Book Synopsis Proceedings by :
Download or read book Proceedings written by and published by . This book was released on 1997 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings by :
Proceedings 1997 Ieee Multi Chip Module Conference
Download Proceedings 1997 Ieee Multi Chip Module Conference full books in PDF, epub, and Kindle. Read online Proceedings 1997 Ieee Multi Chip Module Conference ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Book Synopsis Proceedings by :
Author : IEEE Computer Society
Publisher : IEEE Computer Society
ISBN 13 : 9780818677892
Total Pages : 171 pages
Book Rating : 4.6/5 (778 download)
Book Synopsis Proceedings, 1997 IEEE Multi-Chip Module Conference by : IEEE Computer Society
Download or read book Proceedings, 1997 IEEE Multi-Chip Module Conference written by IEEE Computer Society and published by IEEE Computer Society. This book was released on 1997-01-01 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Computer Society Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Book Synopsis Multi-Chip Module Conference, 1997 IEEE (MCMC-97). by : IEEE Computer Society Staff
Download or read book Multi-Chip Module Conference, 1997 IEEE (MCMC-97). written by IEEE Computer Society Staff and published by . This book was released on 1997 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : IEEE Computer Society
ISBN 13 : 9780818672866
Total Pages : 209 pages
Book Rating : 4.6/5 (728 download)
Book Synopsis Proceedings by :
Download or read book Proceedings written by and published by IEEE Computer Society. This book was released on 1996-01-01 with total page 209 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 : 9780780337879
Total Pages : 379 pages
Book Rating : 4.3/5 (378 download)
Book Synopsis Proceedings by :
Download or read book Proceedings written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 379 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text on multi-chip modules, covers such topics as: micro/chip scale packaging; low cost MCM-L technology; design and manufacture; markets and infrastructure; flip chip and CSP; interconnect technologies; known good die; and modelling and analysis.
Author :
Publisher :
ISBN 13 : 9780818627279
Total Pages : 181 pages
Book Rating : 4.6/5 (272 download)
Book Synopsis Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92 by :
Download or read book Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92 written by and published by . This book was released on 1992 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9780818655623
Total Pages : 150 pages
Book Rating : 4.6/5 (556 download)
Book Synopsis 1994 IEEE Multi-Chip Module Conference by :
Download or read book 1994 IEEE Multi-Chip Module Conference written by and published by . This book was released on 1994 with total page 150 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 1994 IEEE Multi-Chip Module Conference MCMC 1994 by :
Download or read book 1994 IEEE Multi-Chip Module Conference MCMC 1994 written by and published by . This book was released on 1994 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9780818669729
Total Pages : 233 pages
Book Rating : 4.6/5 (697 download)
Book Synopsis Proceedings, 1995 IEEE Multi-Chip Module Conference, January 31-February 2, 1995, Santa Cruz, California by :
Download or read book Proceedings, 1995 IEEE Multi-Chip Module Conference, January 31-February 2, 1995, Santa Cruz, California written by and published by . This book was released on 1994 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 1996 IEEE Multi-Chip Module Conference by :
Download or read book 1996 IEEE Multi-Chip Module Conference written by and published by . This book was released on 1996 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : IEEE Computer Society
ISBN 13 : 9780818635403
Total Pages : 203 pages
Book Rating : 4.6/5 (354 download)
Book Synopsis Proceedings, 1993 IEEE Multi-Chip Module Conference by :
Download or read book Proceedings, 1993 IEEE Multi-Chip Module Conference written by and published by IEEE Computer Society. This book was released on 1993 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt: Papers delivered at the Santa Cruz, Calif. meeting held 15-18 March, 1993 (under multiple sponsorship) on high speed systems, infrastructure, new technology, test and reliability, interconnect modelling and analysis, and design of multichip modules. As usual the Computer Society Press has published without an index (though quickly--which is a great virtue). Annotation copyright by Book News, Inc., Portland, OR
Book Synopsis 1995 IEEE Multi-Chip Module Conference by :
Download or read book 1995 IEEE Multi-Chip Module Conference written by and published by . This book was released on 1994 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 1992 IEEE Multi-Chip Module Conference, MCMC-92 by :
Download or read book 1992 IEEE Multi-Chip Module Conference, MCMC-92 written by and published by . This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Institute of Electrical and Electronics Engineers, Inc. Staff
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (131 download)
Book Synopsis Multi-Chip Module Conference (MCMC-92 by : Institute of Electrical and Electronics Engineers, Inc. Staff
Download or read book Multi-Chip Module Conference (MCMC-92 written by Institute of Electrical and Electronics Engineers, Inc. Staff and published by . This book was released on 1992 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yervant Zorian
Publisher : Springer Science & Business Media
ISBN 13 : 1461561078
Total Pages : 161 pages
Book Rating : 4.4/5 (615 download)
Book Synopsis Multi-Chip Module Test Strategies by : Yervant Zorian
Download or read book Multi-Chip Module Test Strategies written by Yervant Zorian and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Author : José Pineda de Gyvez
Publisher : John Wiley & Sons
ISBN 13 : 0780334477
Total Pages : 338 pages
Book Rating : 4.7/5 (83 download)
Book Synopsis Integrated Circuit Manufacturability by : José Pineda de Gyvez
Download or read book Integrated Circuit Manufacturability written by José Pineda de Gyvez and published by John Wiley & Sons. This book was released on 1998-10-30 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: "INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."
Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
ISBN 13 : 1461513898
Total Pages : 1250 pages
Book Rating : 4.4/5 (615 download)
Book Synopsis Area Array Interconnection Handbook by : Karl J. Puttlitz
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
