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The Prediction Of Early Failures In Vlsi Interconnects Due To Random Subtractive Defects
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Book Synopsis The Prediction of Early Failures in VLSI Interconnects Due to Random Subtractive Defects by : Kevin Gerald Kemp
Download or read book The Prediction of Early Failures in VLSI Interconnects Due to Random Subtractive Defects written by Kevin Gerald Kemp and published by . This book was released on 1989 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis An Investigation of the Effect of Subtractive Defects and Grain Size on Early Failures in VLSI Metal Interconnects by : Satish S. Menon
Download or read book An Investigation of the Effect of Subtractive Defects and Grain Size on Early Failures in VLSI Metal Interconnects written by Satish S. Menon and published by . This book was released on 1991 with total page 78 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Masters Theses in the Pure and Applied Sciences by : Wade H. Shafer
Download or read book Masters Theses in the Pure and Applied Sciences written by Wade H. Shafer and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 421 pages. Available in PDF, EPUB and Kindle. Book excerpt: Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 34 (thesis year 1989) a total of 13,377 theses titles from 26 Canadian and 184 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this important annual reference work. While Volume 34 reports theses submitted in 1989, on occasion, certain univer sities do report theses submitted in previous years but not reported at the time.
Book Synopsis Microelectronics Manufacturability, Yield, and Reliability by : Barbara Vasquez
Download or read book Microelectronics Manufacturability, Yield, and Reliability written by Barbara Vasquez and published by . This book was released on 1994 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Reliability Test of VLSI Metal Interconnects for Early Failure Prediction by : Jonathan Hsiaoming Liu
Download or read book Reliability Test of VLSI Metal Interconnects for Early Failure Prediction written by Jonathan Hsiaoming Liu and published by . This book was released on 1992 with total page 122 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis American Doctoral Dissertations by :
Download or read book American Doctoral Dissertations written by and published by . This book was released on 1989 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis CMOS Digital Integrated Circuits by : Sung-Mo Kang
Download or read book CMOS Digital Integrated Circuits written by Sung-Mo Kang and published by . This book was released on 2002 with total page 655 pages. Available in PDF, EPUB and Kindle. Book excerpt: The fourth edition of CMOS Digital Integrated Circuits: Analysis and Design continues the well-established tradition of the earlier editions by offering the most comprehensive coverage of digital CMOS circuit design, as well as addressing state-of-the-art technology issues highlighted by the widespread use of nanometer-scale CMOS technologies. In this latest edition, virtually all chapters have been re-written, the transistor model equations and device parameters have been revised to reflect the sigificant changes that must be taken into account for new technology generations, and the material has been reinforced with up-to-date examples. The broad-ranging coverage of this textbook starts with the fundamentals of CMOS process technology, and continues with MOS transistor models, basic CMOS gates, interconnect effects, dynamic circuits, memory circuits, arithmetic building blocks, clock and I/O circuits, low power design techniques, design for manufacturability and design for testability.
Book Synopsis Reliability Physics and Engineering by : J. W. McPherson
Download or read book Reliability Physics and Engineering written by J. W. McPherson and published by Springer Science & Business Media. This book was released on 2013-06-03 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Reliability Physics and Engineering" provides critically important information for designing and building reliable cost-effective products. The textbook contains numerous example problems with solutions. Included at the end of each chapter are exercise problems and answers. "Reliability Physics and Engineering" is a useful resource for students, engineers, and materials scientists.
Book Synopsis Reliability Engineering by : Kailash C. Kapur
Download or read book Reliability Engineering written by Kailash C. Kapur and published by John Wiley & Sons. This book was released on 2014-03-21 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: An Integrated Approach to Product Development Reliability Engineering presents an integrated approach to the design, engineering, and management of reliability activities throughout the life cycle of a product, including concept, research and development, design, manufacturing, assembly, sales, and service. Containing illustrative guides that include worked problems, numerical examples, homework problems, a solutions manual, and class-tested materials, it demonstrates to product development and manufacturing professionals how to distribute key reliability practices throughout an organization. The authors explain how to integrate reliability methods and techniques in the Six Sigma process and Design for Six Sigma (DFSS). They also discuss relationships between warranty and reliability, as well as legal and liability issues. Other topics covered include: Reliability engineering in the 21st Century Probability life distributions for reliability analysis Process control and process capability Failure modes, mechanisms, and effects analysis Health monitoring and prognostics Reliability tests and reliability estimation Reliability Engineering provides a comprehensive list of references on the topics covered in each chapter. It is an invaluable resource for those interested in gaining fundamental knowledge of the practical aspects of reliability in design, manufacturing, and testing. In addition, it is useful for implementation and management of reliability programs.
Book Synopsis Digital Integrated Circuit Design by : Hubert Kaeslin
Download or read book Digital Integrated Circuit Design written by Hubert Kaeslin and published by Cambridge University Press. This book was released on 2008-04-28 with total page 878 pages. Available in PDF, EPUB and Kindle. Book excerpt: This practical, tool-independent guide to designing digital circuits takes a unique, top-down approach, reflecting the nature of the design process in industry. Starting with architecture design, the book comprehensively explains the why and how of digital circuit design, using the physics designers need to know, and no more.
Book Synopsis Practical Reliability Engineering by : Patrick O'Connor
Download or read book Practical Reliability Engineering written by Patrick O'Connor and published by Wiley. This book was released on 1997-02-24 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: This classic textbook/reference contains a complete integration of the processes which influence quality and reliability in product specification, design, test, manufacture and support. Provides a step-by-step explanation of proven techniques for the development and production of reliable engineering equipment as well as details of the highly regarded work of Taguchi and Shainin. New to this edition: over 75 pages of self-assessment questions plus a revised bibliography and references. The book fulfills the requirements of the qualifying examinations in reliability engineering of the Institute of Quality Assurance, UK and the American Society of Quality Control.
Book Synopsis Semiconductor Material and Device Characterization by : Dieter K. Schroder
Download or read book Semiconductor Material and Device Characterization written by Dieter K. Schroder and published by John Wiley & Sons. This book was released on 2015-06-29 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.
Book Synopsis Fundamentals of Semiconductor Manufacturing and Process Control by : Gary S. May
Download or read book Fundamentals of Semiconductor Manufacturing and Process Control written by Gary S. May and published by John Wiley & Sons. This book was released on 2006-05-26 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
Book Synopsis Computer Organization and Design RISC-V Edition by : David A. Patterson
Download or read book Computer Organization and Design RISC-V Edition written by David A. Patterson and published by Morgan Kaufmann. This book was released on 2017-05-12 with total page 700 pages. Available in PDF, EPUB and Kindle. Book excerpt: The new RISC-V Edition of Computer Organization and Design features the RISC-V open source instruction set architecture, the first open source architecture designed to be used in modern computing environments such as cloud computing, mobile devices, and other embedded systems. With the post-PC era now upon us, Computer Organization and Design moves forward to explore this generational change with examples, exercises, and material highlighting the emergence of mobile computing and the Cloud. Updated content featuring tablet computers, Cloud infrastructure, and the x86 (cloud computing) and ARM (mobile computing devices) architectures is included. An online companion Web site provides advanced content for further study, appendices, glossary, references, and recommended reading. Features RISC-V, the first such architecture designed to be used in modern computing environments, such as cloud computing, mobile devices, and other embedded systems Includes relevant examples, exercises, and material highlighting the emergence of mobile computing and the cloud
Book Synopsis VLSI Physical Design: From Graph Partitioning to Timing Closure by : Andrew B. Kahng
Download or read book VLSI Physical Design: From Graph Partitioning to Timing Closure written by Andrew B. Kahng and published by Springer Nature. This book was released on 2022-06-14 with total page 329 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complexity of modern chip design requires extensive use of specialized software throughout the process. To achieve the best results, a user of this software needs a high-level understanding of the underlying mathematical models and algorithms. In addition, a developer of such software must have a keen understanding of relevant computer science aspects, including algorithmic performance bottlenecks and how various algorithms operate and interact. This book introduces and compares the fundamental algorithms that are used during the IC physical design phase, wherein a geometric chip layout is produced starting from an abstract circuit design. This updated second edition includes recent advancements in the state-of-the-art of physical design, and builds upon foundational coverage of essential and fundamental techniques. Numerous examples and tasks with solutions increase the clarity of presentation and facilitate deeper understanding. A comprehensive set of slides is available on the Internet for each chapter, simplifying use of the book in instructional settings. “This improved, second edition of the book will continue to serve the EDA and design community well. It is a foundational text and reference for the next generation of professionals who will be called on to continue the advancement of our chip design tools and design the most advanced micro-electronics.” Dr. Leon Stok, Vice President, Electronic Design Automation, IBM Systems Group “This is the book I wish I had when I taught EDA in the past, and the one I’m using from now on.” Dr. Louis K. Scheffer, Howard Hughes Medical Institute “I would happily use this book when teaching Physical Design. I know of no other work that’s as comprehensive and up-to-date, with algorithmic focus and clear pseudocode for the key algorithms. The book is beautifully designed!” Prof. John P. Hayes, University of Michigan “The entire field of electronic design automation owes the authors a great debt for providing a single coherent source on physical design that is clear and tutorial in nature, while providing details on key state-of-the-art topics such as timing closure.” Prof. Kurt Keutzer, University of California, Berkeley “An excellent balance of the basics and more advanced concepts, presented by top experts in the field.” Prof. Sachin Sapatnekar, University of Minnesota
Book Synopsis Modern Processor Design by : John Paul Shen
Download or read book Modern Processor Design written by John Paul Shen and published by Waveland Press. This book was released on 2013-07-30 with total page 657 pages. Available in PDF, EPUB and Kindle. Book excerpt: Conceptual and precise, Modern Processor Design brings together numerous microarchitectural techniques in a clear, understandable framework that is easily accessible to both graduate and undergraduate students. Complex practices are distilled into foundational principles to reveal the authors insights and hands-on experience in the effective design of contemporary high-performance micro-processors for mobile, desktop, and server markets. Key theoretical and foundational principles are presented in a systematic way to ensure comprehension of important implementation issues. The text presents fundamental concepts and foundational techniques such as processor design, pipelined processors, memory and I/O systems, and especially superscalar organization and implementations. Two case studies and an extensive survey of actual commercial superscalar processors reveal real-world developments in processor design and performance. A thorough overview of advanced instruction flow techniques, including developments in advanced branch predictors, is incorporated. Each chapter concludes with homework problems that will institute the groundwork for emerging techniques in the field and an introduction to multiprocessor systems.
Book Synopsis Carbon Nanotubes for Interconnects by : Aida Todri-Sanial
Download or read book Carbon Nanotubes for Interconnects written by Aida Todri-Sanial and published by Springer. This book was released on 2016-07-09 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
