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Book Synopsis 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS 2015) by : IEEE Compound Semiconductor Integrated Circuit Symposium
Download or read book 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS 2015) written by IEEE Compound Semiconductor Integrated Circuit Symposium and published by . This book was released on 2015 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS 2015) by :
Download or read book 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS 2015) written by and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) by : IEEE Staff
Download or read book 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) written by IEEE Staff and published by . This book was released on 2015-10-11 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: CSICS is a technology and integrated circuit conference showcasing many of the finest achievements made in compound semiconductor technology and circuits CSICS has grown to encompass GaAs, InP, GaN, SiGe, SiC, InSb, nano scale CMOS, and graphene semiconductor technologies and their application to RF, mm wave, high speed, and energy conversion circuits and systems Specific technical areas of interest include Innovative device concepts in emerging technologies, Nitrides, InP, III V on Si, Ge on Si, Graphene, Analog, RF, mixed signal, mm wave, THz circuit blocks and ICs in III V, CMOS, SiGe BiCMOS, Power conversion circuits and technologies, Optoelectronic and photonic devices and ICs, System applications, Wireless handsets and base stations, Vehicular and military RADAR, High speed digital systems, Fiber optics and photonics, Device and circuit modeling EM and EDA tools, Thermal simulation and advanced packaging of high power devices and ICs, Device and IC manufacturing processes
Book Synopsis 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS 2015) by :
Download or read book 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS 2015) written by and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Special Section on the 2015 Compound Semiconductor Integrated Circuit Symposium by : Shahriar Shahramian
Download or read book Special Section on the 2015 Compound Semiconductor Integrated Circuit Symposium written by Shahriar Shahramian and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Compound Semiconductor Integrated Circuit Symposium (CSICS), 2013 IEEE. by :
Download or read book Compound Semiconductor Integrated Circuit Symposium (CSICS), 2013 IEEE. written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Special Section on the 2008 Compound Semiconductor Integrated Circuit Symposium (CSICS 08) by : Mounir Meghelli
Download or read book Special Section on the 2008 Compound Semiconductor Integrated Circuit Symposium (CSICS 08) written by Mounir Meghelli and published by . This book was released on 2008 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Betting the Ranch on Compound Semiconductors by : Compound Semiconductor Integrated Circuit Symposium
Download or read book Betting the Ranch on Compound Semiconductors written by Compound Semiconductor Integrated Circuit Symposium and published by . This book was released on 2005 with total page 291 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis THz Communications by : Thomas Kürner
Download or read book THz Communications written by Thomas Kürner and published by Springer Nature. This book was released on 2021-12-07 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the fundamentals of THz communications, spanning the whole range of applications, propagation and channel models, RF transceiver technology, antennas, baseband techniques, and networking interfaces. The requested data rate in wireless communications will soon reach from 100 Gbit/s up to 1 Tbps necessitating systems with ultra-high bandwidths of several 10s of GHz which are available only above 200 GHz. In the last decade, research at these frequency bands has made significant progress, enabling mature experimental demonstrations of so-called THz communications, which are thus expected to play a vital role in future wireless networks. In addition to chapters by leading experts on the theory, modeling, and implementation of THz communication technology, the book also features the latest experimental results and addresses standardization and regulatory aspects. This book will be of interest to both academic researchers and engineers in the telecommunications industry.
Book Synopsis Nitride Semiconductor Technology by : Fabrizio Roccaforte
Download or read book Nitride Semiconductor Technology written by Fabrizio Roccaforte and published by John Wiley & Sons. This book was released on 2020-07-17 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book "Nitride Semiconductor Technology" provides an overview of nitride semiconductors and their uses in optoelectronics and power electronics devices. It explains the physical properties of those materials as well as their growth methods. Their applications in high electron mobility transistors, vertical power devices, LEDs, laser diodes, and vertical-cavity surface-emitting lasers are discussed in detail. The book further examines reliability issues in these materials and puts forward perspectives of integrating them with 2D materials for novel high-frequency and high-power devices. In summary, it covers nitride semiconductor technology from materials to devices and provides the basis for further research.
Book Synopsis Compound Semiconductor Integrated Circuits by : Tho T Vu
Download or read book Compound Semiconductor Integrated Circuits written by Tho T Vu and published by World Scientific. This book was released on 2003-04-02 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits. There are fourteen invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. The book also includes three papers focused on radiation effects and reliability in III-V semiconductor electronics, which are useful for reference and future directions. Moreover, reliability is covered in several papers separately for certain process technologies.
Book Synopsis Selected Proceedings from the 232nd ECS Meeting: National Harbor, MD – Fall 2017 by : Abbott
Download or read book Selected Proceedings from the 232nd ECS Meeting: National Harbor, MD – Fall 2017 written by Abbott and published by The Electrochemical Society. This book was released on 2017-12-22 with total page 1616 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Book Synopsis 2D Materials for Nanoelectronics by : Michel Houssa
Download or read book 2D Materials for Nanoelectronics written by Michel Houssa and published by CRC Press. This book was released on 2016-05-05 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Major developments in the semiconductor industry are on the horizon through the use of two-dimensional (2D) materials, such as graphene and transition metal dichalcogenides, for integrated circuits (ICs). 2D Materials for Nanoelectronics is the first comprehensive treatment of these materials and their applications in nanoelectronic devices.Compris
Book Synopsis Millimeter-Wave Low Noise Amplifiers by : Mladen Božanić
Download or read book Millimeter-Wave Low Noise Amplifiers written by Mladen Božanić and published by Springer. This book was released on 2017-11-30 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the first standalone book that combines research into low-noise amplifiers (LNAs) with research into millimeter-wave circuits. In compiling this book, the authors have set two research objectives. The first is to bring together the research context behind millimeter-wave circuit operation and the theory of low-noise amplification. The second is to present new research in this multi-disciplinary field by dividing the common LNA configurations and typical specifications into subsystems, which are then optimized separately to suggest improvements in the current state-of-the-art designs. To achieve the second research objective, the state-of-the-art LNA configurations are discussed and the weaknesses of state-of the art configurations are considered, thus identifying research gaps. Such research gaps, among others, point towards optimization – at a systems and microelectronics level. Optimization topics include the influence of short wavelength, layout and crosstalk on LNA performance. Advanced fabrication technologies used to decrease the parasitics of passive and active devices are also explored, together with packaging technologies such as silicon-on-chip and silicon-on-package, which are proposed as alternatives to traditional IC implementation. This research outcome builds through innovation. Innovative ideas for LNA construction are explored, and alternative design methodologies are deployed, including LNA/antenna co-design or utilization of the electronic design automation in the research flow. The book also offers the authors’ proposal for streamlined automated LNA design flow, which focuses on LNA as a collection of highly optimized subsystems.
Book Synopsis Thermal Management of Gallium Nitride Electronics by : Marko Tadjer
Download or read book Thermal Management of Gallium Nitride Electronics written by Marko Tadjer and published by Woodhead Publishing. This book was released on 2022-07-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management of Gallium Nitride Electronics outlines the technical approaches undertaken by leaders in the community, the challenges they have faced, and the resulting advances in the field. This book serves as a one-stop reference for compound semiconductor device researchers tasked with solving this engineering challenge for future material systems based on ultra-wide bandgap semiconductors. A number of perspectives are included, such as the growth methods of nanocrystalline diamond, the materials integration of polycrystalline diamond through wafer bonding, and the new physics of thermal transport across heterogeneous interfaces. Over the past 10 years, the book's authors have performed pioneering experiments in the integration of nanocrystalline diamond capping layers into the fabrication process of compound semiconductor devices. Significant research efforts of integrating diamond and GaN have been reported by a number of groups since then, thus resulting in active thermal management options that do not necessarily lead to performance derating to avoid self-heating during radio frequency or power switching operation of these devices. Self-heating refers to the increased channel temperature caused by increased energy transfer from electrons to the lattice at high power. This book chronicles those breakthroughs. Includes the fundamentals of thermal management of wide-bandgap semiconductors, with historical context, a review of common heating issues, thermal transport physics, and characterization methods Reviews the latest strategies to overcome heating issues through materials modeling, growth and device design strategies Touches on emerging, real-world applications for thermal management strategies in power electronics
Book Synopsis Microwave Active Circuit Analysis and Design by : Clive Poole
Download or read book Microwave Active Circuit Analysis and Design written by Clive Poole and published by Academic Press. This book was released on 2015-11-03 with total page 668 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book teaches the skills and knowledge required by today’s RF and microwave engineer in a concise, structured and systematic way. Reflecting modern developments in the field, this book focuses on active circuit design covering the latest devices and design techniques. From electromagnetic and transmission line theory and S-parameters through to amplifier and oscillator design, techniques for low noise and broadband design; This book focuses on analysis and design including up to date material on MMIC design techniques. With this book you will: Learn the basics of RF and microwave circuit analysis and design, with an emphasis on active circuits, and become familiar with the operating principles of the most common active system building blocks such as amplifiers, oscillators and mixers Be able to design transistor-based amplifiers, oscillators and mixers by means of basic design methodologies Be able to apply established graphical design tools, such as the Smith chart and feedback mappings, to the design RF and microwave active circuits Acquire a set of basic design skills and useful tools that can be employed without recourse to complex computer aided design Structured in the form of modular chapters, each covering a specific topic in a concise form suitable for delivery in a single lecture Emphasis on clear explanation and a step-by-step approach that aims to help students to easily grasp complex concepts Contains tutorial questions and problems allowing readers to test their knowledge An accompanying website containing supporting material in the form of slides and software (MATLAB) listings Unique material on negative resistance oscillator design, noise analysis and three-port design techniques Covers the latest developments in microwave active circuit design with new approaches that are not covered elsewhere
