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Process Engineering Analysis In Semiconductor Device Fabrication
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Book Synopsis Process Engineering Analysis in Semiconductor Device Fabrication by : Stanley Middleman
Download or read book Process Engineering Analysis in Semiconductor Device Fabrication written by Stanley Middleman and published by McGraw-Hill Companies. This book was released on 1993 with total page 802 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written primarily for chemical engineering students, the material included in this new text is an extension of upper level chemical engineering courses. Covering a range of processes in semiconductor device fabrication, the authors try to present traditional chemical engineering methodology in a non-traditional context. The text covers such topics as crystal growth and filtration and contains over 300 worked examples and problems.
Book Synopsis Process Engineering Analysis in Semiconductor Device Fabrication by : Stanley Middleman
Download or read book Process Engineering Analysis in Semiconductor Device Fabrication written by Stanley Middleman and published by . This book was released on 1993-01 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt: This solutions manual accompanies a text which covers a range of processes in semiconductor device fabrication. The authors try to present traditional chemical engineering methodology in a non-traditional context. The text covers topics such as crystal growth and filtration.
Book Synopsis Fundamentals of Semiconductor Manufacturing and Process Control by : Gary S. May
Download or read book Fundamentals of Semiconductor Manufacturing and Process Control written by Gary S. May and published by John Wiley & Sons. This book was released on 2006-05-26 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
Book Synopsis Wafer Fabrication: Factory Performance and Analysis by : Linda F. Atherton
Download or read book Wafer Fabrication: Factory Performance and Analysis written by Linda F. Atherton and published by Springer Science & Business Media. This book was released on 1995-11-30 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is concerned with wafer fabrication and the factories that manufacture microprocessors and other integrated circuits. With the invention of the transistor in 1947, the world as we knew it changed. The transistor led to the microprocessor, and the microprocessor, the guts of the modern computer, has created an epoch of virtually unlimited information processing. The electronics and computer revolution has brought about, for better or worse, a new way of life. This revolution could not have occurred without wafer fabrication, and its associated processing technologies. A microprocessor is fabricated via a lengthy, highly-complex sequence of chemical processes. The success of modern chip manufacturing is a miracle of technology and a tribute to the hundreds of engineers who have contributed to its development. This book will delineate the magnitude of the accomplishment, and present methods to analyze and predict the performance of the factories that make the chips. The set of topics covered juxtaposes several disciplines of engineering. A primary subject is the chemical engineering aspects of the electronics industry, an industry typically thought to be strictly an electrical engineer's playground. The book also delves into issues of manufacturing, operations performance, economics, and the dynamics of material movement, topics often considered the domain of industrial engineering and operations research. Hopefully, we have provided in this work a comprehensive treatment of both the technology and the factories of wafer fabrication. Novel features of these factories include long process flows and a dominance of processing over operational issues.
Book Synopsis Analysis and Optimisation of Semiconductor Device Fabrication Following New Process Introduction by :
Download or read book Analysis and Optimisation of Semiconductor Device Fabrication Following New Process Introduction written by and published by . This book was released on 1996 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Introduction to Microfabrication by : Sami Franssila
Download or read book Introduction to Microfabrication written by Sami Franssila and published by John Wiley & Sons. This book was released on 2010-10-29 with total page 534 pages. Available in PDF, EPUB and Kindle. Book excerpt: This accessible text is now fully revised and updated, providing an overview of fabrication technologies and materials needed to realize modern microdevices. It demonstrates how common microfabrication principles can be applied in different applications, to create devices ranging from nanometer probe tips to meter scale solar cells, and a host of microelectronic, mechanical, optical and fluidic devices in between. Latest developments in wafer engineering, patterning, thin films, surface preparation and bonding are covered. This second edition includes: expanded sections on MEMS and microfluidics related fabrication issues new chapters on polymer and glass microprocessing, as well as serial processing techniques 200 completely new and 200 modified figures more coverage of imprinting techniques, process integration and economics of microfabrication 300 homework exercises including conceptual thinking assignments, order of magnitude estimates, standard calculations, and device design and process analysis problems solutions to homework problems on the complementary website, as well as PDF slides of the figures and tables within the book With clear sections separating basic principles from more advanced material, this is a valuable textbook for senior undergraduate and beginning graduate students wanting to understand the fundamentals of microfabrication. The book also serves as a handy desk reference for practicing electrical engineers, materials scientists, chemists and physicists alike. www.wiley.com/go/Franssila_Micro2e
Book Synopsis PRINCIPLES OF MASS TRANSFER AND SEPERATION PROCESSES by : BINAY K. DUTTA
Download or read book PRINCIPLES OF MASS TRANSFER AND SEPERATION PROCESSES written by BINAY K. DUTTA and published by PHI Learning Pvt. Ltd.. This book was released on 2007-01-21 with total page 957 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook is targetted to undergraduate students in chemical engineering, chemical technology, and biochemical engineering for courses in mass transfer, separation processes, transport processes, and unit operations. The principles of mass transfer, both diffusional and convective have been comprehensively discussed. The application of these principles to separation processes is explained. The more common separation processes used in the chemical industries are individually described in separate chapters. The book also provides a good understanding of the construction, the operating principles, and the selection criteria of separation equipment. Recent developments in equipment have been included as far as possible. The procedure of equipment design and sizing has been illustrated by simple examples. An overview of different applications and aspects of membrane separation has also been provided. ‘Humidification and water cooling’, necessary in every process indus-try, is also described. Finally, elementary principles of ‘unsteady state diffusion’ and mass transfer accompanied by a chemical reaction are covered. SALIENT FEATURES : • A balanced coverage of theoretical principles and applications. • Important recent developments in mass transfer equipment and practice are included. • A large number of solved problems of varying levels of complexities showing the applications of the theory are included. • Many end-chapter exercises. • Chapter-wise multiple choice questions. • An Instructors manual for the teachers.
Book Synopsis Proceedings of the Fifth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing by : Jerzy Rużyłło
Download or read book Proceedings of the Fifth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing written by Jerzy Rużyłło and published by The Electrochemical Society. This book was released on 1998 with total page 668 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis InP and Related Compounds by : M O Manasreh
Download or read book InP and Related Compounds written by M O Manasreh and published by CRC Press. This book was released on 2000-08-08 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt: InP is a key semiconductor for the production of optoelectronic and photonic devices. Its related compounds, such as InGaAsP alloy, have been realized as very important materials for communication in the 1.3 and 1.55 micron spectral regions. Furthermore, the applications on InP and related compounds have extended to other areas that include laser diodes, light emitting diodes, photodetectors, waveguides, photocathodes, solar cells, and many other applications. The topics presented in this book have been chosen to achieve a balance between the properties of bulk materials, doping, characterization, applications, and devices. This unique volume, featuring chapters written by experts in the field, provides a good starting point for those who are new to the subject and contains detailed results and in depth discussions for those who are experts in the field.
Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 3276 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Book Synopsis Semiconductor Material and Device Characterization by : Dieter K. Schroder
Download or read book Semiconductor Material and Device Characterization written by Dieter K. Schroder and published by John Wiley & Sons. This book was released on 2015-06-29 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.
Book Synopsis Discrete and Integrated Power Semiconductor Devices by : Vítezslav Benda
Download or read book Discrete and Integrated Power Semiconductor Devices written by Vítezslav Benda and published by John Wiley & Sons. This book was released on 1999-01-26 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dieses Buch beschreibt in leicht verständlicher Weise Aufbau, Funktion, Eigenschaften und Anwendungsmöglichkeiten wichtiger Halbleiter-Bauelemente - von Leistungsdioden über Thyristoren und MOSFETs bis hin zu integrierten Systemen. Die Autoren verzichten dabei auf komplizierte Mathematik; sie stützen sich vielmehr auf grundlegende physikalische Modelle. (11/98)
Book Synopsis Fundamentals of Momentum, Heat, and Mass Transfer by : James Welty
Download or read book Fundamentals of Momentum, Heat, and Mass Transfer written by James Welty and published by John Wiley & Sons. This book was released on 2014-09-09 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fundamentals of Momentum, Heat and Mass Transfer, Revised, 6th Edition provides a unified treatment of momentum transfer (fluid mechanics), heat transfer and mass transfer. The new edition has been updated to include more modern examples, problems, and illustrations with real world applications. The treatment of the three areas of transport phenomena is done sequentially. The subjects of momentum, heat, and mass transfer are introduced, in that order, and appropriate analysis tools are developed.
Book Synopsis Semiconductor Process Reliability in Practice by : Zhenghao Gan
Download or read book Semiconductor Process Reliability in Practice written by Zhenghao Gan and published by McGraw Hill Professional. This book was released on 2012-10-10 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown
Book Synopsis Fundamentals of Solid State Engineering by : Manijeh Razeghi
Download or read book Fundamentals of Solid State Engineering written by Manijeh Razeghi and published by Springer Science & Business Media. This book was released on 2006-06-12 with total page 894 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides a multidisciplinary introduction to quantum mechanics, solid state physics, advanced devices, and fabrication Covers wide range of topics in the same style and in the same notation Most up to date developments in semiconductor physics and nano-engineering Mathematical derivations are carried through in detail with emphasis on clarity Timely application areas such as biophotonics , bioelectronics
Book Synopsis Materials Science of Thin Films by : Milton Ohring
Download or read book Materials Science of Thin Films written by Milton Ohring and published by Academic Press. This book was released on 2002 with total page 817 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.
Book Synopsis Wafer Fabrication: Factory Performance and Analysis by : Linda F. Atherton
Download or read book Wafer Fabrication: Factory Performance and Analysis written by Linda F. Atherton and published by Springer. This book was released on 1995-12-14 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is concerned with wafer fabrication and the factories that manufacture microprocessors and other integrated circuits. With the invention of the transistor in 1947, the world as we knew it changed. The transistor led to the microprocessor, and the microprocessor, the guts of the modern computer, has created an epoch of virtually unlimited information processing. The electronics and computer revolution has brought about, for better or worse, a new way of life. This revolution could not have occurred without wafer fabrication, and its associated processing technologies. A microprocessor is fabricated via a lengthy, highly-complex sequence of chemical processes. The success of modern chip manufacturing is a miracle of technology and a tribute to the hundreds of engineers who have contributed to its development. This book will delineate the magnitude of the accomplishment, and present methods to analyze and predict the performance of the factories that make the chips. The set of topics covered juxtaposes several disciplines of engineering. A primary subject is the chemical engineering aspects of the electronics industry, an industry typically thought to be strictly an electrical engineer's playground. The book also delves into issues of manufacturing, operations performance, economics, and the dynamics of material movement, topics often considered the domain of industrial engineering and operations research. Hopefully, we have provided in this work a comprehensive treatment of both the technology and the factories of wafer fabrication. Novel features of these factories include long process flows and a dominance of processing over operational issues.
