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2020 Ieee 70th Electronic Components And Technology Conference Ectc
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Book Synopsis 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) by : IEEE Staff
Download or read book 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) written by IEEE Staff and published by . This book was released on 2020-06-03 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation
Book Synopsis Electronic Components and Technology Conference, 1993 by : Institute of Electrical and Electronics Engineers
Download or read book Electronic Components and Technology Conference, 1993 written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1993 with total page 1166 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Book Synopsis Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces by : Beth Keser
Download or read book Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces written by Beth Keser and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Book Synopsis Contributions from the 44th Electronic Components and Technology Conference (ECTC). by :
Download or read book Contributions from the 44th Electronic Components and Technology Conference (ECTC). written by and published by . This book was released on 1995 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Contributions from the 48th Electronic Components and Technology Conference (ECTC). by :
Download or read book Contributions from the 48th Electronic Components and Technology Conference (ECTC). written by and published by . This book was released on 1999 with total page 123 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Contributions from the 44th Electronic Components and Technology Conference (ECTC) by : Robert A. Boudreau
Download or read book Contributions from the 44th Electronic Components and Technology Conference (ECTC) written by Robert A. Boudreau and published by . This book was released on 1995 with total page 119 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Smart and Connected Wearable Electronics by : Woon-Hong Yeo
Download or read book Smart and Connected Wearable Electronics written by Woon-Hong Yeo and published by Elsevier. This book was released on 2023-11-13 with total page 590 pages. Available in PDF, EPUB and Kindle. Book excerpt: Approx.630 pagesApprox.630 pages
Book Synopsis TSV 3D RF Integration by : Shenglin Ma
Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology
Book Synopsis Interconnect Reliability in Advanced Memory Device Packaging by : Chong Leong, Gan
Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Book Synopsis Information Systems and Technologies by : Alvaro Rocha
Download or read book Information Systems and Technologies written by Alvaro Rocha and published by Springer Nature. This book was released on 2022-05-10 with total page 722 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the following main topics: A) information and knowledge management; B) organizational models and information systems; C) software and systems modeling; D) software systems, architectures, applications and tools; E) multimedia systems and applications; F) computer networks, mobility and pervasive systems; G) intelligent and decision support systems; H) big data analytics and applications; I) human–computer interaction; J) ethics, computers and security; K) health informatics; L) information technologies in education; M) information technologies in radio communications; N) technologies for biomedical applications. This book is composed by a selection of articles from The 2022 World Conference on Information Systems and Technologies (WorldCIST'22), held between April 12 and 14, in Budva, Montenegro. WorldCIST is a global forum for researchers and practitioners to present and discuss recent results and innovations, current trends, professional experiences, and challenges of modern information systems and technologies research, together with their technological development and applications.
Book Synopsis Reliability of Organic Compounds in Microelectronics and Optoelectronics by : Willem Dirk van Driel
Download or read book Reliability of Organic Compounds in Microelectronics and Optoelectronics written by Willem Dirk van Driel and published by Springer Nature. This book was released on 2022-01-31 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Download or read book Nanofabrication written by Kamal Prasad and published by CRC Press. This book was released on 2024-09-13 with total page 273 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nature, with its unassuming yet prodigious character, unfolds its assembly and adaptability guided by the principles of thermodynamics and supramolecular chemistry. Every entity in nature, regardless of its form, adheres to these fundamental principles. From individual metabolites to ordinary molecules, each possesses inherent potential for nanomaterial synthesis. This book meticulously compiles diverse green approaches that highlight nature's synthetic prowess and its lavish abundance in nanomaterial synthesis, showcasing potential applications. It unveils the lucrative pathways nature provides for cutting-edge advancements in synthetic methodologies and material applications.
Book Synopsis Organic and Inorganic Light Emitting Diodes by : T.D. Subash
Download or read book Organic and Inorganic Light Emitting Diodes written by T.D. Subash and published by CRC Press. This book was released on 2023-06-19 with total page 199 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers a comprehensive range of topics on the physical mechanisms of LEDs (light emitting diodes), scattering effects, challenges in fabrication and efficient enhancement techniques in organic and inorganic LEDs. It deals with various reliability issues in organic/inorganic LEDs like trapping and scattering effects, packaging failures, efficiency droops, irradiation effects, thermal degradation mechanisms, and thermal degradation processes. Features: Provides insights into the improvement of performance and reliability of LEDs Highlights the optical power improvement mechanisms in LEDs Covers the challenges in fabrication and packaging of LEDs Discusses pertinent failures and degradation mechanisms Includes droop minimization techniques This book is aimed at researchers and graduate students in LEDs, illumination engineering, optoelectronics, and polymer/organic materials.
Book Synopsis VLSI Design and Test by : Ambika Prasad Shah
Download or read book VLSI Design and Test written by Ambika Prasad Shah and published by Springer Nature. This book was released on 2022-12-16 with total page 607 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 26th International Symposium on VLSI Design and Test, VDAT 2022, which took place in Jammu, India, in July 2022. The 32 regular papers and 16 short papers presented in this volume were carefully reviewed and selected from 220 submissions. They were organized in topical sections as follows: Devices and Technology; Sensors; Analog/Mixed Signal; Digital Design; Emerging Technologies and Memory; System Design.
Book Synopsis Wearable Antennas and Electronics by : Asimina Kiourti
Download or read book Wearable Antennas and Electronics written by Asimina Kiourti and published by Artech House. This book was released on 2022-01-31 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a practical and comprehensive guide to game-changing and state-of-the-art wearable antennas and RF electronics and their applications. Written by leading experts, the book details how to weave clothing into functional antennas and sensors to serve as unobtrusive devices for medical monitoring, athletic performance tracking, body-area network communications, and a host of other applications. You will learn about the latest advances in materials and electronics along with new and unexplored opportunities in functionalizing fabrics for sensing and wireless connectivity; understand materials selection for diverse wearable applications; gain practical insight into the newest class of embroidered e-textiles; and learn how to engineer flexible and wearable sensors. Wearable Antennas and Electronics covers basic approaches for wearable technology and their applications. You will also get an expert preview of promising future directions and paths for research opportunities. This is a must-have resource for anyone working in the growing industry of wearables and body-area devices, including engineers, researchers, faculty, and graduate students.
Book Synopsis Resilient Hybrid Electronics for Extreme/Harsh Environments by : Amanda Schrand
Download or read book Resilient Hybrid Electronics for Extreme/Harsh Environments written by Amanda Schrand and published by CRC Press. This book was released on 2024-06-06 with total page 187 pages. Available in PDF, EPUB and Kindle. Book excerpt: The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.
