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Three Dimensional Device And Circuit Architectures
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Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Book Synopsis Three-Dimensional Integrated Circuit Design by : Yuan Xie
Download or read book Three-Dimensional Integrated Circuit Design written by Yuan Xie and published by Springer Science & Business Media. This book was released on 2009-12-02 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Book Synopsis Three-Dimensional Design Methodologies for Tree-based FPGA Architecture by : Vinod Pangracious
Download or read book Three-Dimensional Design Methodologies for Tree-based FPGA Architecture written by Vinod Pangracious and published by Springer. This book was released on 2015-06-25 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Book Synopsis Miniaturized Transistors by : Lado Filipovic
Download or read book Miniaturized Transistors written by Lado Filipovic and published by MDPI. This book was released on 2019-06-24 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: What is the future of CMOS? Sustaining increased transistor densities along the path of Moore's Law has become increasingly challenging with limited power budgets, interconnect bandwidths, and fabrication capabilities. In the last decade alone, transistors have undergone significant design makeovers; from planar transistors of ten years ago, technological advancements have accelerated to today's FinFETs, which hardly resemble their bulky ancestors. FinFETs could potentially take us to the 5-nm node, but what comes after it? From gate-all-around devices to single electron transistors and two-dimensional semiconductors, a torrent of research is being carried out in order to design the next transistor generation, engineer the optimal materials, improve the fabrication technology, and properly model future devices. We invite insight from investigators and scientists in the field to showcase their work in this Special Issue with research papers, short communications, and review articles that focus on trends in micro- and nanotechnology from fundamental research to applications.
Book Synopsis 3D Nanoelectronic Computer Architecture and Implementation by : David Crawley
Download or read book 3D Nanoelectronic Computer Architecture and Implementation written by David Crawley and published by CRC Press. This book was released on 2020-01-15 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: It is becoming increasingly clear that the two-dimensional layout of devices on computer chips hinders the development of high-performance computer systems. Three-dimensional structures will be needed to provide the performance required to implement computationally intensive tasks. 3-D Nanoelectronic Computer Architecture and Implementation reviews the state of the art in nanoelectronic device design and fabrication and discusses the architectural aspects of 3-D designs, including the possible use of molecular wiring and carbon nanotube interconnections. This is a valuable reference for those involved in the design and development of nanoelectronic devices and technology.
Book Synopsis Three Dimensional System Integration by : Antonis Papanikolaou
Download or read book Three Dimensional System Integration written by Antonis Papanikolaou and published by Springer Science & Business Media. This book was released on 2010-12-07 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Book Synopsis Wafer Level 3-D ICs Process Technology by : Chuan Seng Tan
Download or read book Wafer Level 3-D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Book Synopsis Memristive Neuromorphics: Materials, Devices, Circuits, Architectures, Algorithms and their Co-Design by : Huanglong Li
Download or read book Memristive Neuromorphics: Materials, Devices, Circuits, Architectures, Algorithms and their Co-Design written by Huanglong Li and published by Frontiers Media SA. This book was released on 2022-02-21 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites by : Christian Gontrand
Download or read book Towards a Modeling Synthesis of Two or Three-Dimensional Circuits Through Substrate Coupling and Interconnections: Noises and Parasites written by Christian Gontrand and published by Bentham Science Publishers. This book was released on 2014-04-21 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt: The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels
Book Synopsis Springer Handbook of Automation by : Shimon Y. Nof
Download or read book Springer Handbook of Automation written by Shimon Y. Nof and published by Springer Nature. This book was released on 2023-06-16 with total page 1533 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook incorporates new developments in automation. It also presents a widespread and well-structured conglomeration of new emerging application areas, such as medical systems and health, transportation, security and maintenance, service, construction and retail as well as production or logistics. The handbook is not only an ideal resource for automation experts but also for people new to this expanding field.
Book Synopsis Conductivity And Magnetism: The Legacy Of Felix Bloch - A Stanford Centennial Symposium Celebrating The Works Of Felix Bloch (1905-1983) by : William A Little
Download or read book Conductivity And Magnetism: The Legacy Of Felix Bloch - A Stanford Centennial Symposium Celebrating The Works Of Felix Bloch (1905-1983) written by William A Little and published by World Scientific. This book was released on 1990-06-05 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: Felix Bloch was one of the foremost scientists of the 20th century. His work on the theory of metals in 1929 laid the cornerstone for the development of semiconductors and his work on magnetism was crucial for the development of a basic understanding of ferromagnetism. Nuclear Magnetic Resonance, which he discovered in 1946, and for which he shared the Nobel Prize with Edward Purcell in 1952, has become the most important spectroscopic tool in Chemistry. The year 1989 marks the sixtieth year since Bloch's paper on the Theory of Metals. This Symposium celebrated the occasion by gathering a group of distinguished scientists who presented overviews of the past, present and future of several major areas of Physics, Chemistry, Engineering, Computer Science, Biology and Medicine, many of which trace their origins to Bloch's influence.
Book Synopsis Handbook of Nanoscience, Engineering, and Technology by : William A. Goddard III
Download or read book Handbook of Nanoscience, Engineering, and Technology written by William A. Goddard III and published by CRC Press. This book was released on 2007-05-03 with total page 1080 pages. Available in PDF, EPUB and Kindle. Book excerpt: The ability to study and manipulate matter at the nanoscale is the defining feature of 21st-century science. The first edition of the standard-setting Handbook of Nanoscience, Engineering, and Technology saw the field through its infancy. Reassembling the preeminent team of leading scientists and researchers from all areas of nanoscience and nanote
Book Synopsis Guide to State-of-the-Art Electron Devices by : Joachim N. Burghartz
Download or read book Guide to State-of-the-Art Electron Devices written by Joachim N. Burghartz and published by John Wiley & Sons. This book was released on 2013-03-19 with total page 637 pages. Available in PDF, EPUB and Kindle. Book excerpt: Winner, 2013 PROSE Award, Engineering and Technology Concise, high quality and comparative overview of state-of-the-art electron device development, manufacturing technologies and applications Guide to State-of-the-Art Electron Devices marks the 60th anniversary of the IRE electron devices committee and the 35th anniversary of the IEEE Electron Devices Society, as such it defines the state-of-the-art of electron devices, as well as future directions across the entire field. Spans full range of electron device types such as photovoltaic devices, semiconductor manufacturing and VLSI technology and circuits, covered by IEEE Electron and Devices Society Contributed by internationally respected members of the electron devices community A timely desk reference with fully-integrated colour and a unique lay-out with sidebars to highlight the key terms Discusses the historical developments and speculates on future trends to give a more rounded picture of the topics covered A valuable resource R&D managers; engineers in the semiconductor industry; applied scientists; circuit designers; Masters students in power electronics; and members of the IEEE Electron Device Society.
Book Synopsis Official Gazette of the United States Patent and Trademark Office by : United States. Patent and Trademark Office
Download or read book Official Gazette of the United States Patent and Trademark Office written by United States. Patent and Trademark Office and published by . This book was released on 1996-12 with total page 2010 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma
Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Book Synopsis Semiconductor Memory Devices and Circuits by : Shimeng Yu
Download or read book Semiconductor Memory Devices and Circuits written by Shimeng Yu and published by CRC Press. This book was released on 2022-04-19 with total page 249 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers semiconductor memory technologies from device bit-cell structures to memory array design with an emphasis on recent industry scaling trends and cutting-edge technologies. The first part of the book discusses the mainstream semiconductor memory technologies. The second part of the book discusses the emerging memory candidates that may have the potential to change the memory hierarchy, and surveys new applications of memory technologies for machine/deep learning applications. This book is intended for graduate students in electrical and computer engineering programs and researchers or industry professionals in semiconductors and microelectronics. Explains the design of basic memory bit-cells including 6-transistor SRAM, 1-transistor-1-capacitor DRAM, and floating gate/charge trap FLASH transistor Examines the design of the peripheral circuits including the sense amplifier and array-level organization for the memory array Examines industry trends of memory technologies such as FinFET based SRAM, High-Bandwidth-Memory (HBM), 3D NAND Flash, and 3D X-point array Discusses the prospects and challenges of emerging memory technologies such as PCM, RRAM, STT-MRAM/SOT-MRAM and FeRAM/FeFET Explores the new applications such as in-memory computing for AI hardware acceleration.
Book Synopsis Bioinspired Devices by : Eugene C. Goldfield
Download or read book Bioinspired Devices written by Eugene C. Goldfield and published by Harvard University Press. This book was released on 2018-01-08 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: Robotic exoskeletons that allow stroke survivors to regain use of their limbs, 3D-printed replacement body parts, and dozens of other innovations still in schematic design are revolutionizing the treatment of debilitating injuries and nervous system disorders. What all these technologies have in common is that they are modeled after engineering strategies found in nature—strategies developed by a vast array of organisms over eons of evolutionary trial and error. Eugene Goldfield lays out many principles of engineering found in the natural world, with a focus on how evolutionary and developmental adaptations, such as sensory organs and spinal cords, function within complex organisms. He shows how the component parts of highly coordinated structures organize themselves into autonomous functional systems. For example, when people walk, spinal cord neurons generate coordinated signals that continuously reorganize patterns of muscle activations during the gait cycle. This self-organizing capacity is just one of many qualities that allow biological systems to be robust, adaptive, anticipatory, and self-repairing. To exploit the full potential of technologies designed to interact seamlessly with human bodies, properties like these must be better understood and harnessed at every level, from molecules to cells to organ systems. Bioinspired Devices brings together insights from a wide range of fields. A member of the Wyss Institute for Biologically Inspired Engineering, Goldfield offers an insider’s view of cutting-edge research, and envisions a future in which synthetic and biological devices share energy sources and control, blurring the boundary between nature and medicine.
