The Elfnet Book On Failure Mechanisms Testing Methods And Quality Issues Of Lead Free Solder Interconnects

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The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Author : Günter Grossmann
Publisher : Springer Science & Business Media
ISBN 13 : 0857292366
Total Pages : 313 pages
Book Rating : 4.8/5 (572 download)

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Book Synopsis The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects by : Günter Grossmann

Download or read book The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects written by Günter Grossmann and published by Springer Science & Business Media. This book was released on 2011-05-12 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.

Humidity and Electronics

Author : Rajan Ambat
Publisher : Woodhead Publishing
ISBN 13 : 0323908543
Total Pages : 399 pages
Book Rating : 4.3/5 (239 download)

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Book Synopsis Humidity and Electronics by : Rajan Ambat

Download or read book Humidity and Electronics written by Rajan Ambat and published by Woodhead Publishing. This book was released on 2021-11-30 with total page 399 pages. Available in PDF, EPUB and Kindle. Book excerpt: Humidity and Electronics: Corrosion Reliability Issues and Preventive Measures provides comprehensive information on humidity related corrosion reliability issues surrounding electronics and how to tackle potential issues from a pro-active-design-prevention perspective. The book contains a mix of academic and industrial relevance, making it suitable for a detailed understanding on humidity issues on electronics, both for materials and corrosion experts and electronics and electrical experts. It will be useful for researchers, academics, and industrial personals involved in materials, corrosion, and electronics reliability aspects. Provides basic and applied knowledge surrounding corrosion in electronics Combines electronics/electrical and electrochemical aspects related to failure modes and mechanisms Presents knowledge on influencing factors and how they can be used as preventive measures at the material, component, device and system level

Fundamentals of Lead-Free Solder Interconnect Technology

Author : Tae-Kyu Lee
Publisher : Springer
ISBN 13 : 1461492661
Total Pages : 266 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Fundamentals of Lead-Free Solder Interconnect Technology by : Tae-Kyu Lee

Download or read book Fundamentals of Lead-Free Solder Interconnect Technology written by Tae-Kyu Lee and published by Springer. This book was released on 2014-11-05 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Corrosion Science: Modern Trends and Applications

Author : N. Suresh Kumar
Publisher : Bentham Science Publishers
ISBN 13 : 9811481814
Total Pages : 230 pages
Book Rating : 4.8/5 (114 download)

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Book Synopsis Corrosion Science: Modern Trends and Applications by : N. Suresh Kumar

Download or read book Corrosion Science: Modern Trends and Applications written by N. Suresh Kumar and published by Bentham Science Publishers. This book was released on 2021-05-24 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt: The advent of Industry 4.0 has opened a data-rich avenue of predicting and controlling premature degradation of industrial materials. For any industrial construction or manufacturing projects, performing analysis on the structural integrity of materials is crucial for their sustainability. Corrosion Science: Modern Trends and Applications gives scholars a snapshot of recent contributions and development in the field of material corrosion. The book presents 12 chapters that cover topics such as corrosion testing methods, anti-corrosive coating mechanisms, corrosion in different types of products (electronics, polymers), industrial systems (power plants, concrete constructions, and hydraulic systems), and corrosion as a result of environmental characteristics (such as marine surroundings). The breadth of topics covered coupled with the reader-friendly presentation of the book make it highly beneficial for students, research scholars, faculty members, and R&D specialists working in the area of corrosion science, material science, solid-state science, chemical engineering, and nanotechnology. Readers will be equipped with the knowledge to understand and plan industrial processes that involve measuring the reliability and integrity of material structures which are impacted by corrosive factors.

Lead-Free Solder Interconnect Reliability

Author : Dongkai Shangguan
Publisher : ASM International
ISBN 13 : 161503093X
Total Pages : 292 pages
Book Rating : 4.6/5 (15 download)

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Book Synopsis Lead-Free Solder Interconnect Reliability by : Dongkai Shangguan

Download or read book Lead-Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Assembly and Reliability of Lead-Free Solder Joints

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811539200
Total Pages : 545 pages
Book Rating : 4.8/5 (115 download)

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Book Synopsis Assembly and Reliability of Lead-Free Solder Joints by : John H. Lau

Download or read book Assembly and Reliability of Lead-Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Lead Free Solder

Author :
Publisher : Springer
ISBN 13 : 9781461404644
Total Pages : 188 pages
Book Rating : 4.4/5 (46 download)

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Book Synopsis Lead Free Solder by :

Download or read book Lead Free Solder written by and published by Springer. This book was released on 2011-10-15 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt:

A Guide to Lead-free Solders

Author : John W. Evans
Publisher : Springer Science & Business Media
ISBN 13 : 1846283108
Total Pages : 212 pages
Book Rating : 4.8/5 (462 download)

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Book Synopsis A Guide to Lead-free Solders by : John W. Evans

Download or read book A Guide to Lead-free Solders written by John W. Evans and published by Springer Science & Business Media. This book was released on 2007-01-05 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.

Lead-Free Solder Process Development

Author : Gregory Henshall
Publisher : John Wiley & Sons
ISBN 13 : 1118102746
Total Pages : 241 pages
Book Rating : 4.1/5 (181 download)

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Book Synopsis Lead-Free Solder Process Development by : Gregory Henshall

Download or read book Lead-Free Solder Process Development written by Gregory Henshall and published by John Wiley & Sons. This book was released on 2011-03-29 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.

Lead-free Solders

Author : K. Subramanian
Publisher : John Wiley & Sons
ISBN 13 : 1119966809
Total Pages : 510 pages
Book Rating : 4.1/5 (199 download)

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Book Synopsis Lead-free Solders by : K. Subramanian

Download or read book Lead-free Solders written by K. Subramanian and published by John Wiley & Sons. This book was released on 2012-03-06 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

Test Procedures for Developing Solder Data

Author : T. A. Siewert
Publisher : National Institute of Standards & Technology
ISBN 13 : 9780160677342
Total Pages : 31 pages
Book Rating : 4.6/5 (773 download)

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Book Synopsis Test Procedures for Developing Solder Data by : T. A. Siewert

Download or read book Test Procedures for Developing Solder Data written by T. A. Siewert and published by National Institute of Standards & Technology. This book was released on 2002 with total page 31 pages. Available in PDF, EPUB and Kindle. Book excerpt: Prepared by the NEMI Task Group on Lead-Free Alloys and Reliability. Documents standardized test procedures that can produce valid and reproducible mechanical-property data for lead-free solders.

Lead-Free Soldering

Author : Jasbir Bath
Publisher : Springer Science & Business Media
ISBN 13 : 0387684220
Total Pages : 307 pages
Book Rating : 4.3/5 (876 download)

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Book Synopsis Lead-Free Soldering by : Jasbir Bath

Download or read book Lead-Free Soldering written by Jasbir Bath and published by Springer Science & Business Media. This book was released on 2007-06-26 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Author : Karl J. Puttlitz
Publisher : CRC Press
ISBN 13 : 082475249X
Total Pages : 1044 pages
Book Rating : 4.8/5 (247 download)

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Book Synopsis Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by : Karl J. Puttlitz

Download or read book Handbook of Lead-Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Mechanics of Solder Alloy Interconnects

Author : Darrel R. Frear
Publisher : Springer Science & Business Media
ISBN 13 : 9780442015053
Total Pages : 434 pages
Book Rating : 4.0/5 (15 download)

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Book Synopsis Mechanics of Solder Alloy Interconnects by : Darrel R. Frear

Download or read book Mechanics of Solder Alloy Interconnects written by Darrel R. Frear and published by Springer Science & Business Media. This book was released on 1994-01-31 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Lead Free Solders

Author : Abhijit Kar
Publisher :
ISBN 13 : 9781839622786
Total Pages : 94 pages
Book Rating : 4.6/5 (227 download)

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Book Synopsis Lead Free Solders by : Abhijit Kar

Download or read book Lead Free Solders written by Abhijit Kar and published by . This book was released on 2019 with total page 94 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.

Solder Joint Reliability

Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 9780442002602
Total Pages : 156 pages
Book Rating : 4.0/5 (26 download)

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Book Synopsis Solder Joint Reliability by : John H. Lau

Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 1991-05-31 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR

Reflow Soldering Processes

Author : Ning-Cheng Lee
Publisher : Newnes
ISBN 13 : 0750672188
Total Pages : 282 pages
Book Rating : 4.7/5 (56 download)

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Book Synopsis Reflow Soldering Processes by : Ning-Cheng Lee

Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process