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Modeling Of And Experiments Characterizing Electromigration Induced Failures In Interconnects
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Book Synopsis Modeling of and Experiments Characterizing Electromigration-induced Failures in Interconnects by : Vaibhav Kumar Andleigh
Download or read book Modeling of and Experiments Characterizing Electromigration-induced Failures in Interconnects written by Vaibhav Kumar Andleigh and published by . This book was released on 2001 with total page 666 pages. Available in PDF, EPUB and Kindle. Book excerpt: (Cont.) A failure mechanism map constructed for damascene Cu demonstrates the absence of immortality by resistance saturation due to the shunt structure. Finally, proposed damascene designs eliminating the diffusion barrier at the studs may be expected to have an adverse effect on interconnect reliability due to the loss of short length effects. The test structure developed in this thesis provides a simple means of testing the effects of new shunt and barrier layer technologies on the reliability of Cu-based interconnects. Through the use of the simulation, an accurate methodology for predicting the reliability of Al- and Cu-based interconnects in semiconductor chips has been developed. MIT/EmSim is now being used by Motorola and LSI Logic for evaluating interconnect reliability during the design of future Cu interconnects, and has also been used by numerous SRC-companies and universities through EmSim-Web for electromigration research.
Book Synopsis Electromigration in ULSI Interconnections by : Cher Ming Tan
Download or read book Electromigration in ULSI Interconnections written by Cher Ming Tan and published by World Scientific. This book was released on 2010 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration in ULSI Interconnections provides a comprehensive description of the electro migration in integrated circuits. It is intended for both beginner and advanced readers on electro migration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electro migration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electro migration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electro migration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electro migration are presented in a concise and rigorous manner.Methods of numerical modeling for the interconnect electro migration and their applications to the understanding of electro migration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electro migration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electro migration are outlined and discussed.
Book Synopsis Handbook of Solid State Diffusion: Volume 2 by : Aloke Paul
Download or read book Handbook of Solid State Diffusion: Volume 2 written by Aloke Paul and published by Elsevier. This book was released on 2017-04-13 with total page 478 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Solid State Diffusion, Volume 2: Diffusion Analysis in Material Applications covers the basic fundamentals, techniques, applications, and latest developments in the area of solid-state diffusion, offering a pedagogical understanding for students, academicians, and development engineers. Both experimental techniques and computational methods find equal importance in the second of this two volume set. Volume 2 covers practical issues on diffusion phenomena in bulk, thin film, and in nanomaterials. Diffusion related problems and analysis of methods in industrial applications, such as electronic industry, high temperature materials, nuclear materials, and superconductor materials are discussed. Presents a handbook with a short mathematical background and detailed examples of concrete applications of the sophisticated methods of analysis Enables readers to learn the basic concepts of experimental approaches and the computational methods involved in solid-state diffusion Covers bulk, thin film, and nanomaterials Introduces the problems and analysis in important materials systems in various applications Collates contributions from academic and industrial problems from leading scientists involved in developing key concepts across the globe
Book Synopsis Electromigration in Metals by : Paul S. Ho
Download or read book Electromigration in Metals written by Paul S. Ho and published by Cambridge University Press. This book was released on 2022-05-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Book Synopsis Modeling and Characterization of Electromigration Failures in IC Metallization Systems and Copper Metallization for ULSI Applications by : Jiang Tao
Download or read book Modeling and Characterization of Electromigration Failures in IC Metallization Systems and Copper Metallization for ULSI Applications written by Jiang Tao and published by . This book was released on 1995 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Simulation of the Effect of Microstructure on Electromigration Induced Failure of Interconnects by : Walid Rahif Fayad
Download or read book Simulation of the Effect of Microstructure on Electromigration Induced Failure of Interconnects written by Walid Rahif Fayad and published by . This book was released on 1997 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis New Methodologies for Interconnect Reliability Assessments of Integrated Circuits by : Stefan Peter Hau-Riege
Download or read book New Methodologies for Interconnect Reliability Assessments of Integrated Circuits written by Stefan Peter Hau-Riege and published by . This book was released on 2000 with total page 502 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis American Doctoral Dissertations by :
Download or read book American Doctoral Dissertations written by and published by . This book was released on 2001 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Long-Term Reliability of Nanometer VLSI Systems by : Sheldon Tan
Download or read book Long-Term Reliability of Nanometer VLSI Systems written by Sheldon Tan and published by Springer Nature. This book was released on 2019-09-12 with total page 460 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques. Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models; Introduces a dynamic EM model to address transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects; Presents a cross-layer approach to transistor aging modeling, analysis and mitigation, spanning multiple abstraction levels; Equips readers for EM-induced dynamic reliability management and energy or lifetime optimization techniques, for many-core dark silicon microprocessors, embedded systems, lower power many-core processors and datacenters.
Book Synopsis Fundamentals of Electromigration-Aware Integrated Circuit Design by : Jens Lienig
Download or read book Fundamentals of Electromigration-Aware Integrated Circuit Design written by Jens Lienig and published by Springer. This book was released on 2018-02-23 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Book Synopsis Dissertation Abstracts International by :
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2008 with total page 946 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Dependable Embedded Systems by : Jörg Henkel
Download or read book Dependable Embedded Systems written by Jörg Henkel and published by Springer Nature. This book was released on 2020-12-09 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems.
Download or read book Journal of Applied Physics written by and published by . This book was released on 2003 with total page 500 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Stress-induced Phenomena in Metallization by : Paul Totta
Download or read book Stress-induced Phenomena in Metallization written by Paul Totta and published by American Institute of Physics. This book was released on 1994 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: The aim of this text of stress-induced phenomena in metallization is to assess the current understanding of the problems, to discuss the implications for the reliability of future devices, and to identify needs and directions for future research.
Book Synopsis Microstructure and Electromigration Effects in A1 and A1 Alloy Thin Films by : John Espinoza Sanchez (Jr)
Download or read book Microstructure and Electromigration Effects in A1 and A1 Alloy Thin Films written by John Espinoza Sanchez (Jr) and published by . This book was released on 1991 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book GLSVLSI '05 written by and published by . This book was released on 2005 with total page 530 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the ... ACM Great Lakes Symposium on VLSI. by :
Download or read book Proceedings of the ... ACM Great Lakes Symposium on VLSI. written by and published by . This book was released on 2005 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
