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Author : IEEE Staff
Publisher :
ISBN 13 : 9781509068654
Total Pages : pages
Book Rating : 4.0/5 (686 download)
Download or read book 2009 IEEE Workshop on Signal Propagation on Interconnects written by IEEE Staff and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Staff
Publisher :
ISBN 13 : 9781424444908
Total Pages : 139 pages
Book Rating : 4.4/5 (449 download)
Download or read book 2009 IEEE Workshop on Signal Propagation on Interconnects (Spi) written by IEEE Staff and published by . This book was released on 2009 with total page 139 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Components, Packaging, and Manufacturing Technology Society Technical Committee on Electrical Design, Modeling and Simulation
Publisher :
ISBN 13 : 9781424423187
Total Pages : 268 pages
Book Rating : 4.4/5 (231 download)
Download or read book 2008 IEEE Workshop on Signal Propagation on Interconnects written by Components, Packaging, and Manufacturing Technology Society Technical Committee on Electrical Design, Modeling and Simulation and published by . This book was released on 2008 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9781457704659
Total Pages : 158 pages
Book Rating : 4.7/5 (46 download)
Download or read book 2011 15th IEEE Workshop on Signal Propagation on Interconnects (SPI 2011) written by and published by . This book was released on 2011 with total page 158 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Renato Rimolo-Donadio
Publisher : Logos Verlag Berlin GmbH
ISBN 13 : 3832527761
Total Pages : 226 pages
Book Rating : 4.8/5 (325 download)
Download or read book Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates written by Renato Rimolo-Donadio and published by Logos Verlag Berlin GmbH. This book was released on 2011 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A framework for automated simulation of multilayer structures is also proposed. The validation and evaluation of the models are thoroughly addressed with several test structures and application studies. It is shown that the models can provide good results up to 40 GHz, whereas the numerical efficiency is at least two orders of magnitude higher in comparison to general-purpose numerical methods.
Author : Manho Lee
Publisher : Springer
ISBN 13 : 9401790388
Total Pages : 286 pages
Book Rating : 4.4/5 (17 download)
Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2014-05-11 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 0470662549
Total Pages : 616 pages
Book Rating : 4.4/5 (76 download)
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author :
Publisher : IEEE
ISBN 13 : 9781424423170
Total Pages : 265 pages
Book Rating : 4.4/5 (231 download)
Download or read book 2008 IEEE Workshop on Signal Propagation on Interconnects written by and published by IEEE. This book was released on 2008 with total page 265 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : IEEE
ISBN 13 : 9781424412235
Total Pages : 248 pages
Book Rating : 4.4/5 (122 download)
Download or read book 2007 IEEE Workshop on Signal Propagation on Interconnects written by and published by IEEE. This book was released on 2007-01-01 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Blaise Ravelo
Publisher : Springer Nature
ISBN 13 : 9811505527
Total Pages : 233 pages
Book Rating : 4.8/5 (115 download)
Download or read book Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution written by Blaise Ravelo and published by Springer Nature. This book was released on 2019-11-21 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
Author :
Publisher :
ISBN 13 : 9781424412242
Total Pages : pages
Book Rating : 4.4/5 (122 download)
Download or read book 2007 IEEE Workshop on Signal Propagation on Interconnects written by and published by . This book was released on 2007 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Brajesh Kumar Kaushik
Publisher : Springer
ISBN 13 : 8132220471
Total Pages : 86 pages
Book Rating : 4.1/5 (322 download)
Download or read book Carbon Nanotube Based VLSI Interconnects written by Brajesh Kumar Kaushik and published by Springer. This book was released on 2014-11-01 with total page 86 pages. Available in PDF, EPUB and Kindle. Book excerpt: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
Author : Madhavan Swaminathan
Publisher : World Scientific
ISBN 13 : 9814508608
Total Pages : 379 pages
Book Rating : 4.8/5 (145 download)
Download or read book Design and Modeling for 3D ICs and Interposers written by Madhavan Swaminathan and published by World Scientific. This book was released on 2013-11-05 with total page 379 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Author : Antonio Orlandi
Publisher : John Wiley & Sons
ISBN 13 : 1119281520
Total Pages : 236 pages
Book Rating : 4.1/5 (192 download)
Download or read book Electromagnetic Bandgap (EBG) Structures written by Antonio Orlandi and published by John Wiley & Sons. This book was released on 2017-06-19 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt: An essential guide to the background, design, and application of common-mode filtering structures in modern high-speed differential communication links Written by a team of experts in the field, Electromagnetic Bandgap (EBG) Structures explores the practical electromagnetic bandgap based common mode filters for power integrity applications and covers the theoretical and practical design approaches for common mode filtering in high-speed printed circuit boards, especially for boards in high data-rate systems. The authors describe the classic applications of electromagnetic bandgap (EBG) structures and the phenomena of common mode generation in high speed digital boards. The text also explores the fundamental electromagnetic mechanisms of the functioning of planar EBGs and considers the impact of planar EBGs on the digital signal propagation of single ended and differential interconnects routed on top or between EBGs. The authors examine the concept, design, and modeling of EBG common mode filters in their two forms: on-board and removable. They also provide several comparisons between measurement and electromagnetic simulations that validate the proposed EBG filters' design approach. This important resource: • Presents information on planar EBG based common mode filters for high speed differential digital systems • Provides systematic analysis of the fundamental mechanisms of planar EBG structures • Offers detailed design methodology to create EBG filters without the need for repeated full-wave electromagnetic analysis • Demonstrates techniques for use in practical real-world designs Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems offers an introduction to the background, design, and application of common-mode filtering structures in modern high-speed differential communication links, a critical issue in high-speed and high-performance systems.
Author : IEEE Computer Society. Technical Council on Test Technology
Publisher :
ISBN 13 : 9781424476107
Total Pages : pages
Book Rating : 4.4/5 (761 download)
Download or read book 2010 IEEE 14th Workshop on Signal Propagation on Interconnects written by IEEE Computer Society. Technical Council on Test Technology and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ian O'Connor
Publisher : Springer Science & Business Media
ISBN 13 : 1441961933
Total Pages : 286 pages
Book Rating : 4.4/5 (419 download)
Download or read book Integrated Optical Interconnect Architectures for Embedded Systems written by Ian O'Connor and published by Springer Science & Business Media. This book was released on 2012-11-07 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.
Author : IEEE Workshop on Signal Propagation on Interconnects
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (115 download)
Download or read book 10th IEEE Workshop on Signal Propagation on Interconnects : May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : Proceedings written by IEEE Workshop on Signal Propagation on Interconnects and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
