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Thermal Stress Resistance Of Materials
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Book Synopsis Thermal Stress Resistance of Materials by : Anatoly Lanin
Download or read book Thermal Stress Resistance of Materials written by Anatoly Lanin and published by Springer Science & Business Media. This book was released on 2008-02-23 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt: This brilliant treatise is based on extensive experimental and technological data derived from high-temperature materials development processes. The distinguished authors analyse results from the development of nuclear reactors and aerospace rocket engines. They apply this data to the problem of bearing capacity and the fracture of thermally loaded bodies. They establish new regularities of fracture at various modes of local and combined thermal loading.
Book Synopsis Behavior of Materials Under Conditions of Thermal Stress by : S. S. Manson
Download or read book Behavior of Materials Under Conditions of Thermal Stress written by S. S. Manson and published by . This book was released on 1953 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt: A review is presented of available information on the behavior of brittle and ductile materials under conditions of thermal stress and thermal shock. For brittle materials, a simple formula relating physical properties to thermal-shock resistance are derived and used to determine the relative significance of two indices currently in use for rating materials. The importance of simulating operating conditions in thermal-shock testing is deduced from the formula and is experimentally illustrated by showing that BeO could be both inferior or superior to Al2O3 in thermal shock depending on the testing conditions. For ductile materials, thermal-shock resistance depends upon the complex interrelation among several metallurgical variables which seriously affect strength and ductility. These variables are briefly discussed and illustrated from literature sources. The importance of simulating operating conditions in tests for rating ductile materials is especially to be emphasized because of the importance of testing conditions in metallurgy. A number of practical methods that have been used to minimize the deleterious effects of thermal stress and thermal shock are outlined.
Book Synopsis Thermal Fatigue of Materials and Components by : David A. Spera
Download or read book Thermal Fatigue of Materials and Components written by David A. Spera and published by ASTM International. This book was released on 1976 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Thermal Stresses in Severe Environments by : D. P. Hasselman
Download or read book Thermal Stresses in Severe Environments written by D. P. Hasselman and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 727 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume of Thermal Stresses in ~~terials and Structures in Severe Thermal Environments constitutes the proceedings of an international conference held at Virginia Polytechnic Institute and State University in Blacksburg, Virginia, USA, on ~1arch 19, 20 and 21, 1980. The purpose of the conference was to bring together experts in the areas of heat transfer, theoretical and applied mechanics amd materials science and engineering, with a.common interest in the highly interdisciplinary nature of the thermal stress problem. It is the hope of the program chairmen that the resulting interac tion has led to a greater understanding of the underlying prin ciples of the thermal stress problem and to an improved design and selection of materials for structures subjected to high thermal stresses. The program chairmen gratefully acknowledge the financial assistance for the conference provided by the Department of Energy, the National Science Foundation, the Army Research Office and the Office of Naval Research as well as the Departments of Engineering Science and Mechanics and Materials Engineering at Virginia Poly technic Institute and State University. A number of professional societies also provided mailing lists for the program at no nominal cost The Associate Director, Mr. R. J. Harshberger and his staff at the Conference Center for Continuing Education at VPI and SU should be recognized especially for their coordination of the con ference activities, lunches and banquet. Provost John D. Wilson gave a most enlightening and provocative after-dinner speech.
Book Synopsis Thermal Stress Analyses by : D. J. Johns
Download or read book Thermal Stress Analyses written by D. J. Johns and published by Elsevier. This book was released on 2013-10-22 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Stress Analyses deals with both elastic and plastic thermal stresses produced from large variations in temperature and thermal expansion in materials whose properties are time-independent. This book is composed of eight chapters. The opening chapter illustrates the general three-dimensional thermoelastic problem, which requires the determination of stress, strains and displacements, when the body forces and boundary conditions are known while the next chapter demonstrate a simpler, two-dimensional formulation involving plane strain and plane stress. The succeeding five chapters describe thermal stresses in various structures, including in thin plates, beams, circular cylinders, and shells. The closing chapters consider the mechanism of thermal buckling and sundry design problems. This book is of value to mechanical engineers, and to mechanical engineering teachers and students.
Book Synopsis Encyclopedia of Thermal Stresses by : Richard B. Hetnarski
Download or read book Encyclopedia of Thermal Stresses written by Richard B. Hetnarski and published by Springer. This book was released on 2013-12-04 with total page 6643 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Encyclopedia of Thermal Stresses is an important interdisciplinary reference work. In addition to topics on thermal stresses, it contains entries on related topics, such as the theory of elasticity, heat conduction, thermodynamics, appropriate topics on applied mathematics, and topics on numerical methods. The Encyclopedia is aimed at undergraduate and graduate students, researchers and engineers. It brings together well established knowledge and recently received results. All entries were prepared by leading experts from all over the world, and are presented in an easily accessible format. The work is lavishly illustrated, examples and applications are given where appropriate, ideas for further development abound, and the work will challenge many students and researchers to pursue new results of their own. This work can also serve as a one-stop resource for all who need succinct, concise, reliable and up to date information in short encyclopedic entries, while the extensive references will be of interest to those who need further information. For the coming decade, this is likely to remain the most extensive and authoritative work on Thermal Stresses.
Book Synopsis Thermal Shock and Thermal Fatigue Behavior of Advanced Ceramics by : Gerold A. Schneider
Download or read book Thermal Shock and Thermal Fatigue Behavior of Advanced Ceramics written by Gerold A. Schneider and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 575 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent developments in advanced ceramics are critically evaluated in respect to their thermal shock and thermal fatigue behavior from an interdisciplinary viewpoint by leading experts. The book covers the aspects of material development, mechanical and fracture mechanical models and experimental testing methods. Special emphasis is given to the influence of a rising crack resistance on the thermal shock behavior, novel irradiation testing methods for a quantitative characterization of the thermal shock and fatigue loading as well as detailed fracture mechanical models for single and multiple crack propagation. This book summarizes developments of the last decade concerning the thermal shock and thermal fatigue behavior of advanced ceramics. The scientific articles of the book were carefully arranged in order to achieve a textbook-like form which will be of great value to researchers and students. (ABSTRACT) This book summarizes developments of the last decade concerning the thermal shock and thermal fatigue behavior of advanced ceramics. The book covers the aspects of material development, mechanical and fracture mechanical models and testing methods. The scientific articles were carefully arranged in order to achieve a textbook-like form which will be of great value to researchers and students.
Book Synopsis Theory of Thermal Stresses by : Bruno A. Boley
Download or read book Theory of Thermal Stresses written by Bruno A. Boley and published by Courier Corporation. This book was released on 2012-05-23 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: Highly regarded text presents detailed discussion of fundamental aspects of theory, background, problems with detailed solutions. Basics of thermoelasticity, heat transfer theory, thermal stress analysis, more. 1985 edition.
Book Synopsis Applications and Techniques for Experimental Stress Analysis by : Karuppasamy, Karthik Selva Kumar
Download or read book Applications and Techniques for Experimental Stress Analysis written by Karuppasamy, Karthik Selva Kumar and published by IGI Global. This book was released on 2019-12-27 with total page 269 pages. Available in PDF, EPUB and Kindle. Book excerpt: The design of mechanical components for various engineering applications requires the understanding of stress distribution in the materials. The need of determining the nature of stress distribution on the components can be achieved with experimental techniques. Applications and Techniques for Experimental Stress Analysis is a timely research publication that examines how experimental stress analysis supports the development and validation of analytical and numerical models, the progress of phenomenological concepts, the measurement and control of system parameters under working conditions, and identification of sources of failure or malfunction. Highlighting a range of topics such as deformation, strain measurement, and element analysis, this book is essential for mechanical engineers, civil engineers, designers, aerospace engineers, researchers, industry professionals, academicians, and students.
Book Synopsis Thermal Stress and Strain in Microelectronics Packaging by : John Lau
Download or read book Thermal Stress and Strain in Microelectronics Packaging written by John Lau and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Book Synopsis Thermal Expansion 7 by : David C. Larsen
Download or read book Thermal Expansion 7 written by David C. Larsen and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Stress Analysis of Fiber-reinforced Composite Materials by : M. W. Hyer
Download or read book Stress Analysis of Fiber-reinforced Composite Materials written by M. W. Hyer and published by DEStech Publications, Inc. This book was released on 2009 with total page 718 pages. Available in PDF, EPUB and Kindle. Book excerpt: Updated and improved, Stress Analysis of Fiber-Reinforced Composite Materials, Hyer's work remains the definitive introduction to the use of mechanics to understand stresses in composites caused by deformations, loading, and temperature changes. In contrast to a materials science approach, Hyer emphasizes the micromechanics of stress and deformation for composite material analysis. The book provides invaluable analytic tools for students and engineers seeking to understand composite properties and failure limits. A key feature is a series of analytic problems continuing throughout the text, starting from relatively simple problems, which are built up step-by-step with accompanying calculations. The problem series uses the same material properties, so the impact of the elastic and thermal expansion properties for a single-layer of FR material on the stress, strains, elastic properties, thermal expansion and failure stress of cross-ply and angle-ply symmetric and unsymmetric laminates can be evaluated. The book shows how thermally induced stresses and strains due to curing, add to or subtract from those due to applied loads.Another important element, and one unique to this book, is an emphasis on the difference between specifying the applied loads, i.e., force and moment results, often the case in practice, versus specifying strains and curvatures and determining the subsequent stresses and force and moment results. This represents a fundamental distinction in solid mechanics.
Book Synopsis Materials for Tribology by : William Glaeser
Download or read book Materials for Tribology written by William Glaeser and published by Elsevier. This book was released on 1992-05-07 with total page 259 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides an extensive reference source on the materials used in tribological applications. Materials used in tribological applications are, for the most part, common materials used for general engineering applications. Many conventional engineering materials have been adapted to tribological uses and examples of these are given throughout the text. Literature that so far has been scattered and difficult to retrieve is now presented for the first time in this comprehensive treatise. The author has used his expertise in selecting materials for a wide variety of friction and wear applications to develop this data base on materials for tribology. In addition information has been selected from the literature on the behaviour of these materials in bearings, seals, gears, brakes, clutches, wire rope, valves, cams and wear surfaces and is included in the descriptive text. The materials have been grouped in families, relating to their composition. A short table is provided at the beginning of each chapter, listing the ranges of selected properties for the materials under discussion. In addition there are short summaries of the tribological applications this class of materials is used for. On the first page of each chapter one can find a guide for the selection of materials. Sufficient references to the literature are given to enable the reader to follow up in more detail the various topics discussed.
Book Synopsis On Thermal Stresses, Strains, and Warping by : F. H. Murray
Download or read book On Thermal Stresses, Strains, and Warping written by F. H. Murray and published by . This book was released on 1944 with total page 12 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Fracture Mechanics of Ceramics by : R.C. Bradt
Download or read book Fracture Mechanics of Ceramics written by R.C. Bradt and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Volume 13 of the Fracture Mechanics of Ceramics series constitutes the th Proceedings of the 7 International Symposium on the fracture mechanics of ceramics held at the Presidium of the Russian Academy of Sciences, Moscow, Russia on July 20 to 22, 1999. The series started from the Proceedings of the 1 st Symposium at the Pennsylvania State University that has been held on 1973 (Vols. 1 and 2), followed by 1977 and 1981 Years meetings (Vols. 3 to 6) which were held at the Pennsylvania State University, too. Volumes 7 and 8 are from the 1985 Symposium which was held at the Virginia Polytechnic Institute and State University, Volumes 9 and 10 are from the 1991 Symposium at Japan Fine Ceramic Centre, Nagoya, and Volumes 11 and 12 are from the 1995 Symposium at Kernforschungszentrum, Karlsruhe. The theme of the Symposium was focused on the mechanical behaviour of advanced ceramics in terms of the cracks, particularly the crack-microstructure interaction, delayed failure, environmental effects in fracture. Special attention was paid on the novel methods in fracture mechanics testing, pre-standardisation and standartisation. The authors from 19 countries represented the current state of that field. The International Scientific Committee gratefully acknowledge the sponsoring provided by The Russian Academy of Sciences and, personally, Academician Yu.S.Osipov, President of RAS; The Ministry of Science and Technologies of the Russian Federation, Prof. G.Terestchenko; Russian Foundation for Basic Research, Academician I.Moiseev; Scientific Technical Center "Bacor", Dr. B.Krasnij; Gzhel Ltd., Prof.
Book Synopsis Thermal Stresses by : Richard B. Hetnarski
Download or read book Thermal Stresses written by Richard B. Hetnarski and published by North Holland. This book was released on 1986 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: The publication of this volume, the first in a series, is a major event for those interested in Applied Mechanics in general and Thermal Stresses in particular. It is only about thirty years ago that the first books devoted exclusively to the subject of Thermal Stresses appeared in print. Since then, many advances have been made, both in theory and in applications. Modern requirements in design and construction of a multitude of products require the evaluation of stresses and displacements caused by the temperature fields which change in time and space. It is hoped that the state-of-the-art articles in this series will stimulate interest in this field of research and will also be of assistance to engineers in their everyday work.
Book Synopsis 5th Annual Conference on Composites and Advanced Ceramic Materials by : William J. Smothers
Download or read book 5th Annual Conference on Composites and Advanced Ceramic Materials written by William J. Smothers and published by John Wiley & Sons. This book was released on 2009-09-28 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.
