Study of Selective CVD Tungsten as a Diffusion Barrier for Electroless Copper Depositions

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ISBN 13 :
Total Pages : 96 pages
Book Rating : 4.E/5 ( download)

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Book Synopsis Study of Selective CVD Tungsten as a Diffusion Barrier for Electroless Copper Depositions by : Yeeli Lee

Download or read book Study of Selective CVD Tungsten as a Diffusion Barrier for Electroless Copper Depositions written by Yeeli Lee and published by . This book was released on 1994 with total page 96 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Metals Abstracts

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ISBN 13 :
Total Pages : 1042 pages
Book Rating : 4.E/5 ( download)

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Metals Abstracts Index

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ISBN 13 :
Total Pages : 1622 pages
Book Rating : 4.3/5 (91 download)

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Electrochemistry in Molecular and Microscopic Dimensions

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Publisher : Elsevier
ISBN 13 : 9780444515599
Total Pages : 572 pages
Book Rating : 4.5/5 (155 download)

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Book Synopsis Electrochemistry in Molecular and Microscopic Dimensions by : International Society of Electrochemistry. Meeting

Download or read book Electrochemistry in Molecular and Microscopic Dimensions written by International Society of Electrochemistry. Meeting and published by Elsevier. This book was released on 2003-12-18 with total page 572 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a hard bound edition of a special issue (vol. 48/20-22) of the journal Electrochimica Acta. It summarizes the highlights of the 53rd Annual meeting of the International Society of Electrochemistry and Annual meeting of the GDCh-Fachgruppe Angewandte Elektrochemie. The theme of the conference was Electrochemistry in Molecular and Microscopic dimensions and was based on the role of electrochemistry in the miniaturization of chemical and physical methods. Topics covered are : - development of electrochemistry with microscopic and molecular resolution; - initiation of advances in Electrochemical Microsystem Technologies EMT, and micro/nano-electronics; - development of Electrochemical Materials Science for nanomaterials; - enhancement of miniaturization and sensitivity of electroanalysis, and; - the bridge from electrochemistry to biology and medicine of microscopic and molecular understanding. - Summarizes the highlights of two major electrochemistry meetings. - It includes research papers on the electrochemical processes in micro- and nanotechnology. - Highlights developments and advances in electrochemistry.

Microelectronic Packaging

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Publisher : CRC Press
ISBN 13 : 020347368X
Total Pages : 564 pages
Book Rating : 4.2/5 (34 download)

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Book Synopsis Microelectronic Packaging by : M. Datta

Download or read book Microelectronic Packaging written by M. Datta and published by CRC Press. This book was released on 2004-12-20 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Eighth International IEEE VLSI Multilevel Interconnection Conference, 1991

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Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 478 pages
Book Rating : 4.X/5 (2 download)

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Book Synopsis Eighth International IEEE VLSI Multilevel Interconnection Conference, 1991 by : IEEE Electron Devices Society

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Japanese Journal of Applied Physics

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ISBN 13 :
Total Pages : 916 pages
Book Rating : 4.3/5 (91 download)

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Reliabilty [sic] Issues in Copper Metallization for VLSI

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ISBN 13 :
Total Pages : 268 pages
Book Rating : 4.E/5 ( download)

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Book Synopsis Reliabilty [sic] Issues in Copper Metallization for VLSI by : Aatish N. Dedhia

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Proceedings

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ISBN 13 :
Total Pages : 504 pages
Book Rating : 4.3/5 (91 download)

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Download or read book Proceedings written by and published by . This book was released on 1990 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Metallization

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Publisher : Butterworth-Heinemann
ISBN 13 :
Total Pages : 268 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Metallization by : S. P. Murarka

Download or read book Metallization written by S. P. Murarka and published by Butterworth-Heinemann. This book was released on 1993 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.

Tungsten and Other Advanced Metals for ULSI Applications in 1990: Volume 6

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Publisher : Mrs Conference Proceedings
ISBN 13 :
Total Pages : 422 pages
Book Rating : 4.0/5 ( download)

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Book Synopsis Tungsten and Other Advanced Metals for ULSI Applications in 1990: Volume 6 by : Gregory C. Smith

Download or read book Tungsten and Other Advanced Metals for ULSI Applications in 1990: Volume 6 written by Gregory C. Smith and published by Mrs Conference Proceedings. This book was released on 1991-03 with total page 422 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Electrical & Electronics Abstracts

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Publisher :
ISBN 13 :
Total Pages : 2092 pages
Book Rating : 4.3/5 (243 download)

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Handbook of Deposition Technologies for Films and Coatings

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Publisher : William Andrew
ISBN 13 : 0815520328
Total Pages : 932 pages
Book Rating : 4.8/5 (155 download)

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Book Synopsis Handbook of Deposition Technologies for Films and Coatings by : Peter M. Martin

Download or read book Handbook of Deposition Technologies for Films and Coatings written by Peter M. Martin and published by William Andrew. This book was released on 2009-12-01 with total page 932 pages. Available in PDF, EPUB and Kindle. Book excerpt: This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.

Chemical Abstracts

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ISBN 13 :
Total Pages : 2540 pages
Book Rating : 4.3/5 (91 download)

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Download or read book Chemical Abstracts written by and published by . This book was released on 2002 with total page 2540 pages. Available in PDF, EPUB and Kindle. Book excerpt:

1991 Symposium on VLSI Technology

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ISBN 13 :
Total Pages : 142 pages
Book Rating : 4.:/5 (318 download)

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Download or read book 1991 Symposium on VLSI Technology written by and published by . This book was released on 1991 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12

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ISBN 13 :
Total Pages : 640 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12 by : Robert Havemann

Download or read book Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12 written by Robert Havemann and published by . This book was released on 1997 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Physics Briefs

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ISBN 13 :
Total Pages : 1256 pages
Book Rating : 4.3/5 (91 download)

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Download or read book Physics Briefs written by and published by . This book was released on 1994 with total page 1256 pages. Available in PDF, EPUB and Kindle. Book excerpt: