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2011 International Symposium On Advanced Packaging Materials
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Book Synopsis 2011 International Symposium on Advanced Packaging Materials by : Components, Packaging & Manufacturing Technology Society
Download or read book 2011 International Symposium on Advanced Packaging Materials written by Components, Packaging & Manufacturing Technology Society and published by . This book was released on 2011-11 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2011 International Symposium on Advanced Packaging Materials (APM) by :
Download or read book 2011 International Symposium on Advanced Packaging Materials (APM) written by and published by . This book was released on 2011 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2011 International Symposium on Advanced Packaging Materials (APM 2011) by : Yixiong Huang
Download or read book 2011 International Symposium on Advanced Packaging Materials (APM 2011) written by Yixiong Huang and published by . This book was released on 2011 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials for Advanced Packaging by : Daniel Lu
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author :Georgia) International Symposium on Advanced Packaging Materials (2001 : Braselton Publisher :International Society of Hybrid ISBN 13 :9780930815646 Total Pages :0 pages Book Rating :4.8/5 (156 download)
Book Synopsis Advanced Packaging Materials, 2001 by : Georgia) International Symposium on Advanced Packaging Materials (2001 : Braselton
Download or read book Advanced Packaging Materials, 2001 written by Georgia) International Symposium on Advanced Packaging Materials (2001 : Braselton and published by International Society of Hybrid. This book was released on 2001-03 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Packaging Materials written by and published by . This book was released on 1995 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on by :
Download or read book Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on written by and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book MEMS written by Vikas Choudhary and published by CRC Press. This book was released on 2017-12-19 with total page 481 pages. Available in PDF, EPUB and Kindle. Book excerpt: The microelectromechanical systems (MEMS) industry has experienced explosive growth over the last decade. Applications range from accelerometers and gyroscopes used in automotive safety to high-precision on-chip integrated oscillators for reference generation and mobile phones. MEMS: Fundamental Technology and Applications brings together groundbreaking research in MEMS technology and explores an eclectic set of novel applications enabled by the technology. The book features contributions by top experts from industry and academia from around the world. The contributors explain the theoretical background and supply practical insights on applying the technology. From the historical evolution of nano micro systems to recent trends, they delve into topics including: Thin-film integrated passives as an alternative to discrete passives The possibility of piezoelectric MEMS Solutions for MEMS gyroscopes Advanced interconnect technologies Ambient energy harvesting Bulk acoustic wave resonators Ultrasonic receiver arrays using MEMS sensors Optical MEMS-based spectrometers The integration of MEMS resonators with conventional circuitry A wearable inertial and magnetic MEMS sensor assembly to estimate rigid body movement patterns Wireless microactuators to enable implantable MEMS devices for drug delivery MEMS technologies for tactile sensing and actuation in robotics MEMS-based micro hot-plate devices Inertial measurement units with integrated wireless circuitry to enable convenient, continuous monitoring Sensors using passive acousto-electric devices in wired and wireless systems Throughout, the contributors identify challenges and pose questions that need to be resolved, paving the way for new applications. Offering a wide view of the MEMS landscape, this is an invaluable resource for anyone working to develop and commercialize MEMS applications.
Book Synopsis Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on by :
Download or read book Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on written by and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Reliability and Failure Analysis of High-Power LED Packaging by : Cher Ming Tan
Download or read book Reliability and Failure Analysis of High-Power LED Packaging written by Cher Ming Tan and published by Woodhead Publishing. This book was released on 2022-09-24 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Book Synopsis Proceedings of the American Society for Composites 2014-Twenty-ninth Technical Conference on Composite Materials by : Hyonny Kim
Download or read book Proceedings of the American Society for Composites 2014-Twenty-ninth Technical Conference on Composite Materials written by Hyonny Kim and published by DEStech Publications, Inc. This book was released on 2014-09-17 with total page 3583 pages. Available in PDF, EPUB and Kindle. Book excerpt: New and not previously published U.S. and international research on composite and nanocomposite materialsFocus on health monitoring/diagnosis, multifunctionality, self-healing, crashworthiness, integrated computational materials engineering (ICME), and moreApplications to aircraft, armor, bridges, ships, and civil structures This fully searchable CD-ROM contains 270 original research papers on all phases of composite materials, presented by specialists from universities, NASA and private corporations such as Boeing. The document is divided into the following sections: Aviation Safety and Aircraft Structures; Armor and Protection; Multifunctional Composites; Effects of Defects; Out of Autoclave Processing; Sustainable Processing; Design and Manufacturing; Stability and Postbuckling; Crashworthiness; Impact and Dynamic Response; Natural, Biobased and Green; Integrated Computational Materials Engineering (ICME); Structural Optimization; Uncertainty Quantification; NDE and SHM Monitoring; Progressive Damage Modeling; Molecular Modeling; Marine Composites; Simulation Tools; Interlaminar Properties; Civil Structures; Textiles. The CD-ROM displays figures and illustrations in articles in full color along with a title screen and main menu screen. Each user can link to all papers from the Table of Contents and Author Index and also link to papers and front matter by using the global bookmarks which allow navigation of the entire CD-ROM from every article. Search features on the CD-ROM can be by full text including all key words, article title, author name, and session title. The CD-ROM has Autorun feature for Windows 2000 or higher products and can also be used with Macintosh computers. The CD includes the program for Adobe Acrobat Reader with Search 11.0. One year of technical support is included with your purchase of this product.
Book Synopsis Advanced Adhesives in Electronics by : M O Alam
Download or read book Advanced Adhesives in Electronics written by M O Alam and published by Elsevier. This book was released on 2011-05-25 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 996 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Book Synopsis Particulate Composites by : Randall M. German
Download or read book Particulate Composites written by Randall M. German and published by Springer. This book was released on 2016-06-14 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is focused on composites involving powders as the starting materials. It provides relevant information for questions related to the selection of constituent phases, most economic fabrication routes, proper testing procedures, and product optimization. The field is sufficiently advanced that predictive models guide many decisions. Applications are illustrated over a broad range of material and property combinations. This title includes: •Selection of phases with consideration of intersolubility & interface •Microstructure, especially the role of phase connectivity •Fabrication approaches, especially net-shape consolidation •Assessment of typical properties, testing techniques & industry standards •Design & trade-off decisions involved in optimization, including cost •Applications, both those that have matured and some emerging prospects. The reader may have little appreciation for how particulate composites are literally everywhere. Examples include new wear resistant consumer products(Apple watch), longer lasting automotive tires with reduced rolling resistance(Yokohama tires), and new diamond heat sinks for computers(Element Six substrates). Particulate composites also form critical components in applications such as magnets, dental fillings, brakes, darts, bio-implants, & cutting tools. Particulate composites are a multi-billion dollar industry, and can be a cost-effective solution ripe for innovation and continued rapid growth. For the engineer, the wide range of particulate composite formulation and property combinations offers the ability to design for a variety of application and provides ample opportunity for innovation. Particulate Composites: Fundamentals & Applications is ideal for use in a one-semester eng. course at the senior UG/graduate level, and is also suitable as a practical reference for materials scientists in academia and industry.
Book Synopsis Integrated High-Vin Multi-MHz Converters by : Jürgen Wittmann
Download or read book Integrated High-Vin Multi-MHz Converters written by Jürgen Wittmann and published by Springer Nature. This book was released on 2019-09-03 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with guidelines for designing integrated multi-MHz-switching converters for input voltages/system supplies up to 50V or higher. Coverage includes converter theory, converter architectures, circuit design, efficiency, sizing of passives, technology aspects, etc. The author discusses new circuit designs, new architectures and new switching concepts, including dead-time control and soft-switching techniques that overcome current limitations of these converters. The discussion includes technology related issues and helps readers to choose the right technology for fast-switching converters. This book discusses benefits and drawbacks in terms of integration, size and cost, efficiency and complexity, and enables readers to make trade-offs in design, given different converter parameters. Describes a study for increasing switching frequencies up to 30 MHz at input voltages up to 50V or higher in the scaling of the size of switching converter passives; Analyzes various buck converter implementations and shows that a preference due to higher efficiency depends on the operating point, on the available switch technologies, and on the implementation of the high-side supply generation; Describes an efficiency model based on a four-phase model, which enables separation of loss causes and loss locations.
