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Author : Ting-Yuan Wang
Publisher :
ISBN 13 :
Total Pages : 124 pages
Book Rating : 4.:/5 (89 download)
Download or read book Thermal and Power Integrity Analysis and Optimization for High Performance VLSI written by Ting-Yuan Wang and published by . This book was released on 2004 with total page 124 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Hang Li
Publisher :
ISBN 13 :
Total Pages : 258 pages
Book Rating : 4.3/5 (121 download)
Download or read book Power and Thermal Integrity Analysis and Optimization for Nanometer VLSI Systems written by Hang Li and published by . This book was released on 2007 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Fengyuan Sun
Publisher : Editions Publibook
ISBN 13 : 2753903298
Total Pages : 178 pages
Book Rating : 4.7/5 (539 download)
Download or read book Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D written by Fengyuan Sun and published by Editions Publibook. This book was released on 2016 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Author :
Publisher :
ISBN 13 :
Total Pages : 994 pages
Book Rating : 4.F/5 ( download)
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2008 with total page 994 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Joseph T. DiBene, II
Publisher : John Wiley & Sons
ISBN 13 : 1118826345
Total Pages : 279 pages
Book Rating : 4.1/5 (188 download)
Download or read book Fundamentals of Power Integrity for Computer Platforms and Systems written by Joseph T. DiBene, II and published by John Wiley & Sons. This book was released on 2014-05-16 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: An all-encompassing text that focuses on the fundamentals of power integrity Power integrity is the study of power distribution from the source to the load and the system level issues that can occur across it. For computer systems, these issues can range from inside the silicon to across the board and may egress into other parts of the platform, including thermal, EMI, and mechanical. With a focus on computer systems and silicon level power delivery, this book sheds light on the fundamentals of power integrity, utilizing the author’s extensive background in the power integrity industry and unique experience in silicon power architecture, design, and development. Aimed at engineers interested in learning the essential and advanced topics of the field, this book offers important chapter coverage of fundamentals in power distribution, power integrity analysis basics, system-level power integrity considerations, power conversion in computer systems, chip-level power, and more. Fundamentals of Power Integrity for Computer Platforms and Systems: Introduces readers to both the field of power integrity and to platform power conversion Provides a unique focus on computer systems and silicon level power delivery unavailable elsewhere Offers detailed analysis of common problems in the industry Reviews electromagnetic field and circuit representation Includes a detailed bibliography of references at the end of each chapter Works out multiple example problems within each chapter Including additional appendixes of tables and formulas, Fundamentals of Power Integrity for Computer Platforms and Systems is an ideal introductory text for engineers of power integrity as well as those in the chip design industry, specifically physical design and packaging.
Author :
Publisher :
ISBN 13 :
Total Pages : 704 pages
Book Rating : 4.:/5 (31 download)
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 268 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings written by and published by . This book was released on 2001 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Salvador Bracho del Pino
Publisher : Ed. Universidad de Cantabria
ISBN 13 : 9788481023114
Total Pages : 756 pages
Book Rating : 4.0/5 (231 download)
Download or read book DCIS2002 written by Salvador Bracho del Pino and published by Ed. Universidad de Cantabria. This book was released on 2002 with total page 756 pages. Available in PDF, EPUB and Kindle. Book excerpt: Este libro contiene las presentaciones de la XVII Conferencia de Diseño de Circuitos y Sistemas Integrados celebrado en el Palacio de la Magdalena, Santander, en noviembre de 2002. Esta Conferencia ha alcanzado un alto nivel de calidad, como consecuencia de su tradición y madurez, que lo convierte en uno de los acontecimientos más importantes para los circuitos de microelectrónica y la comunidad de diseño de sistemas en el sur de Europa. Desde su origen tiene una gran contribución de Universidades españolas, aunque hoy los autores participan desde catorce países
Author : Sharma, Manoj
Publisher : IGI Global
ISBN 13 : 1522501916
Total Pages : 423 pages
Book Rating : 4.5/5 (225 download)
Download or read book Design and Modeling of Low Power VLSI Systems written by Sharma, Manoj and published by IGI Global. This book was released on 2016-06-06 with total page 423 pages. Available in PDF, EPUB and Kindle. Book excerpt: Very Large Scale Integration (VLSI) Systems refer to the latest development in computer microchips which are created by integrating hundreds of thousands of transistors into one chip. Emerging research in this area has the potential to uncover further applications for VSLI technologies in addition to system advancements. Design and Modeling of Low Power VLSI Systems analyzes various traditional and modern low power techniques for integrated circuit design in addition to the limiting factors of existing techniques and methods for optimization. Through a research-based discussion of the technicalities involved in the VLSI hardware development process cycle, this book is a useful resource for researchers, engineers, and graduate-level students in computer science and engineering.
Author : Fakhfakh, Mourad
Publisher : IGI Global
ISBN 13 : 1466666285
Total Pages : 488 pages
Book Rating : 4.4/5 (666 download)
Download or read book Performance Optimization Techniques in Analog, Mixed-Signal, and Radio-Frequency Circuit Design written by Fakhfakh, Mourad and published by IGI Global. This book was released on 2014-10-31 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: Improving the performance of existing technologies has always been a focal practice in the development of computational systems. However, as circuitry is becoming more complex, conventional techniques are becoming outdated and new research methodologies are being implemented by designers. Performance Optimization Techniques in Analog, Mix-Signal, and Radio-Frequency Circuit Design features recent advances in the engineering of integrated systems with prominence placed on methods for maximizing the functionality of these systems. This book emphasizes prospective trends in the field and is an essential reference source for researchers, practitioners, engineers, and technology designers interested in emerging research and techniques in the performance optimization of different circuit designs.
Author : Aida Todri-Sanial
Publisher : CRC Press
ISBN 13 : 1351830198
Total Pages : 409 pages
Book Rating : 4.3/5 (518 download)
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author : Ruijing Shen
Publisher : Springer Science & Business Media
ISBN 13 : 1461407885
Total Pages : 326 pages
Book Rating : 4.4/5 (614 download)
Download or read book Statistical Performance Analysis and Modeling Techniques for Nanometer VLSI Designs written by Ruijing Shen and published by Springer Science & Business Media. This book was released on 2014-07-08 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since process variation and chip performance uncertainties have become more pronounced as technologies scale down into the nanometer regime, accurate and efficient modeling or characterization of variations from the device to the architecture level have become imperative for the successful design of VLSI chips. This book provides readers with tools for variation-aware design methodologies and computer-aided design (CAD) of VLSI systems, in the presence of process variations at the nanometer scale. It presents the latest developments for modeling and analysis, with a focus on statistical interconnect modeling, statistical parasitic extractions, statistical full-chip leakage and dynamic power analysis considering spatial correlations, statistical analysis and modeling for large global interconnects and analog/mixed-signal circuits. Provides readers with timely, systematic and comprehensive treatments of statistical modeling and analysis of VLSI systems with a focus on interconnects, on-chip power grids and clock networks, and analog/mixed-signal circuits; Helps chip designers understand the potential and limitations of their design tools, improving their design productivity; Presents analysis of each algorithm with practical applications in the context of real circuit design; Includes numerical examples for the quantitative analysis and evaluation of algorithms presented. Provides readers with timely, systematic and comprehensive treatments of statistical modeling and analysis of VLSI systems with a focus on interconnects, on-chip power grids and clock networks, and analog/mixed-signal circuits; Helps chip designers understand the potential and limitations of their design tools, improving their design productivity; Presents analysis of each algorithm with practical applications in the context of real circuit design; Includes numerical examples for the quantitative analysis and evaluation of algorithms presented.
Author :
Publisher :
ISBN 13 :
Total Pages : 1948 pages
Book Rating : 4.3/5 (243 download)
Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 1948 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Selahattin Sayil
Publisher : Springer Nature
ISBN 13 : 303112751X
Total Pages : 142 pages
Book Rating : 4.0/5 (311 download)
Download or read book Noise Contamination in Nanoscale VLSI Circuits written by Selahattin Sayil and published by Springer Nature. This book was released on 2022-08-31 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook provides readers with a comprehensive introduction to various noise sources that significantly reduce performance and reliability in nanometer-scale integrated circuits. The author covers different types of noise, such as crosstalk noise caused by signal switching of adjacent wires, power supply noise or IR voltage drop in the power line due to simultaneous buffer / gate switching events, substrate coupling noise, radiation-induced transients, thermally induced noise and noise due to process and environmental Coverages also includes the relationship between some of these noise sources, as well as compound effects, and modeling and mitigation of noise mechanisms.
Author : Ho-Ming Tong
Publisher : Springer Science & Business Media
ISBN 13 : 1441957685
Total Pages : 562 pages
Book Rating : 4.4/5 (419 download)
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author : Yong Zhan
Publisher : Now Publishers Inc
ISBN 13 : 1601981708
Total Pages : 131 pages
Book Rating : 4.6/5 (19 download)
Download or read book Thermally-Aware Design written by Yong Zhan and published by Now Publishers Inc. This book was released on 2008 with total page 131 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides an overview of analysis and optimization techniques for thermally-aware chip design.
Author : Vasilis F. Pavlidis
Publisher : Newnes
ISBN 13 : 0124104843
Total Pages : 770 pages
Book Rating : 4.1/5 (241 download)
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
