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Author : Eric Bogatin
Publisher : Integrated Circuit Engingeering
ISBN 13 : 9781877750618
Total Pages : 580 pages
Book Rating : 4.7/5 (56 download)
Download or read book Roadmaps of Packaging Technology written by Eric Bogatin and published by Integrated Circuit Engingeering. This book was released on 1997-01-01 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Eric Bogatin
Publisher :
ISBN 13 : 9781732567016
Total Pages : 548 pages
Book Rating : 4.5/5 (67 download)
Download or read book Roadmaps of Packaging Technology written by Eric Bogatin and published by . This book was released on 2018-12-17 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: ROADMAPS OF PACKAGING TECHNOLOGY. IC packaging technology is driven by four forces: Faster, Denser, Cheaper, NOW! It is squeezed from both sides by advances in IC technologies and by the demands of the users. These forces drive the packaging industry to constantly evolve. This book tells this story.
Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119793777
Total Pages : 324 pages
Book Rating : 4.1/5 (197 download)
Download or read book Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces written by Beth Keser and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Author : David Tolfree
Publisher : Troubador Publishing Ltd
ISBN 13 : 184876099X
Total Pages : 277 pages
Book Rating : 4.8/5 (487 download)
Download or read book Roadmapping Emergent Technologies written by David Tolfree and published by Troubador Publishing Ltd. This book was released on 2009 with total page 277 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book shows how roadmapping can prepare the policy-maker and planner for the challenges and changes which lie ahead. It provides the reader with a comprehensive introduction on roadmapping methodology, extracts from existing roadmaps covering the key sectors of industry.
Author :
Publisher : World Scientific
ISBN 13 : 9811209642
Total Pages : 1079 pages
Book Rating : 4.8/5 (112 download)
Download or read book Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) written by and published by World Scientific. This book was released on 2019-08-27 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Author : Y.C. Lee
Publisher : Springer Science & Business Media
ISBN 13 : 1461558034
Total Pages : 270 pages
Book Rating : 4.4/5 (615 download)
Download or read book Manufacturing Challenges in Electronic Packaging written by Y.C. Lee and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119313988
Total Pages : 634 pages
Book Rating : 4.1/5 (193 download)
Download or read book Advances in Embedded and Fan-Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-20 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Download or read book Advanced Packaging written by and published by . This book was released on 2008-11 with total page 36 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Author :
Publisher :
ISBN 13 :
Total Pages : 252 pages
Book Rating : 4.3/5 (91 download)
Download or read book The National Technology Roadmap for Semiconductors written by and published by . This book was released on 1997 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : DIANE Publishing
ISBN 13 : 9781422318850
Total Pages : 12 pages
Book Rating : 4.3/5 (188 download)
Download or read book Technology Roadmaps for Compound Semiconductors written by and published by DIANE Publishing. This book was released on with total page 12 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
ISBN 13 : 1461513898
Total Pages : 1250 pages
Book Rating : 4.4/5 (615 download)
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author : Martin Moehrle
Publisher : Springer Science & Business Media
ISBN 13 : 3642339239
Total Pages : 283 pages
Book Rating : 4.6/5 (423 download)
Download or read book Technology Roadmapping for Strategy and Innovation written by Martin Moehrle and published by Springer Science & Business Media. This book was released on 2013-01-17 with total page 283 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technology roadmapping is a significant method to help companies gain orientation concerning future challenges. This work contains a description of technology roadmapping in four major parts, providing expert knowledge on framing/embedding of technology roadmapping, processes of technology roadmapping, implementing technology roadmapping and linking technology roadmapping to other instruments of strategic planning. The book provides a comprehensive survey of technology roadmapping since it contains papers by leading European, American and Asian experts, provides orientation regarding different methods of technology roadmapping and their interconnections, supplies readers with a compilation of the most important submethods, and embeds and links technology roadmapping in the framework of management research. This book aims at becoming the leading compendium on technology roadmapping.
Author : National Research Council
Publisher : National Academies Press
ISBN 13 : 0309253624
Total Pages : 376 pages
Book Rating : 4.3/5 (92 download)
Download or read book NASA Space Technology Roadmaps and Priorities written by National Research Council and published by National Academies Press. This book was released on 2012-06-07 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: NASA's Office of the Chief Technologist (OCT) has begun to rebuild the advanced space technology program in the agency with plans laid out in 14 draft technology roadmaps. It has been years since NASA has had a vigorous, broad-based program in advanced space technology development and its technology base has been largely depleted. However, success in executing future NASA space missions will depend on advanced technology developments that should already be underway. Reaching out to involve the external technical community, the National Research Council (NRC) considered the 14 draft technology roadmaps prepared by OCT and ranked the top technical challenges and highest priority technologies that NASA should emphasize in the next 5 years. This report provides specific guidance and recommendations on how the effectiveness of the technology development program managed by OCT can be enhanced in the face of scarce resources.
Author : Ken Gilleo
Publisher : McGraw Hill Professional
ISBN 13 : 9780071428279
Total Pages : 224 pages
Book Rating : 4.4/5 (282 download)
Download or read book Area Array Package Design written by Ken Gilleo and published by McGraw Hill Professional. This book was released on 2004 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
Author : Wataru Nakayama
Publisher : CRC Press
ISBN 13 : 1351829866
Total Pages : 156 pages
Book Rating : 4.3/5 (518 download)
Download or read book The Japanese Electronics Industry written by Wataru Nakayama and published by CRC Press. This book was released on 2019-01-15 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: The explosive growth of the Japanese electronics industry continues to be driven by a combination of market forces and the unique characteristics of the Japanese social organization and people. As an industrial phenomenon, the Japanese electronics industry receives considerable attention from researchers in various fields. However, most of their studies focus on either historical analyses intent on discovering the secret of the industry's enormous success, or on the issue of America's competitiveness in the face of challenges from Japanese technology. Moreover, none of these studies can be free of the bias that stems from each researcher's own upbringing and environment. The authors of The Japanese Electronics Industry have pooled their diverse experience and talents to create a balanced, objective study of this complex subject. They illuminate the history and characteristics of the industry, show the current state of the industry, and explore the research, development, and education vital to the future of the industry.
Author : IBP USA
Publisher : Lulu.com
ISBN 13 : 1433063190
Total Pages : 312 pages
Book Rating : 4.4/5 (33 download)
Download or read book Japan Research and Development Policy Handbook Volume 1 Strategic Information and Programs written by IBP USA and published by Lulu.com. This book was released on 2013-08 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: 2011 Updated Reprint. Updated Annually. Japan Research & Development Policy Handbook
Author : Lih-Tyng Hwang
Publisher : John Wiley & Sons
ISBN 13 : 111928967X
Total Pages : 465 pages
Book Rating : 4.1/5 (192 download)
Download or read book 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility written by Lih-Tyng Hwang and published by John Wiley & Sons. This book was released on 2018-03-28 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools
