987.
Book Synopsis Advanced Materials for Thermal Management of Electronic Packaging by : Xingcun Colin Tong
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Book Synopsis Nanotechnology Research Directions: IWGN Workshop Report by : R.S. Williams
Download or read book Nanotechnology Research Directions: IWGN Workshop Report written by R.S. Williams and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 367 pages. Available in PDF, EPUB and Kindle. Book excerpt: energy production, environmental management, transportation, communication, computation, and education. As the twenty-first century unfolds, nanotechnology's impact on the health, wealth, and security of the world's people is expected to be at least as significant as the combined influences in this century of antibiotics, the integrated circuit, and human-made polymers. Dr. Neal Lane, Advisor to the President for Science and Technology and former National Science Foundation (NSF) director, stated at a Congressional hearing in April 1998, "If I were asked for an area of science and engineering that will most likely produce the breakthroughs of tomorrow, I would point to nanoscale science and engineering. " Recognizing this potential, the White House Office of Science and Technology Policy (OSTP) and the Office of Management and Budget (OMB) have issued a joint memorandum to Federal agency heads that identifies nanotechnology as a research priority area for Federal investment in fiscal year 2001. This report charts "Nanotechnology Research Directions," as developed by the Interagency W orking Group on Nano Science, Engineering, and Technology (IWGN) of the National Science and Technology Council (NSTC). The report incorporates the views of leading experts from government, academia, and the private sector. It reflects the consensus reached at an IWGN-sponsored workshop held on January 27-29, 1999, and detailed in contributions submitted thereafter by members of the V. S. science and engineering community. (See Appendix A for a list of contributors.
Book Synopsis Nano/Microscale Heat Transfer by : Zhuomin M. Zhang
Download or read book Nano/Microscale Heat Transfer written by Zhuomin M. Zhang and published by Springer Nature. This book was released on 2020-06-23 with total page 780 pages. Available in PDF, EPUB and Kindle. Book excerpt: This substantially updated and augmented second edition adds over 200 pages of text covering and an array of newer developments in nanoscale thermal transport. In Nano/Microscale Heat Transfer, 2nd edition, Dr. Zhang expands his classroom-proven text to incorporate thermal conductivity spectroscopy, time-domain and frequency-domain thermoreflectance techniques, quantum size effect on specific heat, coherent phonon, minimum thermal conductivity, interface thermal conductance, thermal interface materials, 2D sheet materials and their unique thermal properties, soft materials, first-principles simulation, hyperbolic metamaterials, magnetic polaritons, and new near-field radiation experiments and numerical simulations. Informed by over 12 years use, the author’s research experience, and feedback from teaching faculty, the book has been reorganized in many sections and enriched with more examples and homework problems. Solutions for selected problems are also available to qualified faculty via a password-protected website.• Substantially updates and augments the widely adopted original edition, adding over 200 pages and many new illustrations;• Incorporates student and faculty feedback from a decade of classroom use;• Elucidates concepts explained with many examples and illustrations;• Supports student application of theory with 300 homework problems;• Maximizes reader understanding of micro/nanoscale thermophysical properties and processes and how to apply them to thermal science and engineering;• Features MATLAB codes for working with size and temperature effects on thermal conductivity, specific heat of nanostructures, thin-film optics, RCWA, and near-field radiation.
