Chemical Mechanical Polishing in Silicon Processing

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Author :
Publisher : Academic Press
ISBN 13 : 0080864619
Total Pages : 307 pages
Book Rating : 4.0/5 (88 download)

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Book Synopsis Chemical Mechanical Polishing in Silicon Processing by :

Download or read book Chemical Mechanical Polishing in Silicon Processing written by and published by Academic Press. This book was released on 1999-10-29 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry.

Advances in Chemical Mechanical Planarization (CMP)

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Author :
Publisher : Woodhead Publishing
ISBN 13 : 0128218193
Total Pages : 650 pages
Book Rating : 4.1/5 (282 download)

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Book Synopsis Advances in Chemical Mechanical Planarization (CMP) by : Babu Suryadevara

Download or read book Advances in Chemical Mechanical Planarization (CMP) written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Advances in CMP Polishing Technologies

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Author :
Publisher : William Andrew
ISBN 13 : 1437778593
Total Pages : 330 pages
Book Rating : 4.4/5 (377 download)

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Book Synopsis Advances in CMP Polishing Technologies by : Toshiro Doi

Download or read book Advances in CMP Polishing Technologies written by Toshiro Doi and published by William Andrew. This book was released on 2011-12-06 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Chemical-Mechanical Polishing - Fundamentals and Challenges: Volume 566

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Author :
Publisher :
ISBN 13 :
Total Pages : 304 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Chemical-Mechanical Polishing - Fundamentals and Challenges: Volume 566 by : S. V. Babu

Download or read book Chemical-Mechanical Polishing - Fundamentals and Challenges: Volume 566 written by S. V. Babu and published by . This book was released on 2000-02-10 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Chemical Mechanical Planarization in IC Device Manufacturing III

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566772600
Total Pages : 664 pages
Book Rating : 4.7/5 (726 download)

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Book Synopsis Chemical Mechanical Planarization in IC Device Manufacturing III by : Robert Leon Opila

Download or read book Chemical Mechanical Planarization in IC Device Manufacturing III written by Robert Leon Opila and published by The Electrochemical Society. This book was released on 2000 with total page 664 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).

Semiconductor Manufacturing Handbook

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Author :
Publisher : McGraw Hill Professional
ISBN 13 : 0071445595
Total Pages : 915 pages
Book Rating : 4.0/5 (714 download)

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Book Synopsis Semiconductor Manufacturing Handbook by : Hwaiyu Geng

Download or read book Semiconductor Manufacturing Handbook written by Hwaiyu Geng and published by McGraw Hill Professional. This book was released on 2005-05-18 with total page 915 pages. Available in PDF, EPUB and Kindle. Book excerpt: WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND CHEMICALS Specialty Gas System and DCA * Gas Abatement Systems * Chemical and Slurries Delivery System * Ultra Pure Water FAB YIELD, OPERATIONS, AND FACILITIES Yield Management * Automated Materials Handling System * Metrology * Six Sigma * Advanced Process Control * EHS * Fab Design and Construction * Cleanroom * Vibration and Acoustic Control * ESD * Airborne Molecular Control * Particle Monitoring * Wastewater Neutralization Systems

Semiconductors and Semimetals

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Author :
Publisher :
ISBN 13 :
Total Pages : 307 pages
Book Rating : 4.:/5 (928 download)

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Book Synopsis Semiconductors and Semimetals by : Robert K. Willardson

Download or read book Semiconductors and Semimetals written by Robert K. Willardson and published by . This book was released on 2000 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Chemical-Mechanical Planarization of Semiconductor Materials

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 9783540431817
Total Pages : 444 pages
Book Rating : 4.4/5 (318 download)

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Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M.R. Oliver

Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2004-01-26 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Chemical Mechanical Planarization of Microelectronic Materials

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 3527617752
Total Pages : 337 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Chemical Mechanical Planarization of Microelectronic Materials by : Joseph M. Steigerwald

Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 1461511658
Total Pages : 235 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses by : Christopher Lyle Borst

Download or read book Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses written by Christopher Lyle Borst and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 235 pages. Available in PDF, EPUB and Kindle. Book excerpt: As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.

Chemical Mechanical Planarization VI

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566774048
Total Pages : 370 pages
Book Rating : 4.7/5 (74 download)

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Book Synopsis Chemical Mechanical Planarization VI by : Sudipta Seal

Download or read book Chemical Mechanical Planarization VI written by Sudipta Seal and published by The Electrochemical Society. This book was released on 2003 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Abrasive Technology

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Publisher : BoD – Books on Demand
ISBN 13 : 1789841933
Total Pages : 214 pages
Book Rating : 4.7/5 (898 download)

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Book Synopsis Abrasive Technology by : Anna Rudawska

Download or read book Abrasive Technology written by Anna Rudawska and published by BoD – Books on Demand. This book was released on 2018-10-24 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.

Chemical Mechanical Polishing 14

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 1607687453
Total Pages : 93 pages
Book Rating : 4.6/5 (76 download)

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Book Synopsis Chemical Mechanical Polishing 14 by : R. Rhoades

Download or read book Chemical Mechanical Polishing 14 written by R. Rhoades and published by The Electrochemical Society. This book was released on 2016-09-21 with total page 93 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Chemical-Mechanical Planarization of Semiconductor Materials

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 3662062348
Total Pages : 432 pages
Book Rating : 4.6/5 (62 download)

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Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M.R. Oliver

Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Handbook of Silicon Semiconductor Metrology

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Author :
Publisher : CRC Press
ISBN 13 : 0203904540
Total Pages : 703 pages
Book Rating : 4.2/5 (39 download)

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Book Synopsis Handbook of Silicon Semiconductor Metrology by : Alain C. Diebold

Download or read book Handbook of Silicon Semiconductor Metrology written by Alain C. Diebold and published by CRC Press. This book was released on 2001-06-29 with total page 703 pages. Available in PDF, EPUB and Kindle. Book excerpt: Containing more than 300 equations and nearly 500 drawings, photographs, and micrographs, this reference surveys key areas such as optical measurements and in-line calibration methods. It describes cleanroom-based measurement technology used during the manufacture of silicon integrated circuits and covers model-based, critical dimension, overlay

Chemical Mechanical Polishing 9

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 1566776295
Total Pages : 91 pages
Book Rating : 4.5/5 (667 download)

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Book Synopsis Chemical Mechanical Polishing 9 by : G. Banerjee

Download or read book Chemical Mechanical Polishing 9 written by G. Banerjee and published by The Electrochemical Society. This book was released on 2008-05 with total page 91 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 9¿, held during the 213th meeting of The Electrochemical Society, in Phoenix, Arizona from May 18-23, 2008.

Proceedings of the First International Symposium on Chemical Mechanical Planarization

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566771726
Total Pages : 294 pages
Book Rating : 4.7/5 (717 download)

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Book Synopsis Proceedings of the First International Symposium on Chemical Mechanical Planarization by : Iqbal Ali

Download or read book Proceedings of the First International Symposium on Chemical Mechanical Planarization written by Iqbal Ali and published by The Electrochemical Society. This book was released on 1997 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: