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Special Section On 50th Electronic Components And Technology Conference
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Book Synopsis Special Section on 50th Electronic Components and Technology Conference by : Electronic Components and Technology Conference
Download or read book Special Section on 50th Electronic Components and Technology Conference written by Electronic Components and Technology Conference and published by . This book was released on 2001 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 50th Electronic Components and Technology Conference by : Michael F. Caggiano
Download or read book 50th Electronic Components and Technology Conference written by Michael F. Caggiano and published by . This book was released on 2001 with total page 24 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 50th ECTC written by Robert Boudreau and published by . This book was released on 2001 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Special Section from the 48th Electronic Components and Technology Conference by : Peter J. Krusius
Download or read book Special Section from the 48th Electronic Components and Technology Conference written by Peter J. Krusius and published by . This book was released on 1999 with total page 35 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :IEEE Components, Packaging and Manufacturing Technology Society Staff Publisher : ISBN 13 : Total Pages : pages Book Rating :4.:/5 (131 download)
Book Synopsis 2000 50th Electronic Components and Technology Conference by : IEEE Components, Packaging and Manufacturing Technology Society Staff
Download or read book 2000 50th Electronic Components and Technology Conference written by IEEE Components, Packaging and Manufacturing Technology Society Staff and published by . This book was released on 2000 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2000 Proceedings written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2000 with total page 1756 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work on electronic components and technology covers topics such as advanced packaging, connectors and contacts, interconnections, manufacturing technology, materials and processing, modeling and simulation, and optoelectronics.
Book Synopsis Contributions from the 51st Electronic Components and Technology Conference by : Electronic Components and Technology Conference
Download or read book Contributions from the 51st Electronic Components and Technology Conference written by Electronic Components and Technology Conference and published by . This book was released on 2002 with total page 117 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2000 Proceedings written by and published by IEEE Standards Office. This book was released on 2000 with total page 1756 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work on electronic components and technology covers topics such as advanced packaging, connectors and contacts, interconnections, manufacturing technology, materials and processing, modeling and simulation, and optoelectronics.
Book Synopsis IC Component Sockets by : Weifeng Liu
Download or read book IC Component Sockets written by Weifeng Liu and published by John Wiley & Sons. This book was released on 2004-03-25 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: A broad and practical reference to IC socket technology The first and only comprehensive resource on IC (Integrated Circuit) socket technology, IC Component Sockets offers a complete overview of socket technology and design in order to provide engineers and their managers with a good understanding of these specialized technologies and the processes for evaluating them. The authors, both acknowledged experts in the field, address all relevant aspects of the subject-including materials, design, performance characteristics, failure modes and mechanisms, and qualification and reliability assessment-with emphasis on the technology's inherent advantages and challenges. Topics of interest include: * Socket design and contact technologies * Performance characteristics and material properties * Contact failure modes and mechanisms * Qualification testing conditions * Qualification sequences and setup * IEEE prediction methodology * Theoretical calculation of contact reliability Including a list of standards and specifications, this book is an important and timely resource for today's electronics engineers concerned with evaluating and perfecting socket design, manufacture, and use.
Book Synopsis Moisture Sensitivity of Plastic Packages of IC Devices by : X.J. Fan
Download or read book Moisture Sensitivity of Plastic Packages of IC Devices written by X.J. Fan and published by Springer Science & Business Media. This book was released on 2010-07-23 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Book Synopsis Power Electronic Packaging by : Yong Liu
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Book Synopsis Integrative Production Technology for High-Wage Countries by : Christian Brecher
Download or read book Integrative Production Technology for High-Wage Countries written by Christian Brecher and published by Springer Science & Business Media. This book was released on 2011-12-17 with total page 1118 pages. Available in PDF, EPUB and Kindle. Book excerpt: Industrial production in high-wage countries like Germany is still at risk. Yet, there are many counter-examples in which producing companies dominate their competitors by not only compensating for their specific disadvantages in terms of factor costs (e.g. wages, energy, duties and taxes) but rather by minimising waste using synchronising integrativity as well as by obtaining superior adaptivity on alternating conditions. In order to respond to the issue of economic sustainability of industrial production in high-wage countries, the leading production engineering and material research scientists of RWTH Aachen University together with renowned companies have established the Cluster of Excellence “Integrative Production Technology for High-Wage Countries”. This compendium comprises the cluster’s scientific results as well as a selection of business and technology cases, in which these results have been successfully implemented into industrial practice in close cooperation with more than 30 companies of the industrial production sector.
Book Synopsis Advances in Dielectric Materials and Electronic Devices by : K. M. Nair
Download or read book Advances in Dielectric Materials and Electronic Devices written by K. M. Nair and published by John Wiley & Sons. This book was released on 2012-04-11 with total page 323 pages. Available in PDF, EPUB and Kindle. Book excerpt: This proceedings contains papers presented at the Advanced Dielectric Materials: Design, Preparation, Processing and Applications; and Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing-microstructure-property relationship, multilayer device materials, thin and thick films, device applications, low temperature co-fired ceramics (LTCC)for multilayer devices, microwave dielectric materials and much more.
Book Synopsis Advances in Embedded and Fan-Out Wafer Level Packaging Technologies by : Beth Keser
Download or read book Advances in Embedded and Fan-Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-20 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 1007 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Book Synopsis Index to IEEE Publications by : Institute of Electrical and Electronics Engineers
Download or read book Index to IEEE Publications written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1996 with total page 1260 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials for Advanced Packaging by : Daniel Lu
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
