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Routing In The Third Dimension
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Book Synopsis Routing in the Third Dimension by : Naveed A. Sherwani
Download or read book Routing in the Third Dimension written by Naveed A. Sherwani and published by John Wiley & Sons. This book was released on 1995-03 with total page 386 pages. Available in PDF, EPUB and Kindle. Book excerpt: This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
Download or read book Routing in the Third Dimension written by and published by . This book was released on 1995 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Routing in the Third Dimension by : Naveed A. Sherwani
Download or read book Routing in the Third Dimension written by Naveed A. Sherwani and published by Inst of Electrical &. This book was released on 1995-01-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis The ArcGIS Book by : Christian Harder
Download or read book The ArcGIS Book written by Christian Harder and published by ESRI Press. This book was released on 2017 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is a hands-on book about ArcGIS that you work with as much as read. By the end, using Learn ArcGIS lessons, you'll be able to say you made a story map, conducted geographic analysis, edited geographic data, worked in a 3D web scene, built a 3D model of Venice, and more.
Author :Chrysostomos Nicopoulos Publisher :Springer Science & Business Media ISBN 13 :904813031X Total Pages :237 pages Book Rating :4.0/5 (481 download)
Book Synopsis Network-on-Chip Architectures by : Chrysostomos Nicopoulos
Download or read book Network-on-Chip Architectures written by Chrysostomos Nicopoulos and published by Springer Science & Business Media. This book was released on 2009-09-18 with total page 237 pages. Available in PDF, EPUB and Kindle. Book excerpt: [2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die.
Book Synopsis Applied Reconfigurable Computing by : Vanderlei Bonato
Download or read book Applied Reconfigurable Computing written by Vanderlei Bonato and published by Springer. This book was released on 2016-03-15 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 12th International Symposium on Applied Reconfigurable Computing, ARC 2016, held in Rio de Janeiro, Brazil, in March 2016. The 20 full papers presented in this volume were carefully reviewed and selected from 47 submissions. They are organized in topical headings named: video and image processing; fault-tolerant systems; tools and architectures; signal processing; and multicore systems. In addition, the book contains 3 invited papers and 8 poster papers on funded RD running and completed projects.
Book Synopsis Geospatial Information Technology for Emergency Response by : Sisi Zlatanova
Download or read book Geospatial Information Technology for Emergency Response written by Sisi Zlatanova and published by CRC Press. This book was released on 2008-01-24 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: Disaster management is generally understood to consist of four phases: mitigation, preparedness, response and recovery. While these phases are all important and interrelated, response and recovery are often considered to be the most critical in terms of saving lives. Response is the acute phase occurring after the event, and includes all arrangemen
Book Synopsis Arbitrary Modeling of TSVs for 3D Integrated Circuits by : Khaled Salah
Download or read book Arbitrary Modeling of TSVs for 3D Integrated Circuits written by Khaled Salah and published by Springer. This book was released on 2014-08-21 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Book Synopsis Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) by :
Download or read book Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) written by and published by World Scientific. This book was released on 2014-10-23 with total page 1397 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Book Synopsis Principles and Structures of FPGAs by : Hideharu Amano
Download or read book Principles and Structures of FPGAs written by Hideharu Amano and published by Springer. This book was released on 2018-09-03 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive textbook on the field programmable gate array (FPGA) covers its history, fundamental knowledge, architectures, device technologies, computer-aided design technologies, design tools, examples of application, and future trends. Programmable logic devices represented by FPGAs have been rapidly developed in recent years and have become key electronic devices used in most IT products. This book provides both complete introductions suitable for students and beginners, and high-level techniques useful for engineers and researchers in this field. Differently developed from usual integrated circuits, the FPGA has unique structures, design methodologies, and application techniques. Allowing programming by users, the device can dramatically reduce the rising cost of development in advanced semiconductor chips. The FPGA is now driving the most advanced semiconductor processes and is an all-in-one platform combining memory, CPUs, and various peripheral interfaces. This book introduces the FPGA from various aspects for readers of different levels. Novice learners can acquire a fundamental knowledge of the FPGA, including its history, from Chapter 1; the first half of Chapter 2; and Chapter 4. Professionals who are already familiar with the device will gain a deeper understanding of the structures and design methodologies from Chapters 3 and 5. Chapters 6–8 also provide advanced techniques and cutting-edge applications and trends useful for professionals. Although the first parts are mainly suitable for students, the advanced sections of the book will be valuable for professionals in acquiring an in-depth understanding of the FPGA to maximize the performance of the device.
Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Book Synopsis Embedded Systems by : Krzysztof Iniewski
Download or read book Embedded Systems written by Krzysztof Iniewski and published by John Wiley & Sons. This book was released on 2012-10-26 with total page 314 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covers the significant embedded computing technologies highlighting their applications in wireless communication and computing power An embedded system is a computer system designed for specific control functions within a larger system often with real-time computing constraints. It is embedded as part of a complete device often including hardware and mechanical parts. Presented in three parts, Embedded Systems: Hardware, Design, and Implementation provides readers with an immersive introduction to this rapidly growing segment of the computer industry. Acknowledging the fact that embedded systems control many of today's most common devices such as smart phones, PC tablets, as well as hardware embedded in cars, TVs, and even refrigerators and heating systems, the book starts with a basic introduction to embedded computing systems. It hones in on system-on-a-chip (SoC), multiprocessor system-on-chip (MPSoC), and network-on-chip (NoC). It then covers on-chip integration of software and custom hardware accelerators, as well as fabric flexibility, custom architectures, and the multiple I/O standards that facilitate PCB integration. Next, it focuses on the technologies associated with embedded computing systems, going over the basics of field-programmable gate array (FPGA), digital signal processing (DSP) and application-specific integrated circuit (ASIC) technology, architectural support for on-chip integration of custom accelerators with processors, and O/S support for these systems. Finally, it offers full details on architecture, testability, and computer-aided design (CAD) support for embedded systems, soft processors, heterogeneous resources, and on-chip storage before concluding with coverage of software support in particular, O/S Linux. Embedded Systems: Hardware, Design, and Implementation is an ideal book for design engineers looking to optimize and reduce the size and cost of embedded system products and increase their reliability and performance.
Book Synopsis Handbook of 3D Integration, Volume 1 by : Philip Garrou
Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Book Synopsis VLSI Design and Test by : Anirban Sengupta
Download or read book VLSI Design and Test written by Anirban Sengupta and published by Springer. This book was released on 2019-08-17 with total page 775 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 23st International Symposium on VLSI Design and Test, VDAT 2019, held in Indore, India, in July 2019. The 63 full papers were carefully reviewed and selected from 199 submissions. The papers are organized in topical sections named: analog and mixed signal design; computing architecture and security; hardware design and optimization; low power VLSI and memory design; device modelling; and hardware implementation.
Book Synopsis UAV Swarm Networks: Models, Protocols, and Systems by : Fei Hu
Download or read book UAV Swarm Networks: Models, Protocols, and Systems written by Fei Hu and published by CRC Press. This book was released on 2020-12-28 with total page 317 pages. Available in PDF, EPUB and Kindle. Book excerpt: UAV swarm network has been used in many critical applications, such as disaster recovery, area surveillance, weather monitoring, and military communications. There are many challenging R&D issues in UAV network designs, such as the hardware/software integration for a large-scale UAV network management, long-distance data transmissions among UAVs, swarm shape/formation control, and intelligent UAV mobility/position prediction. This book will be the first one to cover the engineering designs (especially network protocol designs) for dynamic, large-scale UAV network. It has the technical models/algorithms and protocol specifications for practical UAV swarm network deployment. Features: Includes chapters written by professors, researchers, engineers, and experts in UAV networking fields Details network protocol descriptions for practical engineering designs Covers 7-layer protocols (particularly data routing layer) Presents novel AI models/algorithms for intelligent UAV swarming/networking control Highlights practical hardware/software implementations for advanced UAV networks This book is suitable to a variety of audiences: (1) industry UAV R&D engineers, administrators, or technicians, who would like to grasp the latest trends in UAV communications; (2) college graduate students or researchers, who may want to pursue some advanced research on large-scale UAV swarming and networking technologies; (3) government agencies that determine the future society development in this exciting field; and (4) other interested readers with a strong desire to understand the challenges of designing a QoS-oriented UAV network. The book editors are: Dr. Fei Hu, Professor in Electrical and Computer Engineering at University of Alabama, Tuscaloosa, Alabama, USA; Dr. Xin-Lin Huang, Professor in Information and Communication Engineering, Tongji University, Shanghai, China; and Dr. DongXiu Ou, Professor in Transportation Information Institute at Tongji University, Shanghai, China.
Book Synopsis Three-Dimensional Integrated Circuit Design by : Yuan Xie
Download or read book Three-Dimensional Integrated Circuit Design written by Yuan Xie and published by Springer Science & Business Media. This book was released on 2009-12-02 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Book Synopsis Bio and Nano Packaging Techniques for Electron Devices by : Gerald Gerlach
Download or read book Bio and Nano Packaging Techniques for Electron Devices written by Gerald Gerlach and published by Springer Science & Business Media. This book was released on 2012-07-16 with total page 619 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their application as packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; also ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers.
