Optoelectronic Packaging

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Introduction to Microsystem Packaging Technology

Author : Yufeng Jin
Publisher : CRC Press
ISBN 13 : 1439865973
Total Pages : 232 pages
Book Rating : 4.4/5 (398 download)

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Book Synopsis Introduction to Microsystem Packaging Technology by : Yufeng Jin

Download or read book Introduction to Microsystem Packaging Technology written by Yufeng Jin and published by CRC Press. This book was released on 2017-12-19 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

Materials in Microelectronic and Optoelectronic Packaging

Author : Hung C. Ling
Publisher :
ISBN 13 :
Total Pages : 490 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Materials in Microelectronic and Optoelectronic Packaging by : Hung C. Ling

Download or read book Materials in Microelectronic and Optoelectronic Packaging written by Hung C. Ling and published by . This book was released on 1993 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Optoelectronic Packaging

Author : Michael R. Feldman
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 212 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Optoelectronic Packaging by : Michael R. Feldman

Download or read book Optoelectronic Packaging written by Michael R. Feldman and published by SPIE-International Society for Optical Engineering. This book was released on 1996 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Microelectronics Packaging Handbook

Author : Rao Tummala
Publisher : Springer Science & Business Media
ISBN 13 : 9780412084515
Total Pages : 662 pages
Book Rating : 4.0/5 (845 download)

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Book Synopsis Microelectronics Packaging Handbook by : Rao Tummala

Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Handbook of Optoelectronics (Two-Volume Set)

Author : John P. Dakin
Publisher : CRC Press
ISBN 13 : 9780750306461
Total Pages : 832 pages
Book Rating : 4.3/5 (64 download)

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Book Synopsis Handbook of Optoelectronics (Two-Volume Set) by : John P. Dakin

Download or read book Handbook of Optoelectronics (Two-Volume Set) written by John P. Dakin and published by CRC Press. This book was released on 2006-05-17 with total page 832 pages. Available in PDF, EPUB and Kindle. Book excerpt: A field as diverse as optoelectronics needs a reference that is equally versatile. From basic physics and light sources to devices and state-of-the-art applications, the Handbook of Optoelectronics provides comprehensive, self-contained coverage of fundamental concepts and practical applications across the entire spectrum of disciplines encompassed by optoelectronics. The handbook unifies a broad array of current research areas with a forward-looking focus on systems and applications. Beginning with an introduction to the relevant principles of physics, materials science, engineering, and optics, the book explores the details of optoelectronic devices and techniques including semiconductor lasers, optical detectors and receivers, optical fiber devices, modulators, amplifiers, integrated optics, LEDs, and engineered optical materials. Applications and systems then become the focus, with sections devoted to industrial, medical, and commercial applications, communications, imaging and displays, sensing and data processing, spectroscopic analysis, the art of practical optoelectronics, and future prospects. This extensive resource comprises the efforts of more than 70 world-renowned experts from leading industrial and academic institutions around the world and includes many references to contemporary works. Whether used as a field reference, as a research tool, or as a broad and self-contained introduction to the field, the Handbook of Optoelectronics places everything you need in a unified, conveniently organized format.

MEMS Packaging

Author : Tai-Ran Hsu
Publisher : IET
ISBN 13 : 9780863413353
Total Pages : 310 pages
Book Rating : 4.4/5 (133 download)

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Book Synopsis MEMS Packaging by : Tai-Ran Hsu

Download or read book MEMS Packaging written by Tai-Ran Hsu and published by IET. This book was released on 2004 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the entire spectrum of assembly, packaging and testing of MEMs (microelectro-mechanical systems) and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering.

Photonic Packaging Sourcebook

Author : Ulrich H. P. Fischer-Hirchert
Publisher : Springer
ISBN 13 : 3642253768
Total Pages : 336 pages
Book Rating : 4.6/5 (422 download)

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Book Synopsis Photonic Packaging Sourcebook by : Ulrich H. P. Fischer-Hirchert

Download or read book Photonic Packaging Sourcebook written by Ulrich H. P. Fischer-Hirchert and published by Springer. This book was released on 2015-04-11 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Author : Ephraim Suhir
Publisher : Springer Science & Business Media
ISBN 13 : 0387329897
Total Pages : 1471 pages
Book Rating : 4.3/5 (873 download)

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Book Synopsis Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by : Ephraim Suhir

Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Chip-on-Flex Packaging of Optoelectronic Devices Using Optodic Bonding

Author : Yixiao Wang
Publisher :
ISBN 13 : 9783959003421
Total Pages : pages
Book Rating : 4.0/5 (34 download)

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Book Synopsis Chip-on-Flex Packaging of Optoelectronic Devices Using Optodic Bonding by : Yixiao Wang

Download or read book Chip-on-Flex Packaging of Optoelectronic Devices Using Optodic Bonding written by Yixiao Wang and published by . This book was released on 2019 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Microelectronics Packaging Handbook

Author : R.R. Tummala
Publisher : Springer Science & Business Media
ISBN 13 : 1461560373
Total Pages : 1060 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Microelectronics Packaging Handbook by : R.R. Tummala

Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Photonic Networks, Optical Technology and Infrastructure

Author : D. W. Faulkner
Publisher : IOS Press
ISBN 13 : 9789051993417
Total Pages : 316 pages
Book Rating : 4.9/5 (934 download)

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Book Synopsis Photonic Networks, Optical Technology and Infrastructure by : D. W. Faulkner

Download or read book Photonic Networks, Optical Technology and Infrastructure written by D. W. Faulkner and published by IOS Press. This book was released on 1997 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: All optical networks offer new possibilities for high bandwidth applications. New techniques are demonstrated for optical switching and network management for complex optical networks. WDM systems allow upgrading of the backbone optical network. This work explores the current state of research and future developments of optical network technology and applications. Photonic networks are discussed from a variety of viewpoints, including network analysis, modelling and simulation, active and passive devices, as well as packaging.

Thermal Management for Opto-electronics Packaging and Applications

Author : Xiaobing Luo
Publisher : John Wiley & Sons
ISBN 13 : 1119179270
Total Pages : 373 pages
Book Rating : 4.1/5 (191 download)

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Book Synopsis Thermal Management for Opto-electronics Packaging and Applications by : Xiaobing Luo

Download or read book Thermal Management for Opto-electronics Packaging and Applications written by Xiaobing Luo and published by John Wiley & Sons. This book was released on 2024-08-12 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Optoelectronic Interconnects, Integrated Circuits, and Packaging

Author :
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (686 download)

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Book Synopsis Optoelectronic Interconnects, Integrated Circuits, and Packaging by :

Download or read book Optoelectronic Interconnects, Integrated Circuits, and Packaging written by and published by . This book was released on 2002 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

The Electronic Packaging Handbook

Author : Glenn R. Blackwell
Publisher : CRC Press
ISBN 13 : 1351835548
Total Pages : 937 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell

Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 937 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Materials for Advanced Packaging

Author : Daniel Lu
Publisher : Springer Science & Business Media
ISBN 13 : 0387782192
Total Pages : 723 pages
Book Rating : 4.3/5 (877 download)

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Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer Science & Business Media. This book was released on 2008-12-17 with total page 723 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Introduction to Information Optics

Author : Francis T.S. Yu
Publisher : Elsevier
ISBN 13 : 0080509290
Total Pages : 749 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Introduction to Information Optics by : Francis T.S. Yu

Download or read book Introduction to Information Optics written by Francis T.S. Yu and published by Elsevier. This book was released on 2001-09-12 with total page 749 pages. Available in PDF, EPUB and Kindle. Book excerpt: While there are books treating individual topics contained in this book, this will be the first single volume providing a cohesive treatment on this subject as a whole. This goes beyond optical communications in that it includes related topics such as sensing, displays, computing, and data storage.

Handbook of Materials Selection

Author : Myer Kutz
Publisher : John Wiley & Sons
ISBN 13 : 9780471359241
Total Pages : 1524 pages
Book Rating : 4.3/5 (592 download)

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Book Synopsis Handbook of Materials Selection by : Myer Kutz

Download or read book Handbook of Materials Selection written by Myer Kutz and published by John Wiley & Sons. This book was released on 2002-07-22 with total page 1524 pages. Available in PDF, EPUB and Kindle. Book excerpt: Erstmals in einem Band werden Werkstoffe hier (in zwei getrennten Systemen) sowohl nach ihrer technischen Anwendung als auch nach ihren Eigenschaften geordnet. - Benutzer können deshalb zunächst nach der Gruppe von Materialen suchen, die für eine spezielle Anwendung geeignet sind, und anschließend Details über jedes einzelne Material finden - Suchkriterien sind Eigenschaften wie Wärmeleitfähigkeit, optisches Reflexionsvermögen, Elastizität usw. und Anwendungsgebiete wie Bauwesen, Biomedizin, Fahrzeugbau, Luftfahrttechnik, Elektrotechnik usw. - berücksichtigt werden sowohl herkömmliche Werkstoffe (Eisen- und Nichteisenmetalle, Kunststoffe, Klebstoffe) als auch Kompositwerkstoffe und synthetische Materialen wie Laminate, Fasern und Keramiken