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Author : Raman Thiruvenkatachari
Publisher :
ISBN 13 :
Total Pages : 266 pages
Book Rating : 4.:/5 (132 download)
Download or read book Chemical Vapor Deposition of Copper Thin Films written by Raman Thiruvenkatachari and published by . This book was released on 2000 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Wing-Cheong Gilbert Lai
Publisher :
ISBN 13 :
Total Pages : 286 pages
Book Rating : 4.:/5 (267 download)
Download or read book Chemical Vapor Deposition of Copper Thin Films written by Wing-Cheong Gilbert Lai and published by . This book was released on 1991 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Reginald Bernard Little
Publisher :
ISBN 13 :
Total Pages : 310 pages
Book Rating : 4.:/5 (286 download)
Download or read book Chemical Vapor Deposition of Copper Thin Films written by Reginald Bernard Little and published by . This book was released on 1992 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Thomas Wächtler
Publisher : Thomas Waechtler
ISBN 13 : 3941003178
Total Pages : 247 pages
Book Rating : 4.9/5 (41 download)
Download or read book Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices written by Thomas Wächtler and published by Thomas Waechtler. This book was released on 2010 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yu-Neng Chang
Publisher :
ISBN 13 :
Total Pages : 290 pages
Book Rating : 4.:/5 (276 download)
Download or read book Organometallic Chemical Vapor Deposition of Copper Oxide Thin Films written by Yu-Neng Chang and published by . This book was released on 1992 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jorge Ramírez-Ortiz
Publisher : LAP Lambert Academic Publishing
ISBN 13 : 9783659199820
Total Pages : 96 pages
Book Rating : 4.1/5 (998 download)
Download or read book Chemical Vapor Deposition of Copper and Copper Oxides written by Jorge Ramírez-Ortiz and published by LAP Lambert Academic Publishing. This book was released on 2012-08 with total page 96 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical vapor deposition (CVD) is a very versatile process widely used in the production of thin solid films and surface coating. It is also used to produce powders, fibers and monolithic components. In addition, the majority of chemical elements in the periodic table has been deposited, as well as compounds such as carbides, nitrides, oxides, intermetallic and many others. Chemical vapor deposition has been a critical technology in silicon microelectronics processes, fabrication of thin films of metals, semiconductors, and insulators. With increasing packing density in microelectronic devices, copper is used as an interconnecting metal due to its superior electrical conductivity and excellent resistance against electromigration. One of the advantages of chemcial vapor deposition is that selective deposition onto one surface, often defined as the growth surface, in the presence of another surface, often defined as non-growth surface is possible. The high optical absorption coefficient and low cost of production of Cu2O thin films have they made good candidates for electrochromic devices, solar cells and oxygen sensors.
Author : Alan Thomas Stephens
Publisher :
ISBN 13 :
Total Pages : 274 pages
Book Rating : 4.:/5 (317 download)
Download or read book Chemical Vapor Deposition Reactor Design and Process Optimization for the Deposition of Copper Thin Films written by Alan Thomas Stephens and published by . This book was released on 1994 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt: "A chemical vapor deposition reactor has been designed, built, and optimized for the deposition of copper thin films. The single wafer, stagnation point flow reactor features: six inch substrate capacity; direct metering and vaporization of liquid precursor; reactant introduction into the reactor chamber through a multi-zone precursor injection manifold; optional variable power (0-300W) RF plasma assist; manual loadlock; and, a computer control interface. Substrate temperature uniformity has been measured to be better than 1% across the substrate over a wide range of temperatures. The injection manifold was designed for precise tailoring of gas flow characteristics across the substrate, incorporating four concentric, independently adjustable zones, each of which is controlled by a metering valve. Both Cu(I) trimethylvinylsilane hexaf luoroacetylacetonate (tmvs hfac) and Cu(II) hfac precursor chemistries have been used. Film properties were determined by four-point probe, surface profilometer, and scanning electron microscope (SEM). The Cu(I) tmvs hfac chemistry yielded the best results with deposition rates exceeding lOOOA/min, average film resistivities below 1.80 ^Q*cm, excellent step coverage, and complete gap fill."--Abstract.
Author : Dojun Kim
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (61 download)
Download or read book Chemical Vapor Deposition of Tungsten-based Diffusion Barrier Thin Films for Copper Metallization written by Dojun Kim and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ABSTRACT: The ternary material WN[subscript x]C[subscript y] was investigated for Cu diffusion barrier application. Thin films were deposited from tungsten diorganohydrazido(2- ) complexes Cl4(CH3CN)W(NNR22) (1: R2=-(CH2)5-; 2: R2=Ph2; 3: R22=Me2) using metal-organic aerosol-assisted CVD. The films deposited from these novel precursors were characterized for their composition, bonding state, structure, resistivity, and barrier quality. WN[subscript x]C[subscript y] films from 1, 2 and 3 were successfully deposited in the absence and the presence of NH3 in H2 carrier in the temperature range 300 to 700 °C. All WN[subscript x]C[subscript y] films contained W, N, C, and a small amount of O as determined by XPS. The Cl content of the film was below the XPS detection limit (~ 1 at. %). The chemical composition of films deposited with 1 in H2/NH3 exhibited increased N levels and decreased C levels over the entire temperature range of this study as compared with to films deposited 1 in H2. As determined by XPS, W is primarily bonded to N and C for films deposited at 400 C, but at lower deposition temperature the binding energy of the W-O bond becomes more evident. The films deposited at 400 °C were X-ray amorphous and Cu/WN[subscript x]C[subscript y]/Si stacks annealed under N2 at 500 °C for 30 min maintained the integrity of both the Cu/WN[subscript x]C[subscript y] and WN[subscript x]C[subscript y]/Si interfaces.
Author :
Publisher :
ISBN 13 :
Total Pages : 14 pages
Book Rating : 4.:/5 (227 download)
Download or read book Aerosol-Assisted Chemical Vapor Deposition of Copper: A Liquid Delivery Approach to Metal Thin Films written by and published by . This book was released on 1994 with total page 14 pages. Available in PDF, EPUB and Kindle. Book excerpt: Aerosol-Assisted Chemical Vapor Deposition (AACVD) has been used to attain high deposition rates (1000 A/min, up to 800 A/min at 140 deg C) of Cu films at low temperatures (120-200 deg C) from toluene solutions of (hfac)Cu(1, 5-COD) in a warm-wall reactor. The films are crystalline and exhibit resistivities close to bulk (1.7-3.5 micro omega cm). Activation energies calculated from the deposition rate as a function of the preheating temperature and the substrate temperature (varying also the nozzle-substrate distance) were 6.8, 8.9 (0.7 cm) and 9.1 (1.7 cm) kcal/mol, respectively.
Author : Toivo T. Kodas
Publisher : John Wiley & Sons
ISBN 13 : 3527615849
Total Pages : 562 pages
Book Rating : 4.5/5 (276 download)
Download or read book The Chemistry of Metal CVD written by Toivo T. Kodas and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: High purity, thin metal coatings have a variety of important commercial applications, for example, in the microelectronics industry, as catalysts, as protective and decorative coatings as well as in gas-diffusion barriers. This book offers detailed, up- to-date coverage of the chemistry behind the vapor deposition of different metals from organometallic precursors. In nine chapters, the CVD of metals including aluminum, tungsten, gold, silver, platinum, palladium, nickel, as well as copper from copper(I) and copper(II) compounds is covered. The synthesis and properties of the precursors, the growth process, morphology, quality and adhesion of the resulting films as well as laser- assisted, ion- assisted and plasma-assisted methods are discussed. Present applications and prospects for future developments are summarized. With ca. 1000 references and a glossary, this book is a unique source of in-depth information. It is indispensable for chemists, physicists, engineers and materials scientists working with metal- coating processes and technologies. From Reviews: 'I highly recommend this book to anyone interested in learning more about the chemistry of metal CVD.' J. Am Chem. Soc.
Author : Krishna Seshan
Publisher : William Andrew
ISBN 13 : 1437778747
Total Pages : 411 pages
Book Rating : 4.4/5 (377 download)
Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2012-12-06 with total page 411 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory applications and methods for thin film optical processes. In a major restructuring, this edition of the handbook lays the foundations with an up-to-date treatment of lithography, contamination and yield management, and reliability of thin films. The established physical and chemical deposition processes and technologies are then covered, the last section of the book being devoted to more recent technological developments such as microelectromechanical systems, photovoltaic applications, digital cameras, CCD arrays, and optical thin films. A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries The new edition takes covers the transition taking place in the semiconductor world from Al/SiO2 to copper interconnects with low-k dielectrics Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned ‘Moore’s Law’ relating to the technology development cycle in the semiconductor industry
Author : G. S. Mathad
Publisher : The Electrochemical Society
ISBN 13 : 9781566773935
Total Pages : 438 pages
Book Rating : 4.7/5 (739 download)
Download or read book Thin Film Materials, Processes, and Reliability written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2003 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jong-Hee Park
Publisher : ASM International
ISBN 13 : 161503224X
Total Pages : 477 pages
Book Rating : 4.6/5 (15 download)
Download or read book Chemical Vapor Deposition written by Jong-Hee Park and published by ASM International. This book was released on 2001 with total page 477 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Kecheng Li
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (995 download)
Download or read book Direct Liquid Evaporation Chemical Vapor Deposition(DLE-CVD) of Nickel, Manganese and Copper-Based Thin Films for Interconnects in Three-Dimensional Microelectronic Systems written by Kecheng Li and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapter 2 introduces the advantages of DLE-CVD process and its application in deposition of Nickel, Manganese and Copper based thin films. DLE-CVD process is used to deliver consistent and high vapor concentrations of Nickel, Manganese and Copper precursors to coat nanostructures with high aspect ratios.
Author : C. E. Moroșanu
Publisher :
ISBN 13 :
Total Pages : 724 pages
Book Rating : 4.F/5 ( download)
Download or read book Thin Films by Chemical Vapour Deposition written by C. E. Moroșanu and published by . This book was released on 1990 with total page 724 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Levi Karlsson
Publisher :
ISBN 13 : 9781536199499
Total Pages : 0 pages
Book Rating : 4.1/5 (994 download)
Download or read book Chemical Vapor Deposition (CVD). written by Levi Karlsson and published by . This book was released on 2021 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical vapor deposition (CVD) refers to a vacuum deposition method used to produce high quality, high-performance, solid materials in a variety of manufacturing industries. Chapter One provides a critical review of published experimental data for thin films of silicon nitride deposited by thermal and plasma CVD, plasma CVD, high density plasma CVD, atomic layer-by-layer deposition, and hot-wire CVD. Chapter Two describes several aspects of the use of CVD for single-crystal diamond synthesis for electronics. Chapter Three describes the properties of graphene and its preparation by a number of methods with a focus on the classical CVD method on copper foil together with graphene transfer onto a dielectric substrate.
Author : Donald L. Smith
Publisher : McGraw Hill Professional
ISBN 13 : 9780070585027
Total Pages : 648 pages
Book Rating : 4.5/5 (85 download)
Download or read book Thin-Film Deposition: Principles and Practice written by Donald L. Smith and published by McGraw Hill Professional. This book was released on 1995-03-22 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
