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Thirteenth Annual Ieee Semiconductor Thermal Measurement And Management Symposium 1997
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Author :IEEE Components, Packaging and Manufacturing Technology Society Staff Publisher : ISBN 13 : Total Pages : pages Book Rating :4.:/5 (11 download)
Book Synopsis Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 1997 by : IEEE Components, Packaging and Manufacturing Technology Society Staff
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Book Synopsis Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
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Book Synopsis Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
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Author :Institute of Electrical and Electronics Engineers Publisher :Institute of Electrical & Electronics Engineers(IEEE) ISBN 13 : Total Pages :312 pages Book Rating :4.X/5 (4 download)
Book Synopsis 1997 IEEE 13th Annual Semiconductor Thermal Measurement & Management Symposium by : Institute of Electrical and Electronics Engineers
Download or read book 1997 IEEE 13th Annual Semiconductor Thermal Measurement & Management Symposium written by Institute of Electrical and Electronics Engineers and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features coverage of new developments in and applications relating to generation and removal of heat within semiconductor devices, and measurement of junction temperatures under various application and environmental conditions.
Book Synopsis Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
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Book Synopsis Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
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Book Synopsis National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 by :
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Book Synopsis Seventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
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Book Synopsis National Semiconductor Metrology Program by : National Semiconductor Metrology Program (U.S.)
Download or read book National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and published by . This book was released on 1998 with total page 136 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Tenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
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Book Synopsis National Semiconductor Metrology Program, NIST List OF Publications, LP 103, May 2000 by :
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Book Synopsis National Semiconductor Metrology Program by : National Institute of Standards and Technology (U.S.)
Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :IEEE Components, Packaging and Manufacturing Technology Society Staff Publisher : ISBN 13 : Total Pages :189 pages Book Rating :4.:/5 (11 download)
Book Synopsis 1995 Eleventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium by : IEEE Components, Packaging and Manufacturing Technology Society Staff
Download or read book 1995 Eleventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by IEEE Components, Packaging and Manufacturing Technology Society Staff and published by . This book was released on 1995 with total page 189 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Book Synopsis Thirtieth Annual Semiconductor Thermal Measurement and Management Symposium by :
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Book Synopsis Solder Joint Reliability Prediction for Multiple Environments by : Andrew E. Perkins
Download or read book Solder Joint Reliability Prediction for Multiple Environments written by Andrew E. Perkins and published by Springer Science & Business Media. This book was released on 2008-12-16 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
