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Multi Chip Module Test Strategies
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Book Synopsis Multi-Chip Module Test Strategies by : Yervant Zorian
Download or read book Multi-Chip Module Test Strategies written by Yervant Zorian and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Book Synopsis Multichip Module Technologies and Alternatives: The Basics by : Daryl Ann Doane
Download or read book Multichip Module Technologies and Alternatives: The Basics written by Daryl Ann Doane and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Book Synopsis Integrated Circuit Manufacturability by : José Pineda de Gyvez
Download or read book Integrated Circuit Manufacturability written by José Pineda de Gyvez and published by John Wiley & Sons. This book was released on 1998-10-30 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: "INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."
Book Synopsis Program Information Package for Defense Technology Conversion, Reinvestment, and Transition Assistance by :
Download or read book Program Information Package for Defense Technology Conversion, Reinvestment, and Transition Assistance written by and published by DIANE Publishing. This book was released on 1994 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt: Addresses defense industry and technology base activities under eight separate statutory authority programs and sets forth planned selection criteria by which proposals received under a future solicitation will be evaluated. Covers: technology reinvestment activities (technology development, technology deployment, and manufacturing education and training), and eligibility and statutory programs. Also, planning for submission of proposals.
Book Synopsis Multichip Module Technology Handbook by : Philip E. Garrou
Download or read book Multichip Module Technology Handbook written by Philip E. Garrou and published by McGraw-Hill Professional Publishing. This book was released on 1998 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: MCMs are electronic components that house multiple integrated circuits (ICs) upon a single chip. Their use in design allow systems that are faster, hotter and more reliable than those built with standalone ICs. More and more, the speed needs of electronic systems require MCMs. This comprehensive handbook aims to provide designers with the knowledge needed to understand and work with MCMs.
Book Synopsis Economics of Electronic Design, Manufacture and Test by : M. Abadir
Download or read book Economics of Electronic Design, Manufacture and Test written by M. Abadir and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt: The general understanding of design is that it should lead to a manufacturable product. Neither the design nor the process of manufacturing is perfect. As a result, the product will be faulty, will require testing and fixing. Where does economics enter this scenario? Consider the cost of testing and fixing the product. If a manufactured product is grossly faulty, or too many of the products are faulty, the cost of testing and fixing will be high. Suppose we do not like that. We then ask what is the cause of the faulty product. There must be something wrong in the manufacturing process. We trace this cause and fix it. Suppose we fix all possible causes and have no defective products. We would have eliminated the need for testing. Unfortunately, things are not so perfect. There is a cost involved with finding and eliminating the causes of faults. We thus have two costs: the cost of testing and fixing (we will call it cost-1), and the cost of finding and eliminating causes of faults (call it cost-2). Both costs, in some way, are included in the overall cost of the product. If we try to eliminate cost-1, cost-2 goes up, and vice versa. An economic system of production will minimize the overall cost of the product. Economics of Electronic Design, Manufacture and Test is a collection of research contributions derived from the Second Workshop on Economics of Design, Manufacture and Test, written for inclusion in this book.
Book Synopsis Conceptual Design of Multichip Modules and Systems by : Peter A. Sandborn
Download or read book Conceptual Design of Multichip Modules and Systems written by Peter A. Sandborn and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
Book Synopsis Multichip Module Design, Fabrication, and Testing by : James J. Licari
Download or read book Multichip Module Design, Fabrication, and Testing written by James J. Licari and published by McGraw-Hill Companies. This book was released on 1995 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested and manufactured. This evolving technology for packaging printed circuit boards (PCBs) is commanding both interest and excitement.
Download or read book Multichip Modules written by and published by . This book was released on 1994 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Microelectronics Packaging Handbook by : Rao Tummala
Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 1070 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.
Download or read book Chip On Board written by John H. Lau and published by Springer Science & Business Media. This book was released on 1994-06-30 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Book Synopsis Essentials of Electronic Testing for Digital, Memory and Mixed-Signal VLSI Circuits by : M. Bushnell
Download or read book Essentials of Electronic Testing for Digital, Memory and Mixed-Signal VLSI Circuits written by M. Bushnell and published by Springer Science & Business Media. This book was released on 2006-04-11 with total page 690 pages. Available in PDF, EPUB and Kindle. Book excerpt: The modern electronic testing has a forty year history. Test professionals hold some fairly large conferences and numerous workshops, have a journal, and there are over one hundred books on testing. Still, a full course on testing is offered only at a few universities, mostly by professors who have a research interest in this area. Apparently, most professors would not have taken a course on electronic testing when they were students. Other than the computer engineering curriculum being too crowded, the major reason cited for the absence of a course on electronic testing is the lack of a suitable textbook. For VLSI the foundation was provided by semiconductor device techn- ogy, circuit design, and electronic testing. In a computer engineering curriculum, therefore, it is necessary that foundations should be taught before applications. The field of VLSI has expanded to systems-on-a-chip, which include digital, memory, and mixed-signalsubsystems. To our knowledge this is the first textbook to cover all three types of electronic circuits. We have written this textbook for an undergraduate “foundations” course on electronic testing. Obviously, it is too voluminous for a one-semester course and a teacher will have to select from the topics. We did not restrict such freedom because the selection may depend upon the individual expertise and interests. Besides, there is merit in having a larger book that will retain its usefulness for the owner even after the completion of the course. With equal tenacity, we address the needs of three other groups of readers.
Book Synopsis VLSI: Integrated Systems on Silicon by : Ricardo A. Reis
Download or read book VLSI: Integrated Systems on Silicon written by Ricardo A. Reis and published by Springer. This book was released on 2013-06-05 with total page 569 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains the papers that have been presented at the ninth Very Large Scale Integrated Systems conference VLSI'97 that is organized biannually by IFIP Working Group 10.5. It took place at Hotel Serra Azul, in Gramado Brazil from 26-30 August 1997. Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble and Tokyo. The papers in this book report on all aspects of importance to the design of the current and future integrated systems. The current trend towards the realization of versatile Systems-on-a-Chip require attention of embedded hardware/software systems, dedicated ASIC hardware, sensors and actuators, mixed analog/digital design, video and image processing, low power battery operation and wireless communication. The papers as presented in Jhis book have been organized in two tracks, where one is dealing with VLSI System Design and Applications and the other presents VLSI Design Methods and CAD. The following topics are addressed: VLSI System Design and Applications Track • VLSI for Video and Image Processing. • Microsystem and Mixed-mode design. • Communication And Memory System Design • Cow-voltage & Low-power Analog Circuits. • High Speed Circuit Techniques • Application Specific DSP Architectures. VLSI Design Methods and CAD Track • Specification and Simulation at System Level. • Synthesis and Technology Mapping. • CAD Techniques for Low-Power Design. • Physical Design Issues in Sub-micron Technologies. • Architectural Design and Synthesis. • Testing in Complex Mixed Analog and Digital Systems.
Book Synopsis Test Resource Partitioning for System-on-a-Chip by : Vikram Iyengar
Download or read book Test Resource Partitioning for System-on-a-Chip written by Vikram Iyengar and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: Test Resource Partitioning for System-on-a-Chip is about test resource partitioning and optimization techniques for plug-and-play system-on-a-chip (SOC) test automation. Plug-and-play refers to the paradigm in which core-to-core interfaces as well as core-to-SOC logic interfaces are standardized, such that cores can be easily plugged into "virtual sockets" on the SOC design, and core tests can be plugged into the SOC during test without substantial effort on the part of the system integrator. The goal of the book is to position test resource partitioning in the context of SOC test automation, as well as to generate interest and motivate research on this important topic. SOC integrated circuits composed of embedded cores are now commonplace. Nevertheless, There remain several roadblocks to rapid and efficient system integration. Test development is seen as a major bottleneck in SOC design, and test challenges are a major contributor to the widening gap between design capability and manufacturing capacity. Testing SOCs is especially challenging in the absence of standardized test structures, test automation tools, and test protocols. Test Resource Partitioning for System-on-a-Chip responds to a pressing need for a structured methodology for SOC test automation. It presents new techniques for the partitioning and optimization of the three major SOC test resources: test hardware, testing time and test data volume. Test Resource Partitioning for System-on-a-Chip paves the way for a powerful integrated framework to automate the test flow for a large number of cores in an SOC in a plug-and-play fashion. The framework presented allows the system integrator to reduce test cost and meet short time-to-market requirements.
Author :Krishnendu Chakrabarty Publisher :Springer Science & Business Media ISBN 13 :1475765274 Total Pages :202 pages Book Rating :4.4/5 (757 download)
Book Synopsis SOC (System-on-a-Chip) Testing for Plug and Play Test Automation by : Krishnendu Chakrabarty
Download or read book SOC (System-on-a-Chip) Testing for Plug and Play Test Automation written by Krishnendu Chakrabarty and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: System-on-a-Chip (SOC) integrated circuits composed of embedded cores are now commonplace. Nevertheless, there remain several roadblocks to rapid and efficient system integration. Test development is seen as a major bottleneck in SOC design and manufacturing capabilities. Testing SOCs is especially challenging in the absence of standardized test structures, test automation tools, and test protocols. In addition, long interconnects, high density, and high-speed designs lead to new types of faults involving crosstalk and signal integrity. SOC (System-on-a-Chip) Testing for Plug and Play Test Automation is an edited work containing thirteen contributions that address various aspects of SOC testing. SOC (System-on-a-Chip) Testing for Plug and Play Test Automation is a valuable reference for researchers and students interested in various aspects of SOC testing.
Download or read book Proceedings written by and published by . This book was released on 1995 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings, 1996 International Conference on Multichip Modules by :
Download or read book Proceedings, 1996 International Conference on Multichip Modules written by and published by . This book was released on 1996 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
