The Interfacial Reaction and Analysis of W Thin Film on 6H-SiC Annealed in Vacuum, Hydrogen and Argon

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Total Pages : 358 pages
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Book Synopsis The Interfacial Reaction and Analysis of W Thin Film on 6H-SiC Annealed in Vacuum, Hydrogen and Argon by : Thabsile Theodora Thabethe

Download or read book The Interfacial Reaction and Analysis of W Thin Film on 6H-SiC Annealed in Vacuum, Hydrogen and Argon written by Thabsile Theodora Thabethe and published by . This book was released on 2017 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon carbide (SiC) is used as the main diffusion barrier to prevent the fission products (FPs) from escaping in high temperature reactors (HTRs). It retains most of the FPs quite effectively with the exception of silver, strontium and europium. There have also been reports on the reactions between some FPs and SiC, raising some concerns on the integrity of SiC as a coating layer and questioning the ability of SiC as the main diffusion barrier. An additional protective layer of tungsten (W) is proposed to cover the SiC and probably reduce the interaction of FPs with SiC. Coating of SiC layer with W will assist in improving the shielding effect, which will allow for high burn up and enrichment without degrading the SiC. W coatings on SiC are also used for device fabrication. (Thus this study will benefit both semiconductor and nuclear application.) The study was conducted by sputter depositing W metal thin films on 6H-SiC at room temperature (RT). The effect of thermal annealing in vacuum, hydrogen (H2) and argon (Ar) of the W thin film deposited on 6H-SiC was investigated as a function of annealing temperature. The resulting solid-state reactions, phase composition and surface structural modification were investigated using Rutherford backscattering spectrometry (RBS), grazing incidence X-ray diffraction (GIXRD), scanning electron microscopy (SEM) and atomic force microscopy (AFM). The thickness of the as-deposited layer obtained from RUMP simulations was about 73.8 nm and was composed of about 63.4 at.% W and 36.6 at.% O. The oxygen was in a form of tungsten oxide (WO3) mixed in the W thin film. The SEM and AFM images of the as-deposited samples showed that the W thin film had a uniform surface with small grains. The surface roughness (Rrms value) of the as-deposited sample was 0.4 nm. The samples where annealed from 700 °C to 1000 °C for 1h in vacuum, hydrogen (H2), and argon (Ar). From the RBS results, the initial reaction for vacuum annealed samples occurred at 850 °C, for H2 annealed samples it was 700 °C and the Ar annealed had an initial reaction at a temperature lower than 700 °C. In all the annealing atmospheres carbon (C) was found to diffuse faster than Si into the W metal. After this C diffusion reached equilibrium, Si also migrated into the W metal. A reduction of oxygen upon annealing was observed for the vacuum annealed samples. Removal of oxygen was observed for the H2 annealed samples, while oxygen was seen to diffuse to the reaction zone (RZ) for the Ar annealed samples. The phases observed from GIXRD at 700 °C for vacuum annealed samples were CW3 and WC, for H2 samples W5Si3 and WC and for Ar annealed samples W5Si3, WC, SiO2 and W2C. The formation of WSi2 and W2C was observed at 800 °C for H2 samples and 900 °C for vacuum samples. The segregation of Si towards the surface at 1000 °C for H2 samples resulted in the formation of SiO2. The results showed that annealing in different atmospheres reduces the initial reactions and phases formed. SEM and AFM revealed that the samples annealed in Ar were rougher than the vacuum and H2 samples, while the vacuum annealed samples were rougher than the H2 annealed samples. The Rrms of the samples annealed in different atmosphere followed the order: Ar ˃ Vacuum˃ H2. From the SEM and AFM images, the H2 annealed samples at 700 °C were composed of small granules which increased with annealing temperature resulting in the formation of distinct grain boundaries. The samples annealed in Ar at 700 °C were composed of big crystals which were randomly orientated. Increase in annealing temperature for the Ar samples resulted in the parasitic growth of the crystals, which is in line with Wulf’s law. The samples annealed in vacuum at 700 °C formed tungsten oxide nanowires on the W metal surface, with the W metal in a form of granules. Annealing at high temperatures resulted in the removal of the tungsten oxide nanowires on the W metal surface and parasitic growth of the crystals. The difference in the crystal growth observed during the vacuum, H2 and Ar is explained by a crystal growth model.

Electrical & Electronics Abstracts

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ISBN 13 :
Total Pages : 2240 pages
Book Rating : 4.3/5 (243 download)

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Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 2240 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Crystallization and Interfacial Reaction of Amorphous Silicon and Metal Thin Films by Pulsed Excimer Laser Annealing

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ISBN 13 :
Total Pages : 180 pages
Book Rating : 4.:/5 (515 download)

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Book Synopsis Crystallization and Interfacial Reaction of Amorphous Silicon and Metal Thin Films by Pulsed Excimer Laser Annealing by : Connie Lew

Download or read book Crystallization and Interfacial Reaction of Amorphous Silicon and Metal Thin Films by Pulsed Excimer Laser Annealing written by Connie Lew and published by . This book was released on 2002 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Physics Briefs

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ISBN 13 :
Total Pages : 1256 pages
Book Rating : 4.3/5 (91 download)

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Download or read book Physics Briefs written by and published by . This book was released on 1994 with total page 1256 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Nuclear Science Abstracts

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ISBN 13 :
Total Pages : 1256 pages
Book Rating : 4.3/5 (91 download)

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Download or read book Nuclear Science Abstracts written by and published by . This book was released on 1973 with total page 1256 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Aqueous-derived Thin Films and Their Interfacial Interactions with Semiconductor Surfaces

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Total Pages : pages
Book Rating : 4.:/5 (19 download)

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Book Synopsis Aqueous-derived Thin Films and Their Interfacial Interactions with Semiconductor Surfaces by : Milana Cherie Thomas

Download or read book Aqueous-derived Thin Films and Their Interfacial Interactions with Semiconductor Surfaces written by Milana Cherie Thomas and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Metal oxide systems are well known for their high dielectric constants, which are important for advanced microelectronics applications. The microelectronics industry currently employs vacuum-based techniques, such as chemical vapor deposition (CVD), to deposit metal oxide films. These vapor-phase deposition techniques suffer due to their slow deposition rates and their use of expensive equipment. Additionally, these processes sometimes require the use of harmful source gases and/or generate corrosive by-products. On the other hand, solution-processed thin films fabricated by spin-coating are advantageous because the process is simple, low cost, and scalable. Aqueous solution deposition is particularly attractive because it offers a green alternative to vapor-phase deposition and has been shown to produce uniform thin films by spin coating on hydrophilic silicon surfaces. However, it has been shown that silicon's native oxide can degrade device performance due to its electronic interfacial states. In addition, aqueousderived thin films suffer from poor electrical performance due to mobile water and hydroxyl protons, often requiring very high temperature anneals to mitigate. Such anneals compromise the interface between the film and the silicon substrate, hence the electrical performance. One effective method to control the interface, and thus improve device performance, is to functionalize the semiconductor surface using wet chemistry. Here, we address the concerns of aqueous thin film deposition and present a method for alleviating the issues associated with current silicon-silicon oxide devices. We use wet chemical functionalization to graft selfassembled monolayers (SAMs) onto oxide-free silicon, then spin-coat an aqueous thin film on top of the SAM layer. The chemical stability of the SAM and the changes that occur at the interfaces between the Si/SAM/film stack during film deposition and dehydration are monitored by in situ Fourier transform infrared spectroscopy (FTIR) and ex situ X-ray photoelectron spectroscopy (XPS). The modification of the Si/SAM interface is studied as a function of annealing temperature, with electrical measurements used as a metric to quantify the effectiveness of the SAM layer to alleviate issues of interfacial defects observed for films on silicon oxide. The results are presented in three parts: (1) a dehydration study of aqueous-derived thin films deposited on silicon oxide, (2) the synthesis of a novel SAM interfacial layer tailored to accommodate aqueous, Al-based precursors and (3) a study to quantify the effectiveness, if any, on the SAM interfacial layer through electrical characterization methods. In the first part, we investigate the mechanism for dehydration of aqueous thin films and present a method to enhance the removal of water from the films. Using in situ FTIR, we find that the addition of a protective capping layer can enhance the dehydration of the thin film and prevent water reabsorption for a period of up to 14 days. In the second part, we present hydrosilylation methods to graft SAMs onto oxide-free silicon surfaces. The results show that it is possible to covalently attach the SAMs to silicon, evidenced by the formation of Si-C (detected by XPS) at the interface between the Si and the SAM. Four phosphonic acid-terminated SAMs are prepared and contact angle measurements are used as a metric for evaluating which can best accommodate aqueous spin-coater solutions. To conclude, we investigate the interface between the SAM layer and an aluminum-based thin film derived from aqueous precursor solutions. Current-voltage and capacitance-voltage measurements are used to quantify the effectiveness of the SAM layer.

International Aerospace Abstracts

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ISBN 13 :
Total Pages : 980 pages
Book Rating : 4.F/5 ( download)

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Download or read book International Aerospace Abstracts written by and published by . This book was released on 1998 with total page 980 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Investigating the Interfacial Dynamics of Thin Films

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ISBN 13 :
Total Pages : 342 pages
Book Rating : 4.:/5 (618 download)

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Book Synopsis Investigating the Interfacial Dynamics of Thin Films by : Aaron W. Rosenbaum

Download or read book Investigating the Interfacial Dynamics of Thin Films written by Aaron W. Rosenbaum and published by . This book was released on 2005 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Applied Science & Technology Index

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ISBN 13 :
Total Pages : 1628 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Applied Science & Technology Index by :

Download or read book Applied Science & Technology Index written by and published by . This book was released on 1996 with total page 1628 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Summaries of Reports of the Electrotechnical Laboratory

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ISBN 13 :
Total Pages : 98 pages
Book Rating : 4.:/5 (31 download)

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Book Synopsis Summaries of Reports of the Electrotechnical Laboratory by : Denki Shikenjo (Japan)

Download or read book Summaries of Reports of the Electrotechnical Laboratory written by Denki Shikenjo (Japan) and published by . This book was released on 2000 with total page 98 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Interfacial Phenomena in Vacuum-encapsulated Micro and Nano-structures

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Total Pages : pages
Book Rating : 4.:/5 (756 download)

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Book Synopsis Interfacial Phenomena in Vacuum-encapsulated Micro and Nano-structures by : Shingo Yoneoka

Download or read book Interfacial Phenomena in Vacuum-encapsulated Micro and Nano-structures written by Shingo Yoneoka and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: In the micro and nano-scale regimes, the physical phenomena stemmed from interfaces are becoming non-negligible. These phenomena are important in micro and nanoelectromechanical systems (M/NEMS) as reliability issues such as fatigue, adhesion, friction, and charging, are highly influenced by their surface conditions. However, the understandings of interfacial phenomena in micro and nano-structures are currently limited to specific materials and environments, which prevents the improvement in performance of M/NEMS devices. This dissertation aims to enhance and understand the surfaces of M/NEMS through three individual works. The contributions of each work include the development of reproducible fabrication processes that incorporate novel materials, design of test structures, and material characterization. The first part of this dissertation presents bulk and surface micromachining processes to fabricate freestanding structures formed by atomic layer deposition (ALD). Incorporating U-shape trenches, freestanding structures that have> 4000:1 aspect ratios are successfully fabricated with ~12-nm thick ALD platinum (Pt) and aluminum oxide (Al2O3) films. The structures fabricated by the developed processes can provide noteworthy combinations of electrical, thermal, and mechanical properties that will be useful for many applications. With ALD-grown freestanding structures that are fabricated by these technologies, the electrical and thermal conductivities of ALD Pt films of thickness 7.3, 9.8, and 12.1 nm are measured at 50-320 K. Conductivity data for the 7.3-nm film are reduced by 77.8% (electrical) and 66.3% (thermal) compared to bulk values due to the electron scattering at interfaces and grain boundaries. The experimental Lorenz numbers of ALD Pt films exceed the bulk value due to phonon conduction. Finally, based on the developed processes and measured material properties, microbolometer pixels and arrays made of ALD Pt/Al2O3 films are demonstrated. The thermal time constants of the fabricated microbolometer pixels with 50 x 50- and 25 x 25-[Mu]m absorbers are 1.97 and 0.43 ms respectively, which are [greater than] 7.6 times smaller than conventional VOx microbolometers. The noise equivalent temperature difference of the 50 x 50-[Mu]m bolometer is 116 mK, assuming f/1.0 optics and negligible 1/f noise. The second part reports on the first study of fatigue in single crystal silicon (SCS) and Si-SiO2 composite micromechanical resonators fabricated in an extremely clean and controlled environment using an epi-seal encapsulation technology. This packaging technology provides a unique opportunity to investigate controversial issues in silicon fatigue since the surfaces of devices are not exposed to air, oxygen, or other residues that might complicate the initiation and observation of fatigue. Fatigue experiments are conducted on 42 devices over 10^9 actuation cycles with various dynamic loadings ranging from 0.2 to 4.0 GPa at 29-32°C and from 0.2 to 1.2 GPa at 273-290°C. However, no device failure due to the high cyclic fatigue has been observed. This is also true for Si-SiO2 composite. SCS devices that were annealed in hydrogen at [greater than] 925°C do not show fatigue up to 2.5 x 10^9 cycles with 4.0-GPa stress amplitude for the 110 direction and 2.1 x 10^9 cycles with 1.5-GPa stress amplitude for the 100 directions at room temperature. Si-SiO2 composite devices could withstand 5 x 10^9 cycles with 2.5-GPa stress amplitude. Although the experimental results could not verify the fatigue mechanism of silicon, these results could be applicable to ensure the reliability of silicon M/NEMS devices. The last part describes the fabrication and characterization of a polycrystalline 3C silicon carbide (poly-SiC) thin film encapsulation process. In this fabrication technique, devices are sealed with a nominally 2-[Mu]m poly-SiC and the device layer is simultaneously coated with a nominally 0.2-[Mu]m poly-SiC thin film. Device characterization includes the measurement of the resonant frequencies and quality factors of double-ended tuning fork micromechanical resonators, which have Si-SiC composite beam structures. Experimental results show that the pressure inside the packaging can be controlled from 447 Pa to 15.5 kPa with a 400°C annealing process. The frequency drifts of the encapsulated resonators are less than the frequency noise level measured over 29 days at 84.6°C ± 0.1°C, which suggests that the poly-SiC thin film packaging technique can offer hermetic packaging for various applications in M/NEMS including inertial sensors. In addition to the packaging performance, the temperature coefficient of Young's modulus for poly-SiC is derived from the resonant frequency changes with temperature. Reduction of the quality factor due to the poly-SiC coating, predicted in the theoretical model, is confirmed by measurements.

Metals Abstracts

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Total Pages : 740 pages
Book Rating : 4.3/5 (91 download)

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Download or read book Metals Abstracts written by and published by . This book was released on 1996 with total page 740 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Bell Laboratories Talks and Papers

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Total Pages : 430 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Bell Laboratories Talks and Papers by : Bell Telephone Laboratories. Libraries and Information Systems Center

Download or read book Bell Laboratories Talks and Papers written by Bell Telephone Laboratories. Libraries and Information Systems Center and published by . This book was released on 1973 with total page 430 pages. Available in PDF, EPUB and Kindle. Book excerpt:

INIS Atomindex

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Total Pages : 948 pages
Book Rating : 4.:/5 (319 download)

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Download or read book INIS Atomindex written by and published by . This book was released on 1988 with total page 948 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Interfacial Reaction in A-Si/Au and A-Si/Cu Thin Film Bilayers

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Total Pages : 5 pages
Book Rating : 4.:/5 (929 download)

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Book Synopsis Interfacial Reaction in A-Si/Au and A-Si/Cu Thin Film Bilayers by :

Download or read book Interfacial Reaction in A-Si/Au and A-Si/Cu Thin Film Bilayers written by and published by . This book was released on 1992 with total page 5 pages. Available in PDF, EPUB and Kindle. Book excerpt:

BTL Talks and Papers

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ISBN 13 :
Total Pages : 876 pages
Book Rating : 4.:/5 (31 download)

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Book Synopsis BTL Talks and Papers by : Bell Telephone Laboratories, inc. Technical Information Libraries

Download or read book BTL Talks and Papers written by Bell Telephone Laboratories, inc. Technical Information Libraries and published by . This book was released on 1973 with total page 876 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Advancing Silicon Carbide Electronics Technology I

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Publisher : Materials Research Forum LLC
ISBN 13 : 1945291842
Total Pages : 250 pages
Book Rating : 4.9/5 (452 download)

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Book Synopsis Advancing Silicon Carbide Electronics Technology I by : Konstantinos Zekentes

Download or read book Advancing Silicon Carbide Electronics Technology I written by Konstantinos Zekentes and published by Materials Research Forum LLC. This book was released on 2018-09-25 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: The rapidly advancing Silicon Carbide technology has a great potential in high temperature and high frequency electronics. High thermal stability and outstanding chemical inertness make SiC an excellent material for high-power, low-loss semiconductor devices. The present volume presents the state of the art of SiC device fabrication and characterization. Topics covered include: SiC surface cleaning and etching techniques; electrical characterization methods and processing of ohmic contacts to silicon carbide; analysis of contact resistivity dependence on material properties; limitations and accuracy of contact resistivity measurements; ohmic contact fabrication and test structure design; overview of different metallization schemes and processing technologies; thermal stability of ohmic contacts to SiC, their protection and compatibility with device processing; Schottky contacts to SiC; Schottky barrier formation; Schottky barrier inhomogeneity in SiC materials; technology and design of 4H-SiC Schottky and Junction Barrier Schottky diodes; Si/SiC heterojunction diodes; applications of SiC Schottky diodes in power electronics and temperature/light sensors; high power SiC unipolar and bipolar switching devices; different types of SiC devices including material and technology constraints on device performance; applications in the area of metal contacts to silicon carbide; status and prospects of SiC power devices.