Advanced Metallization Conference 2007 Amc 2007 Volume 23

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Advanced Metallization Conference 2007 (AMC 2007): Volume 23

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Author : Andrew J. McKerrow
Publisher : Materials Research Society
ISBN 13 : 9781558999923
Total Pages : 0 pages
Book Rating : 4.9/5 (999 download)

Book Synopsis Advanced Metallization Conference 2007 (AMC 2007): Volume 23 by : Andrew J. McKerrow

Download or read book Advanced Metallization Conference 2007 (AMC 2007): Volume 23 written by Andrew J. McKerrow and published by Materials Research Society. This book was released on 2008-01-01 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Advanced Metallization Conference - held in Albany, New York, and Tokyo, Japan - marked its 24th anniversary in 2007. These two sister conferences form a unique "one conference at two sites" that focuses on latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. Great progress has been made in ULSI metallization, but new challenges in performance, reliability and integration are expected as dimension continues to shrink. The importance of continued basic research in nanoscience and technology, using either metal wires or new materials such as carbon nanotubes, was declared key to the future of ULSI interconnects.

Advanced Metallization Conference in ...

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Author :
Publisher :
ISBN 13 :
Total Pages : 730 pages
Book Rating : 4.3/5 (91 download)

Book Synopsis Advanced Metallization Conference in ... by :

Download or read book Advanced Metallization Conference in ... written by and published by . This book was released on 2007 with total page 730 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Advanced Interconnects for ULSI Technology

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Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 0470662549
Total Pages : 616 pages
Book Rating : 4.4/5 (76 download)

Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov

Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Nucleation and Growth of Metals

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Author : Paul-Henri Haumesser
Publisher : Elsevier
ISBN 13 : 0081012039
Total Pages : 210 pages
Book Rating : 4.0/5 (81 download)

Book Synopsis Nucleation and Growth of Metals by : Paul-Henri Haumesser

Download or read book Nucleation and Growth of Metals written by Paul-Henri Haumesser and published by Elsevier. This book was released on 2016-07-29 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nucleation and Growth of Metals: From Thin Films to Nanoparticles explores how nucleation and growth phenomena condition the morphology and related characteristics of metallic thin films and nanoparticles to help control the functional properties of these objects. The book brings a rigorous theoretical approach to nucleation and growth phenomena, with a particular focus on the essential aspects and outcomes of this theory. The author explores a general framework for the nucleation and growth of condensed phases from liquid solutions. Practical situations are extensively described, providing state-of-the art information on Cu electroplating and related processes for the fabrication of advanced interconnects and elaboration of metallic nanoparticles. Derives the basic equations of nucleation from fundamental thermodynamic and kinetic relations Explores the main outcomes of a range of nucleation theories Features practical examples to further develop the theoretical aspects Provides state-of-the art information on Cu electroplating and related processes for the fabrication of advanced interconnects and elaboration of metallic nanoparticles

Handbook of 3D Integration, Volume 1

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Author : Philip Garrou
Publisher : John Wiley & Sons
ISBN 13 : 352762306X
Total Pages : 798 pages
Book Rating : 4.5/5 (276 download)

Book Synopsis Handbook of 3D Integration, Volume 1 by : Philip Garrou

Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

Atomic Layer Deposition Applications 7

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Author : J. W. Elam
Publisher : The Electrochemical Society
ISBN 13 : 1607682567
Total Pages : 353 pages
Book Rating : 4.6/5 (76 download)

Book Synopsis Atomic Layer Deposition Applications 7 by : J. W. Elam

Download or read book Atomic Layer Deposition Applications 7 written by J. W. Elam and published by The Electrochemical Society. This book was released on 2011 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Design of 3D Integrated Circuits and Systems

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Author : Rohit Sharma
Publisher : CRC Press
ISBN 13 : 1466589426
Total Pages : 302 pages
Book Rating : 4.4/5 (665 download)

Book Synopsis Design of 3D Integrated Circuits and Systems by : Rohit Sharma

Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Metrology and Diagnostic Techniques for Nanoelectronics

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Author : Zhiyong Ma
Publisher : CRC Press
ISBN 13 : 135173394X
Total Pages : 843 pages
Book Rating : 4.3/5 (517 download)

Book Synopsis Metrology and Diagnostic Techniques for Nanoelectronics by : Zhiyong Ma

Download or read book Metrology and Diagnostic Techniques for Nanoelectronics written by Zhiyong Ma and published by CRC Press. This book was released on 2017-03-27 with total page 843 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.

Atomic Layer Deposition for Semiconductors

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Author : Cheol Seong Hwang
Publisher : Springer Science & Business Media
ISBN 13 : 146148054X
Total Pages : 266 pages
Book Rating : 4.4/5 (614 download)

Book Synopsis Atomic Layer Deposition for Semiconductors by : Cheol Seong Hwang

Download or read book Atomic Layer Deposition for Semiconductors written by Cheol Seong Hwang and published by Springer Science & Business Media. This book was released on 2013-10-18 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.

Handbook of Thin Film Deposition

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Author : Krishna Seshan
Publisher : William Andrew
ISBN 13 : 0128123125
Total Pages : 472 pages
Book Rating : 4.1/5 (281 download)

Book Synopsis Handbook of Thin Film Deposition by : Krishna Seshan

Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2018-02-23 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries Features a new chapter discussing Gates Dielectrics

Stress-Induced Phenomena in Metallization

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Author : Paul S. Ho
Publisher : American Institute of Physics
ISBN 13 :
Total Pages : 250 pages
Book Rating : 4.:/5 (318 download)

Book Synopsis Stress-Induced Phenomena in Metallization by : Paul S. Ho

Download or read book Stress-Induced Phenomena in Metallization written by Paul S. Ho and published by American Institute of Physics. This book was released on 2009-07-02 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: This symposium focuses on new developments in the fields of experimental and theoretical nuclear physics, including nuclear dynamics, nuclear structure including hypernuclei, nuclear matter, nuclear astrophysics, applications. The participants also reported on the innovative instrumentation, including future large-scale facility both in Japan and Italy that will be essential for future studies.

Circuits at the Nanoscale

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Author : Krzysztof Iniewski
Publisher : CRC Press
ISBN 13 : 1351834657
Total Pages : 669 pages
Book Rating : 4.3/5 (518 download)

Book Synopsis Circuits at the Nanoscale by : Krzysztof Iniewski

Download or read book Circuits at the Nanoscale written by Krzysztof Iniewski and published by CRC Press. This book was released on 2018-10-08 with total page 669 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.

Electromigration in Metals

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Author : Paul S. Ho
Publisher : Cambridge University Press
ISBN 13 : 1107032385
Total Pages : 433 pages
Book Rating : 4.1/5 (7 download)

Book Synopsis Electromigration in Metals by : Paul S. Ho

Download or read book Electromigration in Metals written by Paul S. Ho and published by Cambridge University Press. This book was released on 2022-05-12 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.

Wafer Level 3-D ICs Process Technology

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Author : Chuan Seng Tan
Publisher : Springer Science & Business Media
ISBN 13 : 0387765344
Total Pages : 365 pages
Book Rating : 4.3/5 (877 download)

Book Synopsis Wafer Level 3-D ICs Process Technology by : Chuan Seng Tan

Download or read book Wafer Level 3-D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

CMOS Past, Present and Future

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Author : Henry Radamson
Publisher : Woodhead Publishing
ISBN 13 : 0081021402
Total Pages : 280 pages
Book Rating : 4.0/5 (81 download)

Book Synopsis CMOS Past, Present and Future by : Henry Radamson

Download or read book CMOS Past, Present and Future written by Henry Radamson and published by Woodhead Publishing. This book was released on 2018-04-03 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends. The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements. Addresses challenges and opportunities for the use of CMOS Covers the latest methods of strain engineering, materials integration to increase mobility, nano-scaled transistor processing, and integration of CMOS with photonic components Provides a look at the evolution of CMOS technology, including the origins of the technology, current status and future possibilities

3D IC Stacking Technology

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Author : Banqiu Wu
Publisher : McGraw Hill Professional
ISBN 13 : 007174195X
Total Pages : 544 pages
Book Rating : 4.0/5 (717 download)

Book Synopsis 3D IC Stacking Technology by : Banqiu Wu

Download or read book 3D IC Stacking Technology written by Banqiu Wu and published by McGraw Hill Professional. This book was released on 2011-07-07 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt: The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology

Advanced Metallization Conference 2002 (AMC 2002)

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Author :
Publisher :
ISBN 13 :
Total Pages : 920 pages
Book Rating : 4.E/5 ( download)

Book Synopsis Advanced Metallization Conference 2002 (AMC 2002) by :

Download or read book Advanced Metallization Conference 2002 (AMC 2002) written by and published by . This book was released on 2003 with total page 920 pages. Available in PDF, EPUB and Kindle. Book excerpt: