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Author :
Publisher :
ISBN 13 :
Total Pages : 294 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings, 2002 International Conference on Advanced Packaging and Systems written by and published by . This book was released on 2002 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 : 9780930815653
Total Pages : 0 pages
Book Rating : 4.8/5 (156 download)
Download or read book Proceedings, 2002 International Conference on Advanced Packaging and Systems written by and published by . This book was released on 2002 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 992 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings of the ... International Symposium on Microelectronics written by and published by . This book was released on 2002 with total page 992 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Aboul Ella Hassanien
Publisher : Springer Nature
ISBN 13 : 303089701X
Total Pages : 412 pages
Book Rating : 4.0/5 (38 download)
Download or read book Proceedings of the International Conference on Advanced Intelligent Systems and Informatics 2021 written by Aboul Ella Hassanien and published by Springer Nature. This book was released on 2021-11-08 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: This proceeding book constitutes the refereed proceedings of the 7th International Conference on Advanced Intelligent Systems and Informatics (AISI 2021), which took place in Cairo, Egypt, during December 11-13, 2021, and is an international interdisciplinary conference that presents a spectrum of scientific research on all aspects of informatics and intelligent systems, technologies, and applications.
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Chi-hau Chen
Publisher : World Scientific
ISBN 13 : 9812704094
Total Pages : 682 pages
Book Rating : 4.8/5 (127 download)
Download or read book Ultrasonic and Advanced Methods for Nondestructive Testing and Material Characterization written by Chi-hau Chen and published by World Scientific. This book was released on 2007 with total page 682 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultrasonic methods have been very popular in nondestructive testing and characterization of materials. This book deals with both industrial ultrasound and medical ultrasound. The advantages of ultrasound include flexibility, low cost, in-line operation, and providing data in both signal and image formats for further analysis. The book devotes 11 chapters to ultrasonic methods. However, ultrasonic methods can be much less effective with some applications. So the book also has 14 chapters catering to other or advanced methods for nondestructive testing or material characterization. Topics like structural health monitoring, Terahertz methods, X-ray and thermography methods are presented. Besides different sensors for nondestructive testing, the book places much emphasis on signal/image processing and pattern recognition of the signals acquired.
Author :
Publisher :
ISBN 13 :
Total Pages : 988 pages
Book Rating : 4.:/5 (318 download)
Download or read book 2002 International Symposium on Microelectronics written by and published by . This book was released on 2002 with total page 988 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Richard K. Ulrich
Publisher : John Wiley & Sons
ISBN 13 : 0471466093
Total Pages : 852 pages
Book Rating : 4.4/5 (714 download)
Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Author : James E. Morris
Publisher : Springer
ISBN 13 : 3319903624
Total Pages : 1007 pages
Book Rating : 4.3/5 (199 download)
Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 1007 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author : Karl J. Puttlitz
Publisher : CRC Press
ISBN 13 : 082475249X
Total Pages : 1044 pages
Book Rating : 4.8/5 (247 download)
Download or read book Handbook of Lead-Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
Author : British Library. Document Supply Centre
Publisher :
ISBN 13 :
Total Pages : 870 pages
Book Rating : 4.F/5 ( download)
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2003 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Philip Garrou
Publisher : John Wiley & Sons
ISBN 13 : 352762306X
Total Pages : 798 pages
Book Rating : 4.5/5 (276 download)
Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Author : Peter Ramm
Publisher : John Wiley & Sons
ISBN 13 : 3527326464
Total Pages : 435 pages
Book Rating : 4.5/5 (273 download)
Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2012-02-13 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Author : Renatas Jakushokas
Publisher : Springer Science & Business Media
ISBN 13 : 1441978712
Total Pages : 636 pages
Book Rating : 4.4/5 (419 download)
Download or read book Power Distribution Networks with On-Chip Decoupling Capacitors written by Renatas Jakushokas and published by Springer Science & Business Media. This book was released on 2010-11-23 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this second edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Author : Mikhail Popovich
Publisher : Springer Science & Business Media
ISBN 13 : 0387716017
Total Pages : 532 pages
Book Rating : 4.3/5 (877 download)
Download or read book Power Distribution Networks with On-Chip Decoupling Capacitors written by Mikhail Popovich and published by Springer Science & Business Media. This book was released on 2007-10-08 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides insight into the behavior and design of power distribution systems for high speed, high complexity integrated circuits. Also presented are criteria for estimating minimum required on-chip decoupling capacitance. Techniques and algorithms for computer-aided design of on-chip power distribution networks are also described; however, the emphasis is on developing circuit intuition and understanding the principles that govern the design and operation of power distribution systems.
Author : Nam-Trung Nguyen
Publisher : Artech House
ISBN 13 : 1630813656
Total Pages : 576 pages
Book Rating : 4.6/5 (38 download)
Download or read book Fundamentals and Applications of Microfluidics, Third Edition written by Nam-Trung Nguyen and published by Artech House. This book was released on 2019-01-31 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Now in its Third Edition, the Artech House bestseller, Fundamentals and Applications of Microfluidics, provides engineers and students with the most complete and current coverage of this cutting-edge field. This revised and expanded edition provides updated discussions throughout and features critical new material on microfluidic power sources, sensors, cell separation, organ-on-chip and drug delivery systems, 3D culture devices, droplet-based chemical synthesis, paper-based microfluidics for point-of-care, ion concentration polarization, micro-optofluidics and micro-magnetofluidics. The book shows how to take advantage of the performance benefits of microfluidics and serves as an instant reference for state-of-the-art microfluidics technology and applications. Readers find discussions on a wide range of applications, including fluid control devices, gas and fluid measurement devices, medical testing equipment, and implantable drug pumps. Professionals get practical guidance in choosing the best fabrication and enabling technology for a specific microfluidic application, and learn how to design a microfluidic device. Moreover, engineers get simple calculations, ready-to-use data tables, and rules of thumb that help them make design decisions and determine device characteristics quickly.
Author : Dimitris Gritzalis
Publisher : Springer
ISBN 13 : 3030000249
Total Pages : 313 pages
Book Rating : 4.0/5 (3 download)
Download or read book Critical Infrastructure Security and Resilience written by Dimitris Gritzalis and published by Springer. This book was released on 2019-01-01 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the latest trends in attacks and protection methods of Critical Infrastructures. It describes original research models and applied solutions for protecting major emerging threats in Critical Infrastructures and their underlying networks. It presents a number of emerging endeavors, from newly adopted technical expertise in industrial security to efficient modeling and implementation of attacks and relevant security measures in industrial control systems; including advancements in hardware and services security, interdependency networks, risk analysis, and control systems security along with their underlying protocols. Novel attacks against Critical Infrastructures (CI) demand novel security solutions. Simply adding more of what is done already (e.g. more thorough risk assessments, more expensive Intrusion Prevention/Detection Systems, more efficient firewalls, etc.) is simply not enough against threats and attacks that seem to have evolved beyond modern analyses and protection methods. The knowledge presented here will help Critical Infrastructure authorities, security officers, Industrial Control Systems (ICS) personnel and relevant researchers to (i) get acquainted with advancements in the field, (ii) integrate security research into their industrial or research work, (iii) evolve current practices in modeling and analyzing Critical Infrastructures, and (iv) moderate potential crises and emergencies influencing or emerging from Critical Infrastructures.
