Thin Films: Volume 875

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Publisher : Cambridge University Press
ISBN 13 : 9781107408937
Total Pages : 472 pages
Book Rating : 4.4/5 (89 download)

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Book Synopsis Thin Films: Volume 875 by : Thomas E. Buchheit

Download or read book Thin Films: Volume 875 written by Thomas E. Buchheit and published by Cambridge University Press. This book was released on 2014-06-05 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.

Thin Films: Volume 875

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Author :
Publisher : Cambridge University Press
ISBN 13 : 9781558998292
Total Pages : 480 pages
Book Rating : 4.9/5 (982 download)

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Book Synopsis Thin Films: Volume 875 by : Thomas E. Buchheit

Download or read book Thin Films: Volume 875 written by Thomas E. Buchheit and published by Cambridge University Press. This book was released on 2005 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.

Thin Films, Stresses and Mechanical Properties

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Author :
Publisher :
ISBN 13 :
Total Pages : 576 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Thin Films, Stresses and Mechanical Properties by :

Download or read book Thin Films, Stresses and Mechanical Properties written by and published by . This book was released on 1997 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Metallic Films for Electronic, Optical and Magnetic Applications

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Author :
Publisher : Woodhead Publishing
ISBN 13 : 085709629X
Total Pages : 656 pages
Book Rating : 4.8/5 (57 download)

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Book Synopsis Metallic Films for Electronic, Optical and Magnetic Applications by : Katayun Barmak

Download or read book Metallic Films for Electronic, Optical and Magnetic Applications written by Katayun Barmak and published by Woodhead Publishing. This book was released on 2014-02-13 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties

Mechanical Properties of Structural Films

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Author :
Publisher : ASTM International
ISBN 13 : 0803128894
Total Pages : 333 pages
Book Rating : 4.8/5 (31 download)

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Book Synopsis Mechanical Properties of Structural Films by : Christopher L. Muhlstein

Download or read book Mechanical Properties of Structural Films written by Christopher L. Muhlstein and published by ASTM International. This book was released on 2001 with total page 333 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent advances in the mechanical properties of structural films are described in these papers from a November 2000 symposium held in Orlando, Florida. Papers are organized in sections on fracture and fatigue of structural films, elastic behavior and residual stress in thin films, tensile testing of

Thin Films: Stresses and Mechanical Properties IX: Volume 695

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Publisher :
ISBN 13 :
Total Pages : 544 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Thin Films: Stresses and Mechanical Properties IX: Volume 695 by : Materials Research Society. Meeting

Download or read book Thin Films: Stresses and Mechanical Properties IX: Volume 695 written by Materials Research Society. Meeting and published by . This book was released on 2002-04 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Thin Films--stresses and Mechanical Properties XI

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Author :
Publisher :
ISBN 13 :
Total Pages : 480 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Thin Films--stresses and Mechanical Properties XI by : Materials Research Society. Meeting

Download or read book Thin Films--stresses and Mechanical Properties XI written by Materials Research Society. Meeting and published by . This book was released on 2005 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Thin Films - Stresses and Mechanical Properties X:

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Author :
Publisher : Cambridge University Press
ISBN 13 : 9781107409316
Total Pages : 606 pages
Book Rating : 4.4/5 (93 download)

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Book Synopsis Thin Films - Stresses and Mechanical Properties X: by : Sean G. Corcoran

Download or read book Thin Films - Stresses and Mechanical Properties X: written by Sean G. Corcoran and published by Cambridge University Press. This book was released on 2014-06-05 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Understanding the mechanical behavior of thin films is crucial for a wide variety of technologies. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. The concepts, models and techniques developed for bulk materials often do not apply to small dimensions, and the mechanisms controlling behavior are not well defined. This book, first published in 2004, brings together an international group of researchers and students from industry, academia and national laboratories to address the mechanical behavior of thin films. Of particular interest are those studies that cut across length scales such as atomistic-to-nanometer or nanometer-to-submicron scale. Topics include: stress evolution; modeling stresses and film instability; deformation and adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanical properties; properties and performance; and multilayers and nanolaminates.

Thin Films: Stresses and Mechanical Properties IX:

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Author :
Publisher : Cambridge University Press
ISBN 13 : 9781107412064
Total Pages : 532 pages
Book Rating : 4.4/5 (12 download)

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Book Synopsis Thin Films: Stresses and Mechanical Properties IX: by : Cengiz S. Ozkan

Download or read book Thin Films: Stresses and Mechanical Properties IX: written by Cengiz S. Ozkan and published by Cambridge University Press. This book was released on 2014-06-05 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, the ninth in a popular series from the Materials Research Society, is strengthened by invited and contributed papers covering a wide range of subjects, from processing-microstructure-mechanical property relationships, strain effects and self-organization in thin films, nanoscale defects and thermomechanical behavior of materials, to novel nanscale materials testing. While the collection continues the series theme of materials science related modeling and characterization of mechanical properties of materials, special focus is given to: strain relaxation and strengthening mechanisms; defects formation; mechanical properties and nanoscale testing; adhesion and fracture; thin-film applications in MEMS; computational modeling and experiments; and film deposition, microstructure, evolution and intrinsic stress.

Thin Films - Stresses and Mechanical Properties VIII:

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Publisher : Cambridge University Press
ISBN 13 : 9781107413306
Total Pages : 566 pages
Book Rating : 4.4/5 (133 download)

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Book Synopsis Thin Films - Stresses and Mechanical Properties VIII: by : Richard Vinci

Download or read book Thin Films - Stresses and Mechanical Properties VIII: written by Richard Vinci and published by Cambridge University Press. This book was released on 2014-06-05 with total page 566 pages. Available in PDF, EPUB and Kindle. Book excerpt: An understanding of mechanical behavior is crucial for a wide variety of thin-film technologies such as semiconductor devices and packaging (including advanced interconnects, dielectrics and silicides), information storage media, hard coatings, microelectromechanical systems (MEMS), and biomedical devices. The influence of mechanical behavior is seen in thin-film performance and reliability, as well as morphology development during processing and service. The increased need for understanding of these properties has challenged modern materials science because concepts, models and techniques developed for bulk materials often do not apply in small dimensions. This book addresses key issues in the still growing field of thin-film mechanical behavior. Topics include: multilayer thin films; metallic thin films; epitaxy, deposition parameters, microstructure and stresses; thin films for applications in MEMS; polymer thin films; mechanical properties of amorphous and crystalline carbon; adhesion and fracture; reliability in microelectronics; and nanoindentation and advanced testing techniques.

Thin Films: Volume 239

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Publisher :
ISBN 13 :
Total Pages : 750 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Thin Films: Volume 239 by : W. D. Nix

Download or read book Thin Films: Volume 239 written by W. D. Nix and published by . This book was released on 1992-06-16 with total page 750 pages. Available in PDF, EPUB and Kindle. Book excerpt: Papers presented at the 1991 Fall Meeting of the Materials Research Society

Mechanical Properties of Thin Films

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Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (141 download)

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Book Synopsis Mechanical Properties of Thin Films by : M. T. Laugier

Download or read book Mechanical Properties of Thin Films written by M. T. Laugier and published by . This book was released on 1979 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Handbook of Semiconductor Manufacturing Technology

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Publisher : CRC Press
ISBN 13 : 1420017667
Total Pages : 1720 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi

Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

The influence of surface films on mechanical properties

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Publisher :
ISBN 13 :
Total Pages : 58 pages
Book Rating : 4.X/5 (4 download)

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Book Synopsis The influence of surface films on mechanical properties by : Heinz G. F. Wilsdorf

Download or read book The influence of surface films on mechanical properties written by Heinz G. F. Wilsdorf and published by . This book was released on 1975 with total page 58 pages. Available in PDF, EPUB and Kindle. Book excerpt: The variables that influence the mechanical behavior of metals covered with thin films have been enumerated. In particular, factors affecting dislocation glide in the surface region have been characterized in terms of image stresses taking into account both the free surface and the accommodation dislocation network at the substrate-film interface. A reduction of yield stress of 50% or more was measured on copper crystals electro-plated with 600 A films of nickel, gold or alpha-brass, all of which are epitaxial overgrowths. The complexity of the microstructure in the substrate-thin film composite has been described and the consequences on dislocation glide explored. An example of a system which exhibits an increase of the critical resolved yield stress, tau sub y, is given. Here, diffusion layers less than 1 micrometer thick caused tau sub y to increase by a factor of two, a consequence of the hindering of glide dislocations by accommodation dislocation networks.

Preparation and Properties of Thin Films

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Author :
Publisher : Elsevier
ISBN 13 : 1483218295
Total Pages : 350 pages
Book Rating : 4.4/5 (832 download)

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Book Synopsis Preparation and Properties of Thin Films by : K. N. Tu

Download or read book Preparation and Properties of Thin Films written by K. N. Tu and published by Elsevier. This book was released on 2013-10-22 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt: Treatise on Materials Science and Technology, Volume 24: Preparation and Properties of Thin Films covers the progress made in the preparation of thin films and the corresponding study of their properties. The book discusses the preparation and property correlations in thin film; the variation of microstructure of thin films; and the molecular beam epitaxy of superlattices in thin film. The text also describes the epitaxial growth of silicon structures (thermal-, laser-, and electron-beam-induced); the characterization of grain boundaries in bicrystalline thin films; and the mechanical properties of thin films on substrates. The ion beam modification of thin film; the use of thin alloy films for metallization in microelectronic devices; and the fabrication and physical properties of ultrasmall structures are also encompassed. Materials scientists and materials engineers will find the book invaluable.

Handbook for Cleaning for Semiconductor Manufacturing

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Publisher : John Wiley & Sons
ISBN 13 : 1118099516
Total Pages : 596 pages
Book Rating : 4.1/5 (18 download)

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Book Synopsis Handbook for Cleaning for Semiconductor Manufacturing by : Karen A. Reinhardt

Download or read book Handbook for Cleaning for Semiconductor Manufacturing written by Karen A. Reinhardt and published by John Wiley & Sons. This book was released on 2011-04-12 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.

Encyclopedia of Thermal Stresses

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Publisher : Springer
ISBN 13 : 9789400727380
Total Pages : 6643 pages
Book Rating : 4.7/5 (273 download)

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Book Synopsis Encyclopedia of Thermal Stresses by : Richard B. Hetnarski

Download or read book Encyclopedia of Thermal Stresses written by Richard B. Hetnarski and published by Springer. This book was released on 2013-12-04 with total page 6643 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Encyclopedia of Thermal Stresses is an important interdisciplinary reference work. In addition to topics on thermal stresses, it contains entries on related topics, such as the theory of elasticity, heat conduction, thermodynamics, appropriate topics on applied mathematics, and topics on numerical methods. The Encyclopedia is aimed at undergraduate and graduate students, researchers and engineers. It brings together well established knowledge and recently received results. All entries were prepared by leading experts from all over the world, and are presented in an easily accessible format. The work is lavishly illustrated, examples and applications are given where appropriate, ideas for further development abound, and the work will challenge many students and researchers to pursue new results of their own. This work can also serve as a one-stop resource for all who need succinct, concise, reliable and up to date information in short encyclopedic entries, while the extensive references will be of interest to those who need further information. For the coming decade, this is likely to remain the most extensive and authoritative work on Thermal Stresses.