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Proceedings Of The 26th International Conference Mixed Design Of Integrated Circuits And Systems
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Book Synopsis Proceedings of the 27th International Conference on Systems Engineering, ICSEng 2020 by : Henry Selvaraj
Download or read book Proceedings of the 27th International Conference on Systems Engineering, ICSEng 2020 written by Henry Selvaraj and published by Springer Nature. This book was released on 2021-01-06 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers topics such as AeroSpace Systems, Intelligent Systems, Machine Learning and Analytics, Internet of Things, Applied Media Informatics and Technology, Adaptive Control Systems, Software Engineering and Cyber-Physical Systems. Research in the discipline of Systems Engineering is an important concept in the advancement of engineering and information sciences. Systems Engineering attempts to integrate many of the traditional engineering disciplines to solve large complex functioning engineering systems, dependent on components from all the disciplines. The research papers contained in these proceedings reflect the state of the art in Systems Engineering from all over the world and serve as vital references to researchers to follow. This book is a very good resource for graduate students, researchers and scholars who want to learn about the most recent development in the fields.
Book Synopsis Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology by : Luciano Lavagno
Download or read book Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Book Synopsis CMOS Indoor Light Energy Harvesting System for Wireless Sensing Applications by : Carlos Manuel Ferreira Carvalho
Download or read book CMOS Indoor Light Energy Harvesting System for Wireless Sensing Applications written by Carlos Manuel Ferreira Carvalho and published by Springer. This book was released on 2015-07-30 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses in detail the CMOS implementation of energy harvesting. The authors describe an integrated, indoor light energy harvesting system, based on a controller circuit that dynamically and automatically adjusts its operation to meet the actual light circumstances of the environment where the system is placed. The system is intended to power a sensor node, enabling an autonomous wireless sensor network (WSN). Although designed to cope with indoor light levels, the system is also able to work with higher levels, making it an all-round light energy harvesting system. The discussion includes experimental data obtained from an integrated manufactured prototype, which in conjunction with a photovoltaic (PV) cell, serves as a proof of concept of the desired energy harvesting system.
Book Synopsis Three-Dimensional Integrated Circuit Design by : Yuan Xie
Download or read book Three-Dimensional Integrated Circuit Design written by Yuan Xie and published by Springer Science & Business Media. This book was released on 2009-12-02 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Book Synopsis Applications of Machine intelligence in Engineering by : Jyotsna Kumar Mandal
Download or read book Applications of Machine intelligence in Engineering written by Jyotsna Kumar Mandal and published by CRC Press. This book was released on 2022-04-21 with total page 1033 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Global Conference on Artificial Intelligence and Applications (GCAIA 2021) provides a prominent venue for researchers, engineers, entrepreneurs, and scholar students to share their research ideas in the area of AI. Academic researchers would reveal the results and conclusions of laboratory based investigations via the GCAIA 21 platform, which bridges the gap between academia, industry, and government ethics. The GCAIA 21 platform will also bring together regional and worldwide issues to explore current advancements in contemporary Computation Intelligence. This Conference Proceedings volume contains the written versions of most of the contributions presented during the conference of GCAIA 2021. The conference has provided an excellent chance for researchers from diverse locations to present and debate their work in the field of artificial intelligence and its applications. It includes a selection of 62 papers. All accepted papers were subjected to strict peer-review by 2–4 expert referees. The papers have been selected for this volume because of their quality and their relevance to the theme of the conference.
Book Synopsis Three Dimensional System Integration by : Antonis Papanikolaou
Download or read book Three Dimensional System Integration written by Antonis Papanikolaou and published by Springer Science & Business Media. This book was released on 2010-12-07 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Book Synopsis Research Perspectives on Dynamic Translinear and Log-Domain Circuits by : Wouter A. Serdijn
Download or read book Research Perspectives on Dynamic Translinear and Log-Domain Circuits written by Wouter A. Serdijn and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 141 pages. Available in PDF, EPUB and Kindle. Book excerpt: The area of analog integrated circuits is facing some serious challenges due to the ongoing trends towards low supply voltages, low power consumption and high-frequency operation. The situation is becoming even more complicated by the fact that many transfer functions have to be tunable or controllable. A promising approach to facing these challenges is given by the class of dynamic translinear circuits, which are, as a consequence, receiving increasing interest. Several different names are used in literature: log-domain, exponential state-space, current-mode companding, instantaneous companding, tanh-domain, sinh-domain, polynomial state-space, square-root domain and translinear filters. In fact, all these groups are (overlapping) subclasses of the overall class of dynamic translinear circuits. Research Perspectives on Dynamic Translinear and Log-Domain Circuits is a compilation of research findings in this growing field. It comprises ten contributions, coming from recognized `dynamic-translinear' researchers in Europe and North America. Research Perspectives on Dynamic Translinear and Log-Domain Circuits is an edited volume of original research.
Book Synopsis EDA for IC Implementation, Circuit Design, and Process Technology by : Luciano Lavagno
Download or read book EDA for IC Implementation, Circuit Design, and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2018-10-03 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
Book Synopsis Languages, Design Methods, and Tools for Electronic System Design by : Tom J. Kazmierski
Download or read book Languages, Design Methods, and Tools for Electronic System Design written by Tom J. Kazmierski and published by Springer Nature. This book was released on 2019-12-20 with total page 197 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book brings together a selection of the best papers from the twenty-first edition of the Forum on specification and Design Languages Conference (FDL), which took place on September 10-12, 2018, in Munich, Germany. FDL is a well-established international forum devoted to dissemination of research results, practical experiences and new ideas in the application of specification, design and verification languages to the design, modeling and verification of integrated circuits, complex hardware/software embedded systems, and mixed-technology systems. Covers Assertion Based Design, Verification & Debug; Includes language-based modeling and design techniques for embedded systems; Covers design, modeling and verification of mixed physical domain and mixed signal systems that include significant analog parts in electrical and non-electrical domains; Includes formal and semi-formal system level design methods for complex embedded systems based on the Unified Modelling Language (UML) and Model Driven Engineering (MDE).
Book Synopsis Biometry by : Ricardo A. Ramirez-Mendoza
Download or read book Biometry written by Ricardo A. Ramirez-Mendoza and published by CRC Press. This book was released on 2022-07-07 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt: Biometrics provide quantitative representations of human features, physiological and behavioral. This book is a compilation of biometric technologies developed by various research groups in Tecnologico de Monterrey, Mexico. It provides a summary of biometric systems as a whole, explaining the principles behind physiological and behavioral biometrics and exploring different types of commercial and experimental technologies and current and future applications in the fields of security, military, criminology, healthcare education, business, and marketing. Examples of biometric systems using brain signals or electroencephalography (EEG) are given. Mobile and home EEG use in children’s natural environments is covered. At the same time, some examples focus on the relevance of such technology in monitoring epileptic encephalopathies in children. Using reliable physiological signal acquisition techniques, functional Human Machine Interfaces (HMI) and Brain-Computer Interfaces (BCI) become possible. This is the case of an HMI used for assistive navigation systems, controlled via voice commands, head, and eye movements. A detailed description of the BCI framework is presented, and applications of user-centered BCIs, oriented towards rehabilitation, human performance, and treatment monitoring are explored. Massive data acquisition also plays an essential role in the evolution of biometric systems. Machine learning, deep learning, and Artificial Intelligence (AI) are crucial allies here. They allow the construction of models that can aid in early diagnosis, seizure detection, and data-centered medical decisions. Such techniques will eventually lead to a more concise understanding of humans.
Book Synopsis Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs by : Balsha R. Stanisic
Download or read book Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs written by Balsha R. Stanisic and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.
Book Synopsis Electronics for Sensors by : Giuseppe Ferri
Download or read book Electronics for Sensors written by Giuseppe Ferri and published by MDPI. This book was released on 2021-08-16 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: The aim of this Special Issue is to explore new advanced solutions in electronic systems and interfaces to be employed in sensors, describing best practices, implementations, and applications. The selected papers in particular concern photomultiplier tubes (PMTs) and silicon photomultipliers (SiPMs) interfaces and applications, techniques for monitoring radiation levels, electronics for biomedical applications, design and applications of time-to-digital converters, interfaces for image sensors, and general-purpose theory and topologies for electronic interfaces.
Book Synopsis Adaptive Techniques for Dynamic Processor Optimization by : Alice Wang
Download or read book Adaptive Techniques for Dynamic Processor Optimization written by Alice Wang and published by Springer Science & Business Media. This book was released on 2008-07-23 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is about various adaptive and dynamic techniques used to optimize processor power and performance. It is based on a very successful forum at ISSCC which focused on Adaptive Techniques. The book looks at the underlying process technology for adaptive designs and then examines different circuits, architecture and software that address the different aspects. The chapters are written by people both in academia and the industry to show the scope of alternative practices.
Download or read book Latchup written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2008-04-15 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interest in latchup is being renewed with the evolution of complimentary metal-oxide semiconductor (CMOS) technology, metal-oxide-semiconductor field-effect transistor (MOSFET) scaling, and high-level system-on-chip (SOC) integration. Clear methodologies that grant protection from latchup, with insight into the physics, technology and circuit issues involved, are in increasing demand. This book describes CMOS and BiCMOS semiconductor technology and their sensitivity to present day latchup phenomena, from basic over-voltage and over-current conditions, single event latchup (SEL) and cable discharge events (CDE), to latchup domino phenomena. It contains chapters focusing on bipolar physics, latchup theory, latchup and guard ring characterization structures, characterization testing, product level test systems, product level testing and experimental results. Discussions on state-of-the-art semiconductor processes, design layout, and circuit level and system level latchup solutions are also included, as well as: latchup semiconductor process solutions for both CMOS to BiCMOS, such as shallow trench, deep trench, retrograde wells, connecting implants, sub-collectors, heavily-doped buried layers, and buried grids – from single- to triple-well CMOS; practical latchup design methods, automated and bench-level latchup testing methods and techniques, latchup theory of logarithm resistance space, generalized alpha (a) space, beta (b) space, new latchup design methods– connecting the theoretical to the practical analysis, and; examples of latchup computer aided design (CAD) methodologies, from design rule checking (DRC) and logical-to-physical design, to new latchup CAD methodologies that address latchup for internal and external latchup on a local as well as global design level. Latchup acts as a companion text to the author’s series of books on ESD (electrostatic discharge) protection, serving as an invaluable reference for the professional semiconductor chip and system-level ESD engineer. Semiconductor device, process and circuit designers, and quality, reliability and failure analysis engineers will find it informative on the issues that confront modern CMOS technology. Practitioners in the automotive and aerospace industries will also find it useful. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, computer aided design and design integration.
Book Synopsis Thermal and Electro-thermal System Simulation 2020 by : Márta Rencz
Download or read book Thermal and Electro-thermal System Simulation 2020 written by Márta Rencz and published by MDPI. This book was released on 2021-01-12 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Book Synopsis Noise Coupling in System-on-Chip by : Thomas Noulis
Download or read book Noise Coupling in System-on-Chip written by Thomas Noulis and published by CRC Press. This book was released on 2018-01-09 with total page 555 pages. Available in PDF, EPUB and Kindle. Book excerpt: Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Book Synopsis Logic Synthesis for FPGA-Based Control Units by : Alexander Barkalov
Download or read book Logic Synthesis for FPGA-Based Control Units written by Alexander Barkalov and published by Springer Nature. This book was released on 2020-01-08 with total page 257 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on control units, which are a vital part of modern digital systems, and responsible for the efficiency of controlled systems. The model of a finite state machine (FSM) is often used to represent the behavior of a control unit. As a rule, control units have irregular structures that make it impossible to design their logic circuits using the standard library cells. Design methods depend strongly on such factors as the FSM used, specific features of the logic elements implemented in the FSM logic circuit, and the characteristics of the control algorithm to be interpreted. This book discusses Moore and Mealy FSMs implemented with FPGA chips, including look-up table elements (LUT) and embedded memory blocks (EMB). It is crucial to minimize the number of LUTs and EMBs in an FSM logic circuit, as well as to make the interconnections between the logic elements more regular, and various methods of structural decompositions can be used to solve this problem. These methods are reduced to the presentation of an FSM circuit as a composition of different logic blocks, the majority of which implement systems of intermediate logic functions different (and much simpler) than input memory functions and FSM output functions. The structural decomposition results in multilevel FSM circuits having fewer logic elements than equivalent single-level circuits. The book describes well-known methods of structural decomposition and proposes new ones, examining their impact on the final amount of hardware in an FSM circuit. It is of interest to students and postgraduates in the area of Computer Science, as well as experts involved in designing digital systems with complex control units. The proposed models and design methods open new possibilities for creating logic circuits of control units with an optimal amount of hardware and regular interconnections.
