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Proceedings Of The Ieee 2006 International Interconnect Technology Conference
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Book Synopsis Proceedings of the IEEE International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE International Interconnect Technology Conference written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2006-01-01 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE 2007 International Interconnect Technology Conference : Burlingame, CA, June 4-6, 2007 by : International Interconnect Technology Conference
Download or read book Proceedings of the IEEE 2007 International Interconnect Technology Conference : Burlingame, CA, June 4-6, 2007 written by International Interconnect Technology Conference and published by . This book was released on 2007 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE 2006 International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE 2006 International Interconnect Technology Conference written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE 2000 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco Airport, Burlingame, California, June 5-7, 2000 by : IEEE Electron Devices Society
Download or read book Proceedings of the IEEE 2000 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco Airport, Burlingame, California, June 5-7, 2000 written by IEEE Electron Devices Society and published by IEEE Standards Office. This book was released on 2000 with total page 277 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work constitutes the proceedings of the 2000 International Interconnect Technology Conference (IITC). It should be useful to process engineers, processing equipment engineers, and engineers and scientists in research and development.
Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Book Synopsis Proceedings of the IEEE 2007 International Interconnect Technology Conference by :
Download or read book Proceedings of the IEEE 2007 International Interconnect Technology Conference written by and published by IEEE Computer Society Press. This book was released on 2007-01-01 with total page 215 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the IEEE 2003 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 2-4, 2003 by : IEEE International Interconnect Technology Conference
Download or read book Proceedings of the IEEE 2003 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 2-4, 2003 written by IEEE International Interconnect Technology Conference and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :IEEE Electron Devices Society Publisher :Institute of Electrical & Electronics Engineers(IEEE) ISBN 13 :9780780366787 Total Pages :300 pages Book Rating :4.3/5 (667 download)
Book Synopsis Proceedings of the IEEE 2001 International Interconnect Technology Conference by : IEEE Electron Devices Society
Download or read book Proceedings of the IEEE 2001 International Interconnect Technology Conference written by IEEE Electron Devices Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2001 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered in this volume include: silicide/salicide; dielectrics; planarization; metallization; process integration; process control/modelling; reliability; and interconnect systems.
Download or read book Network-on-Chip written by Santanu Kundu and published by CRC Press. This book was released on 2018-09-03 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems.
Book Synopsis Handbook of Thin Film Deposition by : Krishna Seshan
Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2012-06-27 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: Resumen: The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Book Synopsis Electromigration in Thin Films and Electronic Devices by : Choong-Un Kim
Download or read book Electromigration in Thin Films and Electronic Devices written by Choong-Un Kim and published by Elsevier. This book was released on 2011-08-28 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. Provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuits Comprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigration Deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure
Book Synopsis Noble and Precious Metals by : Mohindar Seehra
Download or read book Noble and Precious Metals written by Mohindar Seehra and published by BoD – Books on Demand. This book was released on 2018-07-04 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: The use of copper, silver, gold and platinum in jewelry as a measure of wealth is well known. This book contains 19 chapters written by international authors on other uses and applications of noble and precious metals (copper, silver, gold, platinum, palladium, iridium, osmium, rhodium, ruthenium, and rhenium). The topics covered include surface-enhanced Raman scattering, quantum dots, synthesis and properties of nanostructures, and its applications in the diverse fields such as high-tech engineering, nanotechnology, catalysis, and biomedical applications. The basis for these applications is their high-free electron concentrations combined with high-temperature stability and corrosion resistance and methods developed for synthesizing nanostructures. Recent developments in all these areas with up-to-date references are emphasized.
Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Book Synopsis On-Chip Communication Architectures by : Sudeep Pasricha
Download or read book On-Chip Communication Architectures written by Sudeep Pasricha and published by Morgan Kaufmann. This book was released on 2010-07-28 with total page 541 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the past decade, system-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. Improvements in process technology have effectively shrunk board-level components so they can be integrated on a single chip. New on-chip communication architectures have been designed to support all inter-component communication in a SoC design. These communication architecture fabrics have a critical impact on the power consumption, performance, cost and design cycle time of modern SoC designs. As application complexity strains the communication backbone of SoC designs, academic and industrial R&D efforts and dollars are increasingly focused on communication architecture design. On-Chip Communication Architecures is a comprehensive reference on concepts, research and trends in on-chip communication architecture design. It will provide readers with a comprehensive survey, not available elsewhere, of all current standards for on-chip communication architectures. A definitive guide to on-chip communication architectures, explaining key concepts, surveying research efforts and predicting future trends Detailed analysis of all popular standards for on-chip communication architectures Comprehensive survey of all research on communication architectures, covering a wide range of topics relevant to this area, spanning the past several years, and up to date with the most current research efforts Future trends that with have a significant impact on research and design of communication architectures over the next several years
Book Synopsis Design for High Performance, Low Power, and Reliable 3D Integrated Circuits by : Sung Kyu Lim
Download or read book Design for High Performance, Low Power, and Reliable 3D Integrated Circuits written by Sung Kyu Lim and published by Springer Science & Business Media. This book was released on 2012-11-27 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Download or read book Electroplating written by Darwin Sebayang and published by BoD – Books on Demand. This book was released on 2012-04-11 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book emphasizes on new applications of electroplating with consideration for environmental aspect and experimental design. Written by experienced expert from various countries, the authors come from academia and electroplating industrial players. Here, a very detailed explanation to the new application of the electroplating is followed by a solution of the environmental issue caused by the electroplating process and concluded by experimental design for optimization of electro deposition processes. Coverage included: 1) Preparation NiO catalyst on FeCrAl Subtrate Using Various Technique at Higher Oxidation Process 2) Electrochemical properties of carbon- supported metal nanoparticle prepared by electroplating methods 3) Fabrication of InGaN-Based Vertical Light Emitting Diodes Using Electroplating 4) Integration Of Electrografted Layers for the Metallization of Deep Through Silicon Vias 5) Biomass adsorbent for removal of toxic metal ions from electroplating industry wastewater 6) Resistant fungal biodiversity of electroplating effluent and their metal tolerance index 7) Experimental design and response surface analysis as available tools for statistical modeling and optimization of electrodeposition processes
Book Synopsis Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International by :
Download or read book Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International written by and published by . This book was released on 1998 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
