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Author : Mihaela Ana Balseanu
Publisher :
ISBN 13 :
Total Pages : 408 pages
Book Rating : 4.E/5 ( download)
Download or read book Silicon-on-silicon System Packaging written by Mihaela Ana Balseanu and published by . This book was released on 2003 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John W. Balde
Publisher : Springer Science & Business Media
ISBN 13 : 1461502314
Total Pages : 357 pages
Book Rating : 4.4/5 (615 download)
Download or read book Foldable Flex and Thinned Silicon Multichip Packaging Technology written by John W. Balde and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 357 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119314135
Total Pages : 576 pages
Book Rating : 4.1/5 (193 download)
Download or read book Advances in Embedded and Fan-Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-12 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author :
Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author : Henry Helvajian
Publisher : AIAA
ISBN 13 : 9781884989032
Total Pages : 748 pages
Book Rating : 4.9/5 (89 download)
Download or read book Microengineering Aerospace Systems written by Henry Helvajian and published by AIAA. This book was released on 1999 with total page 748 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microengineering Aerospace Systems is a textbook tutorial encompassing MEMS (micro-electromechanical systems), nanoelectronics, packaging, processing, and materials characterization for developing miniaturized smart instruments for aerospace systems (i.e., ASIM application-specific integrated microinstrument), satellites, and satellite subsystems. Third in a series of Aerospace Press publications covering this rapidly advancing technology, this work presents fundamental aspects of the technology and specific aerospace systems applications through worked examples.
Author : Yufeng Jin
Publisher : CRC Press
ISBN 13 : 1351832972
Total Pages : 233 pages
Book Rating : 4.3/5 (518 download)
Download or read book Introduction to Microsystem Packaging Technology written by Yufeng Jin and published by CRC Press. This book was released on 2017-12-19 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Author : Nirod K. Das
Publisher : Springer Science & Business Media
ISBN 13 : 1489914803
Total Pages : 410 pages
Book Rating : 4.4/5 (899 download)
Download or read book Directions for the Next Generation of MMIC Devices and Systems written by Nirod K. Das and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the 1996 WRI International Symposium held in New York City, September 11-13, 1996
Author : Markku Tilli
Publisher : Elsevier
ISBN 13 : 012817787X
Total Pages : 1028 pages
Book Rating : 4.1/5 (281 download)
Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by Elsevier. This book was released on 2020-04-17 with total page 1028 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
Author :
Publisher : DIANE Publishing
ISBN 13 : 1457816083
Total Pages : 266 pages
Book Rating : 4.4/5 (578 download)
Download or read book Certain Silicon Microphone Packages and Products Containing the Same, Inv. 337-TA-629 written by and published by DIANE Publishing. This book was released on with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : R.F. Wolffenbuttel
Publisher : Springer Science & Business Media
ISBN 13 : 9780412709708
Total Pages : 344 pages
Book Rating : 4.7/5 (97 download)
Download or read book Silicon Sensors and Circuits written by R.F. Wolffenbuttel and published by Springer Science & Business Media. This book was released on with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Kirtiraj K. Gaikwad
Publisher : CRC Press
ISBN 13 : 1000917851
Total Pages : 349 pages
Book Rating : 4.0/5 (9 download)
Download or read book Novel Packaging Systems for Fruits and Vegetables written by Kirtiraj K. Gaikwad and published by CRC Press. This book was released on 2024-07-05 with total page 349 pages. Available in PDF, EPUB and Kindle. Book excerpt: This new volume provides a comprehensive overview of the new and diverse technologies in food packaging of fruits and vegetables, providing an emphasis on new commercially available packaging technologies for fresh produce. The book first looks at important biopolymeric films for fresh produce packaging along with a historical overview, followed by coverage of the mechanical, physical, and permeability properties and recent developments in investigative techniques of biopolymers as well as their applications in modified atmosphere packaging used in fresh produce packaging. The volume then discusses the detailed application of natural/organic active agents, including oxygen scavengers, ethylene scavengers, antioxidants, antimicrobial agents, etc., for the fabrication of active packaging for maintaining the quality of fresh produce during storage and transportation. Chapters cover active (antimicrobial, antioxidant) edible films and coatings used to preserve the quality of fresh produce. Protective packaging, package designing aspects, and safety and security packaging for agricultural produce in the supply chain are also explored. Also considered are intelligent packaging technologies that monitor the condition of packaged food using data carriers, indicators, and sensors. Novel Packaging Systems for Fruits and Vegetables provides a thorough presentation of the most important and innovative technologies for the packaging and safety of fruits and vegetables. This volume will be valuable for advanced students as well as for faculty, researchers, and industry professionals in food science and engineering, packaging technology, and postharvest technology.
Download or read book Advanced Packaging written by and published by . This book was released on 2007-10 with total page 44 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Author :
Publisher :
ISBN 13 :
Total Pages : 412 pages
Book Rating : 4.3/5 (91 download)
Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1978 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Muhannad S. Bakir
Publisher : Artech House
ISBN 13 : 1596932473
Total Pages : 551 pages
Book Rating : 4.5/5 (969 download)
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Author : Franco Maloberti
Publisher : John Wiley & Sons
ISBN 13 : 047074555X
Total Pages : 694 pages
Book Rating : 4.4/5 (77 download)
Download or read book Understanding Microelectronics written by Franco Maloberti and published by John Wiley & Sons. This book was released on 2011-12-12 with total page 694 pages. Available in PDF, EPUB and Kindle. Book excerpt: The microelectronics evolution has given rise to many modern benefits but has also changed design methods and attitudes to learning. Technology advancements shifted focus from simple circuits to complex systems with major attention to high-level descriptions. The design methods moved from a bottom-up to a top-down approach. For today’s students, the most beneficial approach to learning is this top-down method that demonstrates a global view of electronics before going into specifics. Franco Maloberti uses this approach to explain the fundamentals of electronics, such as processing functions, signals and their properties. Here he presents a helpful balance of theory, examples, and verification of results, while keeping mathematics and signal processing theory to a minimum. Key features: Presents a new learning approach that will greatly improve students’ ability to retain key concepts in electronics studies Match the evolution of Computer Aided Design (CAD) which focuses increasingly on high-level design Covers sub-functions as well as basic circuits and basic components Provides real-world examples to inspire a thorough understanding of global issues, before going into the detail of components and devices Discusses power conversion and management; an important area that is missing in other books on the subject End-of-chapter problems and self-training sections support the reader in exploring systems and understanding them at increasing levels of complexity Inside this book you will find a complete explanation of electronics that can be applied across a range of disciplines including electrical engineering and physics. This comprehensive introduction will be of benefit to students studying electronics, as well as their lecturers and professors. Postgraduate engineers, those in vocational training, and design and application engineers will also find this book useful.
Author : Wai-Kai Chen
Publisher : CRC Press
ISBN 13 : 0203011503
Total Pages : 400 pages
Book Rating : 4.2/5 (3 download)
Download or read book VLSI Technology written by Wai-Kai Chen and published by CRC Press. This book was released on 2003-03-19 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines the technologies associated with VLSI systems, including
Author : Wai-Kai Chen
Publisher : CRC Press
ISBN 13 : 9781420049671
Total Pages : 1788 pages
Book Rating : 4.0/5 (496 download)
Download or read book The VLSI Handbook written by Wai-Kai Chen and published by CRC Press. This book was released on 2019-07-17 with total page 1788 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.
