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Signal Propagation On Interconnects 2006 Ieee Workshop On
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Book Synopsis Scientific Computing in Electrical Engineering SCEE 2008 by : Luis R.J. Costa
Download or read book Scientific Computing in Electrical Engineering SCEE 2008 written by Luis R.J. Costa and published by Springer Science & Business Media. This book was released on 2010-06-14 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a collection of 65 selected papers presented at the 7th International Conference on Scientific Computing in Electrical Engineering (SCEE), held in Espoo, Finland, in 2008. The aim of the SCEE 2008 conference was to bring together scientists from academia and industry, e.g. mathematicians, electrical engineers, computer scientists, and physicists, with the goal of intensive discussions on industrially relevant mathematical problems, with an emphasis on modeling and numerical simulation of electronic circuits and devices, electromagnetic fields, and coupled problems.This extensive reference work is divided into five parts: 1. Computational electromagnetics, 2. Circuit simulation, 3. Coupled problems, 4. Mathematical and computational methods, and 5. Model-order reduction. Each part starts with an general introduction followed by the actual papers.
Book Synopsis Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by : Yosi Shacham-Diamand
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Book Synopsis Design Rules in a Semiconductor Foundry by : Eitan N. Shauly
Download or read book Design Rules in a Semiconductor Foundry written by Eitan N. Shauly and published by CRC Press. This book was released on 2022-11-30 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.
Book Synopsis The Foundations of Signal Integrity by : Paul G. Huray
Download or read book The Foundations of Signal Integrity written by Paul G. Huray and published by John Wiley & Sons. This book was released on 2009-10-22 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book to focus on the electromagnetic basis of signal integrity The Foundations of Signal Integrity is the first of its kind—a reference that examines the physical foundation of system integrity based on electromagnetic theory derived from Maxwell's Equations. Drawing upon the cutting-edge research of Professor Paul Huray's team of industrial engineers and graduate students, it develops the physical theory of wave propagation using methods of solid state and high-energy physics, mathematics, chemistry, and electrical engineering before addressing its application to modern high-speed systems. Coverage includes: All the necessary electromagnetic theory needed for a complete understanding of signal integrity Techniques for obtaining analytic solutions to Maxwell's Equations for ideal materials and boundary conditions Plane electromagnetic waves Plane waves in compound media Transmission lines and waveguides Ideal models vs. real-world systems Complex permittivity of propagating media Surface roughness Advanced signal integrity Signal integrity simulations Problem sets for each chapter With its thorough coverage of this relatively new discipline, the book serves as an ideal textbook for senior undergraduate and junior graduate students, as well as a resource for practicing engineers in this burgeoning field. At the end of each section, it typically stimulates the reader with open-ended questions that might lead to future theses or dissertation research.
Book Synopsis Design of 3D Integrated Circuits and Systems by : Rohit Sharma
Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Book Synopsis Measurement Techniques for Radio Frequency Nanoelectronics by : T. Mitch Wallis
Download or read book Measurement Techniques for Radio Frequency Nanoelectronics written by T. Mitch Wallis and published by Cambridge University Press. This book was released on 2017-09-14 with total page 329 pages. Available in PDF, EPUB and Kindle. Book excerpt: Connect basic theory with real-world applications with this practical, cross-disciplinary guide to radio frequency measurement of nanoscale devices and materials. • Learn the techniques needed for characterizing the performance of devices and their constituent building blocks, including semiconducting nanowires, graphene, and other two dimensional materials such as transition metal dichalcogenides • Gain practical insights into instrumentation, including on-wafer measurement platforms and scanning microwave microscopy • Discover how measurement techniques can be applied to solve real-world problems, in areas such as passive and active nanoelectronic devices, semiconductor dopant profiling, subsurface nanoscale tomography, nanoscale magnetic device engineering, and broadband, spatially localized measurements of biological materials Featuring numerous practical examples, and written in a concise yet rigorous style, this is the ideal resource for researchers, practicing engineers, and graduate students new to the field of radio frequency nanoelectronics.
Book Synopsis Power Integrity Modeling and Design for Semiconductors and Systems by : Madhavan Swaminathan
Download or read book Power Integrity Modeling and Design for Semiconductors and Systems written by Madhavan Swaminathan and published by Pearson Education. This book was released on 2007-11-19 with total page 599 pages. Available in PDF, EPUB and Kindle. Book excerpt: The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
Book Synopsis Simulation-Driven Design Optimization and Modeling for Microwave Engineering by : Slawomir Koziel
Download or read book Simulation-Driven Design Optimization and Modeling for Microwave Engineering written by Slawomir Koziel and published by World Scientific. This book was released on 2013 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: On the other hand, various interactions between microwave devices and their environment, such as feeding structures and housing, must be taken into account, and this is only possible through full-wave EM analysis. Electromagnetic simulations can be highly accurate, but they tend to be computationally expensive. Therefore, practical design optimization methods have to be computationally efficient, so that the number of CPU-intensive high-fidelity EM simulations is reduced as much as possible during the design process. For the same reasons, techniques for creating fast yet accurate models of microwave structures become crucially important. In this edited book, the authors strive to review the state-of-the-art simulation-driven microwave design optimization and modeling. A group of international experts specialized in various aspects of microwave computer-aided design summarize and review a wide range of the latest developments and real-world applications.
Book Synopsis Carbon Nanotubes by : Jose Mauricio Marulanda
Download or read book Carbon Nanotubes written by Jose Mauricio Marulanda and published by BoD – Books on Demand. This book was released on 2011-08-01 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt: Carbon nanotubes (CNTs), discovered in 1991, have been a subject of intensive research for a wide range of applications. In the past decades, although carbon nanotubes have undergone massive research, considering the success of silicon, it has, nonetheless, been difficult to appreciate the potential influence of carbon nanotubes in current technology. The main objective of this book is therefore to give a wide variety of possible applications of carbon nanotubes in many industries related to electron device technology. This should allow the user to better appreciate the potential of these innovating nanometer sized materials. Readers of this book should have a good background on electron devices and semiconductor device physics as this book presents excellent results on possible device applications of carbon nanotubes. This book begins with an analysis on fabrication techniques, followed by a study on current models, and it presents a significant amount of work on different devices and applications available to current technology.
Book Synopsis Principles and Techniques of Electromagnetic Compatibility by : Christos Christopoulos
Download or read book Principles and Techniques of Electromagnetic Compatibility written by Christos Christopoulos and published by CRC Press. This book was released on 2022-07-14 with total page 658 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a sound grasp of the fundamental concepts, applications, and practice of EMC. Developments in recent years have resulted in further increases in electrical component density, wider penetration of wireless technologies, and a significant increase in complexity of electrical and electronic equipment. New materials, which can be customized to meet EMC needs, have been introduced. Considerable progress has been made in developing numerical tools for complete system EMC simulation. EMC is now a central consideration in all industrial sectors. Maintaining the holistic approach of the previous edition of Principles and Techniques of Electromagnetic Compatibility, the Third Edition updates coverage of EMC to reflects recent important developments. What is new in the Third Edition? A comprehensive treatment of new materials (meta- and nano-) and their impact on EMC Numerical modelling of complex systems and complexity reduction methods Impact of wireless technologies and the Internet of Things (IoT) on EMC Testing in reverberation chambers, and in the time-domain A comprehensive treatment of the scope and development of stochastic models for EMC EMC issues encountered in automotive, railway, aerospace, and marine applications Impact of EMC and Intentional EMI (IEMI) on infrastructure, and risk assessment In addition to updating material, new references, examples, and appendices were added to offer further support to readers interested in exploring further. As in previous editions, the emphasis is on building a sound theoretical framework, and demonstrating how it can be turned to practical use in challenging applications. The expectation is that this approach will serve EMC engineers through the inevitable future technological shifts and developments.
Download or read book Applications written by Peter Benner and published by Walter de Gruyter GmbH & Co KG. This book was released on 2020-12-07 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: An increasing complexity of models used to predict real-world systems leads to the need for algorithms to replace complex models with far simpler ones, while preserving the accuracy of the predictions. This three-volume handbook covers methods as well as applications. This third volume focuses on applications in engineering, biomedical engineering, computational physics and computer science.
Book Synopsis Coupled Multiscale Simulation and Optimization in Nanoelectronics by : Michael Günther
Download or read book Coupled Multiscale Simulation and Optimization in Nanoelectronics written by Michael Günther and published by Springer. This book was released on 2015-06-15 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt: Designing complex integrated circuits relies heavily on mathematical methods and calls for suitable simulation and optimization tools. The current design approach involves simulations and optimizations in different physical domains (device, circuit, thermal, electromagnetic) and in a range of electrical engineering disciplines (logic, timing, power, crosstalk, signal integrity, system functionality). COMSON was a Marie Curie Research Training Network created to meet these new scientific and training challenges by (a) developing new descriptive models that take these mutual dependencies into account, (b) combining these models with existing circuit descriptions in new simulation strategies and (c) developing new optimization techniques that will accommodate new designs. The book presents the main project results in the fields of PDAE modeling and simulation, model order reduction techniques and optimization, based on merging the know-how of three major European semiconductor companies with the combined expertise of university groups specialized in developing suitable mathematical models, numerical schemes and e-learning facilities. In addition, a common Demonstrator Platform for testing mathematical methods and approaches was created to assess whether they are capable of addressing the industry’s problems, and to educate young researchers by providing hands-on experience with state-of-the-art problems.
Book Synopsis Dependability in Electronic Systems by : Nobuyasu Kanekawa
Download or read book Dependability in Electronic Systems written by Nobuyasu Kanekawa and published by Springer Science & Business Media. This book was released on 2010-11-08 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the practical application of dependable electronic systems in real industry, such as space, train control and automotive control systems, and network servers/routers. The impact from intermittent errors caused by environmental radiation (neutrons and alpha particles) and EMI (Electro-Magnetic Interference) are introduced together with their most advanced countermeasures. Power Integration is included as one of the most important bases of dependability in electronic systems. Fundamental technical background is provided, along with practical design examples. Readers will obtain an overall picture of dependability from failure causes to countermeasures for their relevant systems or products, and therefore, will be able to select the best choice for maximum dependability.
Download or read book ISTFA 2009 written by and published by ASM International. This book was released on 2009-01-01 with total page 371 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
Book Synopsis Interconnect Technologies for Integrated Circuits and Flexible Electronics by : Yash Agrawal
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Book Synopsis Chemistry in Microelectronics by : Yannick Le Tiec
Download or read book Chemistry in Microelectronics written by Yannick Le Tiec and published by John Wiley & Sons. This book was released on 2013-02-28 with total page 261 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics is a complex world where many sciences need to collaborate to create nano-objects: we need expertise in electronics, microelectronics, physics, optics and mechanics also crossing into chemistry, electrochemistry, as well as biology, biochemistry and medicine. Chemistry is involved in many fields from materials, chemicals, gases, liquids or salts, the basics of reactions and equilibrium, to the optimized cleaning of surfaces and selective etching of specific layers. In addition, over recent decades, the size of the transistors has been drastically reduced while the functionality of circuits has increased. This book consists of five chapters covering the chemicals and sequences used in processing, from cleaning to etching, the role and impact of their purity, along with the materials used in “Front End Of the Line” which corresponds to the heart and performance of individual transistors, then moving on to the “Back End Of the Line” which is related to the interconnection of all the transistors. Finally, the need for specific functionalization also requires key knowledge on surface treatments and chemical management to allow new applications. Contents 1. Chemistry in the “Front End of the Line” (FEOL): Deposits, Gate Stacks, Epitaxy and Contacts, François Martin, Jean-Michel Hartmann, Véronique Carron and Yannick Le Tiec. 2. Chemistry in Interconnects, Vincent Jousseaume, Paul-Henri Haumesser, Carole Pernel, Jeffery Butterbaugh, Sylvain Maîtrejean and Didier Louis. 3. The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying, Yannick Le Tiec and Martin Knotter. 4. The Use and Management of Chemical Fluids in Microelectronics, Christiane Gottschalk, Kevin Mclaughlin, Julie Cren, Catherine Peyne and Patrick Valenti. 5. Surface Functionalization for Micro- and Nanosystems: Application to Biosensors, Antoine Hoang, Gilles Marchand, Guillaume Nonglaton, Isabelle Texier-Nogues and Francoise Vinet. About the Authors Yannick Le Tiec is a technical expert at CEA-Leti, Minatec since 2002. He is a CEA-Leti assignee at IBM, Albany (NY) to develop the advanced 14 nm CMOS node and the FDSOI technology. He held different technical positions from the advanced 300 mm SOI CMOS pilot line to different assignments within SOITEC for advanced wafer development and later within INES to optimize solar cell ramp-up and yield. He has been part of the ITRS Front End technical working group at ITRS since 2008.
Book Synopsis Electrical Design of Through Silicon Via by : Manho Lee
Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2014-05-11 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
