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Proceedings Of The Third International Symposium On Corrosion And Reliability Of Electronic Materials And Devices
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Book Synopsis Proceedings of the Third International Symposium on Corrosion and Reliability of Electronic Materials and Devices by : Robert B. Comizzoli
Download or read book Proceedings of the Third International Symposium on Corrosion and Reliability of Electronic Materials and Devices written by Robert B. Comizzoli and published by The Electrochemical Society. This book was released on 1994 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Corrosion and Reliability of Electronic Materials and Devices by : Robert B. Comizzoli
Download or read book Corrosion and Reliability of Electronic Materials and Devices written by Robert B. Comizzoli and published by The Electrochemical Society. This book was released on 1999 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Corrosion and Reliability of Electronic Materials and Devices by : Electrochemical Society. Corrosion Division
Download or read book Corrosion and Reliability of Electronic Materials and Devices written by Electrochemical Society. Corrosion Division and published by . This book was released on 1999 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the Second International Symposium on Corrosion and Reliability of Electronic Materials and Devices by : Robert B. Comizzoli
Download or read book Proceedings of the Second International Symposium on Corrosion and Reliability of Electronic Materials and Devices written by Robert B. Comizzoli and published by . This book was released on 1993 with total page 604 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Book Synopsis Corrosion and Corrosion Protection by : James Douglas Sinclair
Download or read book Corrosion and Corrosion Protection written by James Douglas Sinclair and published by . This book was released on 2001 with total page 1208 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Atmospheric Corrosion by : Christofer Leygraf
Download or read book Atmospheric Corrosion written by Christofer Leygraf and published by John Wiley & Sons. This book was released on 2016-06-07 with total page 623 pages. Available in PDF, EPUB and Kindle. Book excerpt: ATMOSPHERIC CORROSION Presents a comprehensive look at atmospheric corrosion, combining expertise in corrosion science and atmospheric chemistry Atmospheric corrosion has been a subject of engineering study, largely empirical, for nearly a century. Scientists came to the field rather later on and had considerable difficulty bringing their arsenal of tools to bear on the problem. Atmospheric corrosion was traditionally studied by specialists in corrosion having little knowledge of atmospheric chemistry, history, or prospects. Atmospheric Corrosion provides a combined approach bringing together experimental corrosion and atmospheric chemistry. The second edition expands on this approach by including environmental aspects of corrosion, atmospheric corrosion modeling, and international corrosion exposure programs. The combination of specialties provides a more comprehensive coverage of the topic. These scientific insights into the corrosion process and its amelioration are the focus of this book. Key topics include the following: Basic principles of atmospheric corrosion chemistry Corrosion mechanisms in controlled and uncontrolled environments Degradation of materials in architectural, transport, and structural applications; electronic devices; and cultural artifacts Protection of existing materials and choosing new ones that resist corrosion Prediction of how and where atmospheric corrosion may evolve in the future Complete with appendices discussing experimental techniques, computer models, and the degradation of specific metals, Atmospheric Corrosion, Second Edition continues to be an invaluable resource for corrosion scientists, corrosion engineers, conservators, environmental scientists, and anyone interested in the theory and application of this evolving field. The book concerns primarily the atmospheric corrosion of metals and is written at a level suitable for advanced undergraduates or beginning graduate students in any of the physical or engineering sciences.
Book Synopsis Reliability Physics and Engineering by : J. W. McPherson
Download or read book Reliability Physics and Engineering written by J. W. McPherson and published by Springer. This book was released on 2018-12-20 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: This third edition textbook provides the basics of reliability physics and engineering that are needed by electrical engineers, mechanical engineers, civil engineers, biomedical engineers, materials scientists, and applied physicists to help them to build better devices/products. The information contained within should help all fields of engineering to develop better methodologies for: more reliable product designs, more reliable materials selections, and more reliable manufacturing processes— all of which should help to improve product reliability. A mathematics level through differential equations is needed. Also, a familiarity with the use of excel spreadsheets is assumed. Any needed statistical training and tools are contained within the text. While device failure is a statistical process (thus making statistics important), the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases.
Download or read book Istfa 2005 written by ASM International and published by ASM International. This book was released on 2005-01-01 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Influence of Temperature on Microelectronics and System Reliability by : Pradeep Lall
Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Book Synopsis The International Journal of Microcircuits and Electronic Packaging by :
Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 2001 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Contamination of Electronic Assemblies by : Elissa M. Bumiller
Download or read book Contamination of Electronic Assemblies written by Elissa M. Bumiller and published by CRC Press. This book was released on 2002-11-12 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of
Book Synopsis The RF and Microwave Handbook - 3 Volume Set by : Mike Golio
Download or read book The RF and Microwave Handbook - 3 Volume Set written by Mike Golio and published by CRC Press. This book was released on 2018-10-08 with total page 2208 pages. Available in PDF, EPUB and Kindle. Book excerpt: By 1990 the wireless revolution had begun. In late 2000, Mike Golio gave the world a significant tool to use in this revolution: The RF and Microwave Handbook. Since then, wireless technology spread across the globe with unprecedented speed, fueled by 3G and 4G mobile technology and the proliferation of wireless LANs. Updated to reflect this tremendous growth, the second edition of this widely embraced, bestselling handbook divides its coverage conveniently into a set of three books, each focused on a particular aspect of the technology. Six new chapters cover WiMAX, broadband cable, bit error ratio (BER) testing, high-power PAs (power amplifiers), heterojunction bipolar transistors (HBTs), as well as an overview of microwave engineering. Over 100 contributors, with diverse backgrounds in academic, industrial, government, manufacturing, design, and research reflect the breadth and depth of the field. This eclectic mix of contributors ensures that the coverage balances fundamental technical issues with the important business and marketing constraints that define commercial RF and microwave engineering. Focused chapters filled with formulas, charts, graphs, diagrams, and tables make the information easy to locate and apply to practical cases. The new format, three tightly focused volumes, provides not only increased information but also ease of use. You can find the information you need quickly, without wading through material you don’t immediately need, giving you access to the caliber of data you have come to expect in a much more user-friendly format.
Book Synopsis American Book Publishing Record by :
Download or read book American Book Publishing Record written by and published by . This book was released on 2001 with total page 2740 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by and published by . This book was released on 2005 with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Quality Conformance and Qualification of Microelectronic Packages and Interconnects by : Michael Pecht
Download or read book Quality Conformance and Qualification of Microelectronic Packages and Interconnects written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-12-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
