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Author :
Publisher :
ISBN 13 :
Total Pages : 286 pages
Book Rating : 4.3/5 (91 download)
Download or read book Photonics Packaging, Integration, and Interconnects written by and published by . This book was released on 2007 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Alexei L. Glebov
Publisher : Society of Photo Optical
ISBN 13 : 9780819474674
Total Pages : 312 pages
Book Rating : 4.4/5 (746 download)
Download or read book Photonics Packaging, Integration, and Interconnects IX written by Alexei L. Glebov and published by Society of Photo Optical. This book was released on 2009 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Download or read book Photonics Packaging, Integration, and Interconnects IX written by and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Lukas Chrostowski
Publisher : CRC Press
ISBN 13 : 1351832263
Total Pages : 227 pages
Book Rating : 4.3/5 (518 download)
Download or read book High-Speed Photonics Interconnects written by Lukas Chrostowski and published by CRC Press. This book was released on 2017-12-19 with total page 227 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed Photonics Interconnects explores some of the groundbreaking technologies and applications that are based on photonics interconnects. From the Evolution of High-Speed I/O Circuits to the Latest in Photonics Interconnects Packaging and Lasers Featuring contributions by experts from academia and industry, the book brings together in one volume cutting-edge research on various aspects of high-speed photonics interconnects. Contributors delve into a wide range of technologies, from the evolution of high-speed input/output (I/O) circuits to recent trends in photonics interconnects packaging. The book discusses the challenges associated with scaling I/O data rates and current design techniques. It also describes the major high-speed components, channel properties, and performance metrics. The book exposes readers to a myriad of applications enabled by photonics interconnects technology. Learn about Optical Interconnect Technologies Suitable for High-Density Integration with CMOS Chips This richly illustrated work details how optical interchip communication links have the potential to fully leverage increased data rates provided through complementary metal-oxide semiconductor (CMOS) technology scaling at suitable power-efficiency levels. Keeping the mathematics to a minimum, it gives engineers, researchers, graduate students, and entrepreneurs a comprehensive overview of the dynamic landscape of high-speed photonics interconnects.
Author : Allen M. Earman
Publisher : Society of Photo Optical
ISBN 13 : 9780819465917
Total Pages : 274 pages
Book Rating : 4.4/5 (659 download)
Download or read book Photonics Packaging, Integration, and Interconnects VII written by Allen M. Earman and published by Society of Photo Optical. This book was released on 2007 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author :
Publisher :
ISBN 13 :
Total Pages : 272 pages
Book Rating : 4.3/5 (91 download)
Download or read book Photonics Packaging and Integration written by and published by . This book was released on 2003 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Alexei L. Glebov
Publisher : Society of Photo Optical
ISBN 13 : 9780819470744
Total Pages : 364 pages
Book Rating : 4.4/5 (77 download)
Download or read book Photonics Packaging, Integration, and Interconnects VIII written by Alexei L. Glebov and published by Society of Photo Optical. This book was released on 2008-01-01 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Author : Michael R. Feldman
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 440 pages
Book Rating : 4.F/5 ( download)
Download or read book Optoelectronic Interconnects VII ; Photonics Packaging and Integration II written by Michael R. Feldman and published by SPIE-International Society for Optical Engineering. This book was released on 2000 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Madeleine Glick
Publisher : Elsevier
ISBN 13 : 032391831X
Total Pages : 523 pages
Book Rating : 4.3/5 (239 download)
Download or read book Integrated Photonics for Data Communication Applications written by Madeleine Glick and published by Elsevier. This book was released on 2023-07-26 with total page 523 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance. Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances. Includes contributions from leading experts and end-users across academia and industry working on the most exciting research directions of integrated photonics for data communications applications Provides an overview of data communication-specific integrated photonics starting from fundamental building block devices to photonic integrated circuits to manufacturing tools and processes Presents key performance metrics, design principles, performance impact of manufacturing variations and operating conditions, as well as pivotal performance benchmarks
Author : Gabriela Nicolescu
Publisher : CRC Press
ISBN 13 : 1000793370
Total Pages : 453 pages
Book Rating : 4.0/5 (7 download)
Download or read book Photonic Interconnects for Computing Systems written by Gabriela Nicolescu and published by CRC Press. This book was released on 2022-09-01 with total page 453 pages. Available in PDF, EPUB and Kindle. Book excerpt: In recent years, there has been a considerable amount of effort, both in industry and academia, focusing on the design, implementation, performance analysis, evaluation and prediction of silicon photonic interconnects for inter- and intra-chip communication, paving the way for the design and dimensioning of the next and future generation of high-performance computing systems. Photonic Interconnects for Computing Systems provides a comprehensive overview of the current state-of-the-art technology and research achievements in employing silicon photonics for interconnection networks and high-performance computing, summarizing main opportunities and some challenges. The majority of the chapters were collected from presentations made at the International Workshop on Optical/Photonic Interconnects for Computing Systems (OPTICS) held over the past two years. The workshop invites internationally recognized speakers on the range of topics relevant to silicon photonics and computing systems. Technical topics discussed in the book include:Design and Implementation of Chip-Scale Photonic Interconnects;Developing Design Automation Solutions for Chip-Scale Photonic Interconnects;Design Space Exploration in Chip-Scale Photonic Interconnects;Thermal Analysis and Modeling in Photonic Interconnects;Design for Reliability;Fabrication Non-Uniformity in Photonic Interconnects;Photonic Interconnects for Computing Systems presents a compilation of outstanding contributions from leading research groups in the field. It presents a comprehensive overview of the design, advantages, challenges, and requirements of photonic interconnects for computing systems. The selected contributions present important discussions and approaches related to the design and development of novel photonic interconnect architectures, as well as various design solutions to improve the performance of such systems while considering different challenges. The book is ideal for personnel in computer/photonic industries as well as academic staff and master/graduate students in computer science and engineering, electronic engineering, electrical engineering and photonics.
Author : Tolga Tekin
Publisher : Woodhead Publishing
ISBN 13 : 008100513X
Total Pages : 431 pages
Book Rating : 4.0/5 (81 download)
Download or read book Optical Interconnects for Data Centers written by Tolga Tekin and published by Woodhead Publishing. This book was released on 2016-11-01 with total page 431 pages. Available in PDF, EPUB and Kindle. Book excerpt: Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic
Author : William Greig
Publisher : Springer Science & Business Media
ISBN 13 : 0387339132
Total Pages : 312 pages
Book Rating : 4.3/5 (873 download)
Download or read book Integrated Circuit Packaging, Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Author : Koji Yamada
Publisher : Frontiers Media SA
ISBN 13 : 2889196933
Total Pages : 111 pages
Book Rating : 4.8/5 (891 download)
Download or read book Photonic Integration and Photonics-Electronics Convergence on Silicon Platform written by Koji Yamada and published by Frontiers Media SA. This book was released on 2015-11-10 with total page 111 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon photonics technology, which has the DNA of silicon electronics technology, promises to provide a compact photonic integration platform with high integration density, mass-producibility, and excellent cost performance. This technology has been used to develop and to integrate various photonic functions on silicon substrate. Moreover, photonics-electronics convergence based on silicon substrate is now being pursued. Thanks to these features, silicon photonics will have the potential to be a superior technology used in the construction of energy-efficient cost-effective apparatuses for various applications, such as communications, information processing, and sensing. Considering the material characteristics of silicon and difficulties in microfabrication technology, however, silicon by itself is not necessarily an ideal material. For example, silicon is not suitable for light emitting devices because it is an indirect transition material. The resolution and dynamic range of silicon-based interference devices, such as wavelength filters, are significantly limited by fabrication errors in microfabrication processes. For further performance improvement, therefore, various assisting materials, such as indium-phosphide, silicon-nitride, germanium-tin, are now being imported into silicon photonics by using various heterogeneous integration technologies, such as low-temperature film deposition and wafer/die bonding. These assisting materials and heterogeneous integration technologies would also expand the application field of silicon photonics technology. Fortunately, silicon photonics technology has superior flexibility and robustness for heterogeneous integration. Moreover, along with photonic functions, silicon photonics technology has an ability of integration of electronic functions. In other words, we are on the verge of obtaining an ultimate technology that can integrate all photonic and electronic functions on a single Si chip. This e-Book aims at covering recent developments of the silicon photonic platform and novel functionalities with heterogeneous material integrations on this platform.
Author :
Publisher : American Society of Mechanical Engineers
ISBN 13 :
Total Pages : 632 pages
Book Rating : 4.3/5 (91 download)
Download or read book Electronic and Photonic Packaging, Integration and Packaging of Micro/nano/electronic Systems--2005 written by and published by American Society of Mechanical Engineers. This book was released on 2005 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Wensheng Zhao
Publisher : Mdpi AG
ISBN 13 : 9783036567334
Total Pages : 0 pages
Book Rating : 4.5/5 (673 download)
Download or read book Advanced Interconnect and Packaging written by Wensheng Zhao and published by Mdpi AG. This book was released on 2023-02-20 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated circuits. To resolve these interconnect problems, various emerging technologies, including airgap, nanocarbon, optical, and through-silicon via (TSV), have been proposed and investigated. For example, by virtue of TSV technology, dies can be stacked to increase the integration density. More importantly, 3D integration and packaging also offer the most promising platform to implement "More-than-Moore" technologies, providing heterogeneous materials and technologies on a single chip. The "Advanced Interconnect and Packaging" Special Issue seeks to showcase research papers on new developments in advanced interconnect and packaging, i.e., on the design, modeling, fabrication, and reliability assessment of emerging interconnect and packaging technologies. Additionally, there are two interesting papers on carbon nanotube interconnects and interconnect reliability issues.
Author : Hugo Thienpont
Publisher : Society of Photo Optical
ISBN 13 : 9780819462411
Total Pages : 516 pages
Book Rating : 4.4/5 (624 download)
Download or read book Micro-optics, VCSELs, and Photonic Interconnects II written by Hugo Thienpont and published by Society of Photo Optical. This book was released on 2006 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119314135
Total Pages : 576 pages
Book Rating : 4.1/5 (193 download)
Download or read book Advances in Embedded and Fan-Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-12 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
