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Advanced X Ray Characterization Of Ulsi Materials
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Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Book Synopsis Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by : Yosi Shacham-Diamand
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Book Synopsis Semiconductor Strain Metrology by : Terence K. S. Wong
Download or read book Semiconductor Strain Metrology written by Terence K. S. Wong and published by Bentham Science Publishers. This book was released on 2012 with total page 141 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book surveys the major and newly developed techniques for semiconductor strain metrology. Semiconductor strain metrology has emerged in recent years as a topic of great interest to researchers involved in thin film and nanoscale device characterizati
Book Synopsis Failure Analysis of Integrated Circuits by : Lawrence C. Wagner
Download or read book Failure Analysis of Integrated Circuits written by Lawrence C. Wagner and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Book Synopsis Crystal Growth And Characterization Of Advanced Materials - Proceedings Of The International School On Crystal Growth And Characterization Of Advanced Matherials by : A N Christensen
Download or read book Crystal Growth And Characterization Of Advanced Materials - Proceedings Of The International School On Crystal Growth And Characterization Of Advanced Matherials written by A N Christensen and published by World Scientific. This book was released on 1988-12-31 with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contents:Fundamental Aspects of Crystal Growth from the Melt (C Paorici & L Zanotti)Phase Diagrams in Crystal Growth (A N Christensen)Growth Procedures and Perfection of Semiconductor Materials (A Lindegaard-Andersen)Atomistic Aspects of Crystal Growth and Epitaxy (I Markov)Fundamentals of Liquid Phase Epitaxial Growth (P Kordos)Determination of Few Selected Basic Parameters of the Investigation of AIII-BV Semiconductors Using X-Ray Methods (H Bruhl)Multijunction Solar Cells (I Chambouleyron)Application of the Mossbauer Spectroscopy to the Study of Magnetic Materials (G Albanese)Metallic Magnetism in Modern Materials (D Givord)and others Readership: Materials scientists.
Book Synopsis Industrial Applications of X-Ray Diffraction by : Frank Smith
Download or read book Industrial Applications of X-Ray Diffraction written by Frank Smith and published by CRC Press. This book was released on 1999-09-22 with total page 1026 pages. Available in PDF, EPUB and Kindle. Book excerpt: By illustrating a wide range of specific applications in all major industries, this work broadens the coverage of X-ray diffraction beyond basic tenets, research and academic principles. The book serves as a guide to solving problems faced everyday in the laboratory, and offers a review of the current theory and practice of X-ray diffraction, major advances and potential uses.
Book Synopsis Analytical and Diagnostic Techniques for Semiconductor Materials, Devices, and Processes by : Bernd O. Kolbesen
Download or read book Analytical and Diagnostic Techniques for Semiconductor Materials, Devices, and Processes written by Bernd O. Kolbesen and published by The Electrochemical Society. This book was released on 2003 with total page 572 pages. Available in PDF, EPUB and Kindle. Book excerpt: .".. ALTECH 2003 was Symposium J1 held at the 203rd Meeting of the Electrochemical Society in Paris, France from April 27 to May 2, 2003 ... Symposium M1, Diagnostic Techniques for Semiconductor Materials and Devices, was part of the 202nd Meeting of the Electrochemical Society held in Salt Lake City, Utah, from October 21 to 25, 2002 ..."--p. iii.
Book Synopsis Proceedings of the First International Symposium on Advanced Materials for ULSI by : Martin P. Scott
Download or read book Proceedings of the First International Symposium on Advanced Materials for ULSI written by Martin P. Scott and published by . This book was released on 1988 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Dielectric Films for Advanced Microelectronics by : Mikhail Baklanov
Download or read book Dielectric Films for Advanced Microelectronics written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2007-04-04 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Book Synopsis Microelectronic Failure Analysis by :
Download or read book Microelectronic Failure Analysis written by and published by ASM International. This book was released on 2002-01-01 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee
Book Synopsis Failure Analysis of Engineering Materials by : Charles R. Brooks
Download or read book Failure Analysis of Engineering Materials written by Charles R. Brooks and published by McGraw Hill Professional. This book was released on 2002 with total page 626 pages. Available in PDF, EPUB and Kindle. Book excerpt: Suitable for engineers, this work presents a tool for expert investigation and analysis of component failures. It is designed-to-be-used introduction to principals and practices. It includes: 500 illustrations; pinpoints fracture type with comparative fractographs; and can be used as expert examples in reports.
Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Book Synopsis Semiconductor Cleaning Science and Technology 14 (SCST 14) by : T. Hattori
Download or read book Semiconductor Cleaning Science and Technology 14 (SCST 14) written by T. Hattori and published by The Electrochemical Society. This book was released on 2015 with total page 335 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Luminescent Materials and Quantum Confinement by : M. Cahay
Download or read book Advanced Luminescent Materials and Quantum Confinement written by M. Cahay and published by The Electrochemical Society. This book was released on 1999 with total page 522 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics, 2003 by : Materials Research Society. Meeting
Download or read book Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics, 2003 written by Materials Research Society. Meeting and published by . This book was released on 2003 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics by :
Download or read book Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics written by and published by . This book was released on 2003 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials for Information Technology by : Ehrenfried Zschech
Download or read book Materials for Information Technology written by Ehrenfried Zschech and published by Springer Science & Business Media. This book was released on 2006-07-02 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.