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Author : R. M. Lea
Publisher : North Holland
ISBN 13 :
Total Pages : 268 pages
Book Rating : 4.3/5 (91 download)
Download or read book Wafer Scale Integration, II written by R. M. Lea and published by North Holland. This book was released on 1988 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Earl E. Swartzlander Jr.
Publisher : Springer Science & Business Media
ISBN 13 : 1461316219
Total Pages : 515 pages
Book Rating : 4.4/5 (613 download)
Download or read book Wafer Scale Integration written by Earl E. Swartzlander Jr. and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
Author : Stuart K. Tewksbury
Publisher : Springer Science & Business Media
ISBN 13 : 1461316251
Total Pages : 456 pages
Book Rating : 4.4/5 (613 download)
Download or read book Wafer-Level Integrated Systems written by Stuart K. Tewksbury and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.
Author : Marin Alexe
Publisher : Springer Science & Business Media
ISBN 13 : 3662108275
Total Pages : 510 pages
Book Rating : 4.6/5 (621 download)
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Author : Chuan Seng Tan
Publisher : Springer Science & Business Media
ISBN 13 : 0387765344
Total Pages : 365 pages
Book Rating : 4.3/5 (877 download)
Download or read book Wafer Level 3-D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Author : Mariagiovanna Sami
Publisher : North Holland
ISBN 13 :
Total Pages : 518 pages
Book Rating : 4.:/5 (41 download)
Download or read book Wafer Scale Integration, III written by Mariagiovanna Sami and published by North Holland. This book was released on 1990 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: The purpose of this book is to give an up-to-date presentation of architectures and technologies for wafer-scale integration. As such, it is an overview of the work of the leading research centers active in this area, and an outline of expected evolution and progress in the subject. New technological solutions are envisioned; while the use of optical technologies for interconnections promises to overcome one of the main restrictions to architectures on a wafer, the extension of quick-prototyping solutions to the wafer dimension allows the introduction of wafer-scale systems in educational environments as well as in applications where a quick result and limited production would make traditional silicon solutions unacceptable. Regarding architectures and their applications, three different lines of approach can be identified. Evolutive solutions are proposed, mainly concerning array architectures and restructuring techniques. Innovative architectures are presented, several papers dealing with neural nets. There are also architectures designed not just for experimental reasons but for industrial production. Overall, non-numerical applications predominate.
Author :
Publisher : Office of Technology Assessment
ISBN 13 :
Total Pages : 64 pages
Book Rating : 4.3/5 (121 download)
Download or read book Miniaturization Technologies written by and published by Office of Technology Assessment. This book was released on 1991 with total page 64 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Winfried Görke
Publisher : Springer Science & Business Media
ISBN 13 : 3642750028
Total Pages : 400 pages
Book Rating : 4.6/5 (427 download)
Download or read book Fehlertolerierende Rechensysteme / Fault-tolerant Computing Systems written by Winfried Görke and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dieses Buch enthält die Beiträge der 4. GI/ITG/GMA-Fachtagung über Fehlertolerierende Rechensysteme, die im September 1989 in einer Reihe von Tagungen in München 1982, Bonn 1984 sowie Bremerhaven 1987 veranstaltet wurde. Die 31 Beiträge, darunter 4 eingeladene, sind teils in deutscher, überwiegend aber in englischer Sprache verfa€t. Insgesamt wird durch diese Beiträge die Entwicklung der Konzeption und Implementierung fehlertoleranter Systeme in den letzten zwei Jahren vor allem in Europa dokumentiert. Sämtliche Beiträge berichten über neue Forschungs- oder Entwicklungsergebnisse.
Author : Alexander John Anderson
Publisher : CRC Press
ISBN 13 : 1000117162
Total Pages : 450 pages
Book Rating : 4.0/5 (1 download)
Download or read book Foundations of Computer Technology written by Alexander John Anderson and published by CRC Press. This book was released on 2020-10-25 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foundations of Computer Technology is an easily accessible introduction to the architecture of computers and peripherals. This textbook clearly and completely explains modern computer systems through an approach that integrates components, systems, software, and design. It provides a succinct, systematic, and readable guide to computers, providing a springboard for students to pursue more detailed technology subjects. This volume focuses on hardware elements within a computer system and the impact of software on its architecture. It discusses practical aspects of computer organization (structure, behavior, and design) delivering the necessary fundamentals for electrical engineering and computer science students. The book not only lists a wide range of terms, but also explains the basic operations of components within a system, aided by many detailed illustrations. Material on modern technologies is combined with a historical perspective, delivering a range of articles on hardware, architecture and software, programming methodologies, and the nature of operating systems. It also includes a unified treatment on the entire computing spectrum, ranging from microcomputers to supercomputers. Each section features learning objectives and chapter outlines. Small glossary entries define technical terms and each chapter ends with an alphabetical list of key terms for reference and review. Review questions also appear at the end of each chapter and project questions inspire readers to research beyond the text. Short, annotated bibliographies direct students to additional useful reading.
Author : Shichun Qu
Publisher : Springer
ISBN 13 : 1493915568
Total Pages : 336 pages
Book Rating : 4.4/5 (939 download)
Download or read book Wafer-Level Chip-Scale Packaging written by Shichun Qu and published by Springer. This book was released on 2014-09-10 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Author : Raymond Arrathoon
Publisher :
ISBN 13 :
Total Pages : 582 pages
Book Rating : 4.3/5 (91 download)
Download or read book Digital Optical Computing II written by Raymond Arrathoon and published by . This book was released on 1990 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : The International Neural Society(INNS), The IEEE Neural
Publisher : Springer Science & Business Media
ISBN 13 : 9400906439
Total Pages : 569 pages
Book Rating : 4.4/5 (9 download)
Download or read book INNC 90 PARIS written by The International Neural Society(INNS), The IEEE Neural and published by Springer Science & Business Media. This book was released on 2013-12-18 with total page 569 pages. Available in PDF, EPUB and Kindle. Book excerpt: Neural Networks have been the theater of a dramatic increase of activities in the last five years. The interest of mixing results from fields as different as neurobiology, physics (spin glass theory), mathematics (linear algebra, statistics ... ), computer science (software engineering, hardware architectures ... ) or psychology has attracted a large number of researchers to the field. The perspective of dramatic improvements in many applications has lead important companies to launch new neural network programs and start-ups have mushroomed to address this new market. Throughout the world large programs are being set-up: in Japan the government has committed more than $18 million per year to its 20 year Human Frontier Science program; the DARPA and the US Navy have alloted more than $10 million per year each and other US government agencies are contributing to important but less ambitious programs. Neural networks are also a major research are in the supercomputing initiative. Europe has from the beginning taken an active part in funding major projects in the new field with BRAIN, BRA, ANNIE and PYGMALION (Esprit). Approximately $20 million has been invested to date since 1988 and new programs of nearly $30 million are being funded for the next 3 years. National projects in certain countries may globally double these amounts. Neural network conferences are attracting larger audiences than ever before. Prior to 1987 attendance never surpassed 300. The June 1989 IJCNN conference in Washington had over 2200 participants.
Author :
Publisher :
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.:/5 (3 download)
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1992 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : C. R. Jesshope
Publisher : CRC Press
ISBN 13 :
Total Pages : 304 pages
Book Rating : 4.3/5 (91 download)
Download or read book Wafer Scale Integration, written by C. R. Jesshope and published by CRC Press. This book was released on 1986 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, the first to deal wholly with the topic of wafer scale integration, is the edited proceedings of a workshop held at the University of Southampton in July 1985. As the first international meeting held on this subject it attracted many participants from Europe and the United States. The meeting was particularly timely as there has recently been a renewed interest in research and commercial exploitation of wafer scale integration. The papers presented in the book cover the whole range of topics important in wafer scale integration, beginning with a critical review of fault-tolerant chips and wafer scale integration. Sections on general problems and interconnection strategies follow. There are then six papaers on architectures and four on restructurable very large scale integration. The book concludes with three reviews of different aspects of testability.
Author : Ivor Brodie
Publisher : Springer Science & Business Media
ISBN 13 : 1475767757
Total Pages : 661 pages
Book Rating : 4.4/5 (757 download)
Download or read book The Physics of Micro/Nano-Fabrication written by Ivor Brodie and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 661 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this revised and expanded edition, the authors provide a comprehensive overview of the tools, technologies, and physical models needed to understand, build, and analyze microdevices. Students, specialists within the field, and researchers in related fields will appreciate their unified presentation and extensive references.
Author : Sudarshan Bahukudumbi
Publisher : Artech House
ISBN 13 : 1596939907
Total Pages : 198 pages
Book Rating : 4.5/5 (969 download)
Download or read book Wafer-Level Testing and Test During Burn-In for Integrated Circuits written by Sudarshan Bahukudumbi and published by Artech House. This book was released on 2010 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing. Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constraints. Moreover, this unique book helps practitioners address the issue of enabling next generation products with previous generation testers. Practitioners also find expert insights on current industry trends in WLTBI test solutions.
Author :
Publisher : The Electrochemical Society
ISBN 13 : 1566776546
Total Pages : 588 pages
Book Rating : 4.5/5 (667 download)
Download or read book Semiconductor Wafer Bonding 10: Science, Technology, and Applications written by and published by The Electrochemical Society. This book was released on 2008-10 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
