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Atomic Layer Deposition For Continued Scaling Of Interconnects
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Book Synopsis Atomic Layer Deposition for Semiconductors by : Cheol Seong Hwang
Download or read book Atomic Layer Deposition for Semiconductors written by Cheol Seong Hwang and published by Springer Science & Business Media. This book was released on 2013-10-18 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Book Synopsis Atomic Layer Deposition Applications 3 by : Ana Londergan
Download or read book Atomic Layer Deposition Applications 3 written by Ana Londergan and published by The Electrochemical Society. This book was released on 2007 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuously expanding realm of Atomic Layer Deposition (ALD) Applications is the symposium focus. ALD can enable the precise deposition of ultra-thin, highly conformal coatings over complex 3D topography, with controlled composition and properties. Following two successful years, this symposium is well on its way to becoming a forum for the sharing of cutting edge research in the various areas where ALD is used.
Book Synopsis ULSI Process Integration 7 by : C. Claeys
Download or read book ULSI Process Integration 7 written by C. Claeys and published by The Electrochemical Society. This book was released on 2011 with total page 429 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by : Yosi Shacham-Diamand
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Book Synopsis Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 by : K. Kondo
Download or read book Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 written by K. Kondo and published by The Electrochemical Society. This book was released on 2015-04-30 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Atomic Scale Interconnection Machines by : Christian Joachim
Download or read book Atomic Scale Interconnection Machines written by Christian Joachim and published by Springer Science & Business Media. This book was released on 2012-04-23 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume documents the first International Workshop on Atomic Scale Interconnection Machines organised by the European Integrated Project AtMol in June 2011 in Singapore. The four sessions, discussed here in revised contributions by high level speakers, span the subjects of multi-probe UHV instrumentation, atomic scale nano-material nanowires characterization, atomic scale surface conductance measurements, surface atomic scale mechanical machineries. This state-of-the-art account brings academic researchers and industry engineers access to the tools they need to be at the forefront of the atomic scale technology revolution.
Book Synopsis Atomic Layer Deposition Applications 2 by : Ana Londergan
Download or read book Atomic Layer Deposition Applications 2 written by Ana Londergan and published by The Electrochemical Society. This book was released on 2007 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue gives an overview of the cutting edge research in the various areas where Atomic Layer Deposition (ALD) can be used, enabling the identification of issues, challenges, and areas where further research is needed. Contributions include: Memory applications, Interconnects and contacts, ALD Productivity enhancement and precursor development, ALD for optical and photonic applications, and Applications in other areas, such as MEMs, nanotechnology, fabrication of sensors and catalysts, etc.
Book Synopsis 2018 IEEE International Interconnect Technology Conference (IITC) by : IEEE International Interconnect Technology Conference
Download or read book 2018 IEEE International Interconnect Technology Conference (IITC) written by IEEE International Interconnect Technology Conference and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Thin Film Deposition by : Krishna Seshan
Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2018-02-23 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics
Book Synopsis Atomic Layer Deposition Applications 6 by : J. W. Elam
Download or read book Atomic Layer Deposition Applications 6 written by J. W. Elam and published by The Electrochemical Society. This book was released on 2010-10 with total page 469 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuously expanding realm of Atomic Layer Deposition (ALD) Applications is the focus of this reoccurring symposium. ALD can enable the precise deposition of ultra-thin, highly conformal coatings over complex 3D topographies with controlled thickness and composition. This issue of ECS Transactions contains peer reviewed papers presented at the symposium. A broad spectrum of ALD applications is featured, including novel nano-composites and nanostructures, dielectrics for state-of-the-art transistors and capacitors, optoelectronics, and a variety of other emerging applications.
Book Synopsis The Comparison Study of Future On-chip Interconnects for High Performance VLSI Applications by : Kyung Hoae Koo
Download or read book The Comparison Study of Future On-chip Interconnects for High Performance VLSI Applications written by Kyung Hoae Koo and published by Stanford University. This book was released on 2011 with total page 135 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moore's law has driven the scaling of digital electronic devices' dimensions and performances over the last 40 years. As a result, logic components in a microprocessor have shown dramatic performance improvement. On the other hand, an on-chip interconnect which was considered only as a parasitic load before 1990s became the real performance bottleneck due to its extremely reduced cross section dimension. Now, on-chip global interconnect with conventional Cu/low-k and delay optimized repeater scheme faces great challenges in the nanometer regime, imposing problems of slower delay, higher power dissipation and limited bandwidth. Carbon based materials such as carbon nanotubes and graphene nanoribbons, and optical interconnect have been proposed for the alternate solution for the future nodes due to their special physical characteristics. This dissertation investigates the basic physical properties of novel materials for future interconnect, and describes the analytical and numerical models of local and global wire system based on new materials and novel signaling paradigms. This work also compares their basic performance metrics and circuit architectures to cope with the interconnect performance bottlenecks. We quantify the performance of these novel interconnects and compare them with Cu/low-k wires for future high-performance ICs.
Book Synopsis Proceedings of the IEEE ... International Interconnect Technology Conferece by :
Download or read book Proceedings of the IEEE ... International Interconnect Technology Conferece written by and published by . This book was released on 2004 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Atomic Layer Deposition Applications 11 by : F. Roozeboom
Download or read book Atomic Layer Deposition Applications 11 written by F. Roozeboom and published by The Electrochemical Society. This book was released on 2015 with total page 281 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Metrology and Diagnostic Techniques for Nanoelectronics by : Zhiyong Ma
Download or read book Metrology and Diagnostic Techniques for Nanoelectronics written by Zhiyong Ma and published by CRC Press. This book was released on 2017-03-27 with total page 889 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Book Synopsis Handbook of Thin Film Deposition by : Dominic Schepis
Download or read book Handbook of Thin Film Deposition written by Dominic Schepis and published by Elsevier. This book was released on 2024-10-08 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fifth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry. When pursuing patents, there is a phase called 'reduction to practice' where the idea for a technology transitions from a concept to actual use. The section 'Thin Film Reduction to Practice' includes chapters that review the most relevant methods to fabricate thin films towards practical applications. Then, the latest applications of thin film deposition technologies are discussed. Handbook of Thin Film Deposition, 5th Edition is suitable for materials scientists and engineers in academia and working in semiconductor R&D. - Offers a practical survey of thin film technologies including design, fabrication, and reliability - Covers core processes and applications in the semiconductor industry and discusses latest advances in new thin film development - Features new chapters that review methods on front-end and back-end thin films
Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Book Synopsis Atomic Layer Deposition Applications 5 by : S. de Gendt
Download or read book Atomic Layer Deposition Applications 5 written by S. de Gendt and published by The Electrochemical Society. This book was released on 2009-09 with total page 425 pages. Available in PDF, EPUB and Kindle. Book excerpt: Atomic Layer Deposition can enable precise deposition of ultra-thin, highly conformal coatings over complex 3D topography, with controlled composition and properties for a wide range of applications.
