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Author : H. Baumgart
Publisher : The Electrochemical Society
ISBN 13 : 9781566773607
Total Pages : 310 pages
Book Rating : 4.7/5 (736 download)
Download or read book Semiconductor Wafer Bonding written by H. Baumgart and published by The Electrochemical Society. This book was released on 2002 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Charles E. Hunt
Publisher : The Electrochemical Society
ISBN 13 : 9781566772587
Total Pages : 496 pages
Book Rating : 4.7/5 (725 download)
Download or read book Semiconductor Wafer Bonding : Science, Technology, and Applications V written by Charles E. Hunt and published by The Electrochemical Society. This book was released on 2001 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566774604
Total Pages : 476 pages
Book Rating : 4.7/5 (746 download)
Download or read book Semiconductor Wafer Bonding VIII : Science, Technology, and Applications written by and published by The Electrochemical Society. This book was released on 2005 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : T. Suga
Publisher :
ISBN 13 : 9781607687269
Total Pages : 365 pages
Book Rating : 4.6/5 (872 download)
Download or read book Semiconductor Water Bonding written by T. Suga and published by . This book was released on 2016 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 524 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings of the ... International Symposium on Semiconductor Wafer Bonding written by and published by . This book was released on 1991 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : The Electrochemical Society
ISBN 13 : 1566776546
Total Pages : 588 pages
Book Rating : 4.5/5 (667 download)
Download or read book Semiconductor Wafer Bonding 10: Science, Technology, and Applications written by and published by The Electrochemical Society. This book was released on 2008-10 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Author : U. Gösele
Publisher : The Electrochemical Society
ISBN 13 : 9781566771894
Total Pages : 636 pages
Book Rating : 4.7/5 (718 download)
Download or read book Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding written by U. Gösele and published by The Electrochemical Society. This book was released on 1998 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Helmut Baumgart
Publisher : The Electrochemical Society
ISBN 13 : 156677506X
Total Pages : 398 pages
Book Rating : 4.5/5 (667 download)
Download or read book Semiconductor Wafer Bonding 9: Science, Technology, and Applications written by Helmut Baumgart and published by The Electrochemical Society. This book was released on 2006 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Author : Chuan Seng Tan
Publisher :
ISBN 13 : 9781623325350
Total Pages : 248 pages
Book Rating : 4.3/5 (253 download)
Download or read book Semiconductor Water Bonding: Science, Technology, and Applications 15 written by Chuan Seng Tan and published by . This book was released on 2018 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9781607681731
Total Pages : 640 pages
Book Rating : 4.6/5 (817 download)
Download or read book Semiconductor Water Bonding 11 written by and published by . This book was released on 2010 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Charles E. Hunt
Publisher : The Electrochemical Society
ISBN 13 : 9781566772587
Total Pages : 498 pages
Book Rating : 4.7/5 (725 download)
Download or read book Semiconductor Wafer Bonding : Science, Technology, and Applications V written by Charles E. Hunt and published by The Electrochemical Society. This book was released on 2001 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : C. Colinge
Publisher : The Electrochemical Society
ISBN 13 : 1566778239
Total Pages : 656 pages
Book Rating : 4.5/5 (667 download)
Download or read book Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele written by C. Colinge and published by The Electrochemical Society. This book was released on 2010-10 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566774024
Total Pages : 404 pages
Book Rating : 4.7/5 (74 download)
Download or read book Semiconductor Wafer Bonding VII : Science, Technology, and Applications written by and published by The Electrochemical Society. This book was released on 2003 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yoshio Nishi
Publisher : CRC Press
ISBN 13 : 1420017667
Total Pages : 1720 pages
Book Rating : 4.4/5 (2 download)
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author : C. S. Tan
Publisher : The Electrochemical Society
ISBN 13 : 1607688514
Total Pages : 258 pages
Book Rating : 4.6/5 (76 download)
Download or read book Semiconductor Wafer Bonding: Science, Technology, and Applications 15 written by C. S. Tan and published by The Electrochemical Society. This book was released on 2018-09-21 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Marin Alexe
Publisher : Springer Science & Business Media
ISBN 13 : 3662108275
Total Pages : 510 pages
Book Rating : 4.6/5 (621 download)
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Author : Yasuhisa Omura
Publisher : The Electrochemical Society
ISBN 13 : 1566778662
Total Pages : 347 pages
Book Rating : 4.5/5 (667 download)
Download or read book Advanced Semiconductor-on-Insulator Technology and Related Physics 15 written by Yasuhisa Omura and published by The Electrochemical Society. This book was released on 2011-04 with total page 347 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the continuation of the long running ¿Silicon-on-Insulator Technology and Devices¿ symposium. The issue of ECS Transactions covers recent significant advances in SOI technologies, SOI-based nanoelectronics and innovative applications including scientific interests. It will be of interest to materials and device scientists, as well as to process and applications oriented engineers and scientists.
