Modeling Fatigue Behavior Of Silver Filled Electronically Conductive Adhesives

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Modeling Fatigue Behavior of Silver Filled Electronically Conductive Adhesives

Author : Rajesh R. Gomatam
Publisher :
ISBN 13 :
Total Pages : 798 pages
Book Rating : 4.:/5 (97 download)

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Book Synopsis Modeling Fatigue Behavior of Silver Filled Electronically Conductive Adhesives by : Rajesh R. Gomatam

Download or read book Modeling Fatigue Behavior of Silver Filled Electronically Conductive Adhesives written by Rajesh R. Gomatam and published by . This book was released on 2002 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronically conductive adhesives (ECA) have been used for electronics packaging applications. Today, this technology is currently being used in electronics for laptop computers, camcorders, watch electronics, hard-drive suspensions. and in various other electronic equipments [1]. ECAs are used mainly for two purposes in electronic packaging. They are either used to bond, and electrically connect two different conducting substrates such as a piezoelectric device to steel substrates, or as an undertill in flip-chip on board applications (FCOB) in surface mount applications [2, 3]. The durability of any adhesive joint is influenced by the properties of adhesive/tiller type, adherend/substrate, and also the environmental conditions the joints are subjected to. Also, apart from the above-mentioned parameters, the presence of stresses in the form of residual stresses, or stresses developed during thermal cycling has a profound influence on the joint efficiency and its durability. In electronic devices, cyclic stress manifests itself through the thermal mismatch between the chip and the substrate, which in turn limits the lifetime of the joint [4, 5, 6, 7]. One of the major questions that need to be addressed is the estimation and prediction of the real service life of conductive adhesive joints. Exposing the adhesive to the major stresses and determining how these stresses affect its service life can answer this question. In order to conduct service life evaluations. samples must be prepared, exposed to environment stresses for extended lengths of time, and then tested. This dissertation is focused in addressing these critical issues mentioned above, and related to ECAs in electronic packaging. In this study, we intend to investigate the interactions between adhesive-filler, adherend surface, and environmental conditions in both static and dynamic fatigue conditions, using a wide array of experiments, to elucidate these effects, and their interrelations. Finally, we intend to develop a comprehensive life predictive model for design engineers using ECAs for electronic packaging, incorporating the properties of adhesive, adherend, and environmental conditions such as temperature, humidity, and different stress states.

Electrical, Thermomechanical and Reliability Modeling of Electrically Conductive Adhesives

Author : Bin Su
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (71 download)

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Book Synopsis Electrical, Thermomechanical and Reliability Modeling of Electrically Conductive Adhesives by : Bin Su

Download or read book Electrical, Thermomechanical and Reliability Modeling of Electrically Conductive Adhesives written by Bin Su and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The first part of the dissertation focuses on understanding and modeling the conduction mechanism of conductive adhesives. The contact resistance is measured between silver rods with different coating materials, and the relationship between tunnel resistivity and contact pressure is obtained based on the experimental results. Three dimensional microstructure models and resistor networks are built to simulate electrical conduction in conductive adhesives. The bulk resistivity of conductive adhesives is calculated from the computer-simulated model. The effects of the geometric properties of filler particles, such as size, shape and distribution, on electrical conductivity are studied by the method of factorial design. The second part of the dissertation evaluates the reliability and investigates the failure mechanism of conductive adhesives subjected to fatigue loading, moisture conditioning and drop impacts. In fatigue tests it is found that electrical conduction failure occurs prior to mechanical failure. The experimental data show that electrical fatigue life can be described well by the power law equation. The electrical failure of conductive adhesives in fatigue is due to the impaired epoxy-silver interfacial adhesion. Moisture uptake in conductive adhesives is measured after moisture conditioning and moisture recovery. The fatigue life of conductive adhesives is significantly shortened after moisture conditioning and moisture recovery. The moisture accelerates the debonding of silver flakes from epoxy resin, which results in a reduced fatigue life. Drop tests are performed on test vehicles with conductive adhesive joints. The electrical conduction failure happens at the same time as joint breakage. The drop failure life is found to be correlated with the strain energy caused by the drop impact, and a power law life model is proposed for drop tests. The fracture is found to be interfacial between the conductive adhesive joints and components/substrates. This research provides a comprehensive understanding of the conduction mechanism of conductive adhesives. The computer-simulated modeling approach presents a useful design tool for the conductive adhesive industry. The reliability tests and proposed failure mechanisms are helpful to prevent failure of conductive adhesives in electronic packages. Moreover, the fatigue and impact life models provide tools in product design and failure prediction of conductive adhesives.

Electrically Conductive Adhesives

Author : Rajesh Gomatam
Publisher : BRILL
ISBN 13 : 9004165924
Total Pages : 434 pages
Book Rating : 4.0/5 (41 download)

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Book Synopsis Electrically Conductive Adhesives by : Rajesh Gomatam

Download or read book Electrically Conductive Adhesives written by Rajesh Gomatam and published by BRILL. This book was released on 2008-12-23 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).

Modeling of Adhesively Bonded Joints

Author : Lucas F. M. da Silva
Publisher : Springer Science & Business Media
ISBN 13 : 354079056X
Total Pages : 335 pages
Book Rating : 4.5/5 (47 download)

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Book Synopsis Modeling of Adhesively Bonded Joints by : Lucas F. M. da Silva

Download or read book Modeling of Adhesively Bonded Joints written by Lucas F. M. da Silva and published by Springer Science & Business Media. This book was released on 2008-10-14 with total page 335 pages. Available in PDF, EPUB and Kindle. Book excerpt: A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique.

Progress in Adhesion and Adhesives, Volume 2

Author : K. L. Mittal
Publisher : John Wiley & Sons
ISBN 13 : 1119407478
Total Pages : 474 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Progress in Adhesion and Adhesives, Volume 2 by : K. L. Mittal

Download or read book Progress in Adhesion and Adhesives, Volume 2 written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2017-06-15 with total page 474 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the ever-increasing amount of research being published it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in may subjects representing the field of adhesion science and adheisves. Based on the success and the warm reception accorded to the premier volume in this series “Progress in Adhesion and Adhesives” (containing the review articles published in Volume 2 (2014) of the journal Reviews of Adhesion and Adhesives (RAA)), volume 2 comprises 14 review articles published in Volume 4 (2016) of RAA. The subjects of these 14 reviews fall into the following general areas: 1. Surface modification of polymers for a variety of purposes. 2. Adhesion aspects in reinforced composites 3. Thin films/coatings and their adhesion measurement 4. Bioadhesion and bio-implants 5. Adhesives and adhesive joints 6. General adhesion aspects The topics covered include: surface modification of natural fibers for reinforced polymer composites; adhesion of submicrometer thin metals films; surface treatments to modulate bioadhesion; hot-melt adhesives from renewable resources; particulate-polymer composites; functionally graded adhesively bonded joints; fabrication of nano-biodevices; effects of particulates on contact angles , thermal stresses in adhesively bonded joints and ways to mitigate these; laser-assisted electroless metallization of polymer materials; adhesion measurement of coatings on biodevices/implants; cyanoacrylate adhesives; and adhesion of green flame retardant coatings onto polyolefins.

2003 International Symposium on Microelectronics

Author :
Publisher :
ISBN 13 :
Total Pages : 1046 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis 2003 International Symposium on Microelectronics by :

Download or read book 2003 International Symposium on Microelectronics written by and published by . This book was released on 2003 with total page 1046 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Adhesive Joining of Structural Components

Author : Alessandro Pegoretti
Publisher : SAE International
ISBN 13 : 0768092876
Total Pages : 134 pages
Book Rating : 4.7/5 (68 download)

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Book Synopsis Adhesive Joining of Structural Components by : Alessandro Pegoretti

Download or read book Adhesive Joining of Structural Components written by Alessandro Pegoretti and published by SAE International. This book was released on 2018-08-09 with total page 134 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adhesive bonding has been used in the manufacture of primary aircraft fuselage and wing structures by various constructors since 1945. By a proper design, adhesive bonding often helps in designing structures mechanically equivalent to or even stronger than conventional assemblies. Adhesive Joining of Structural Components: New Insights and Technologies introduces the reader to some recent progress involved in adhesive joining of structural components. The chapters, seminal SAE International technical papers, cover the most recent advances in adhesive materials, surface preparation and controls, innovative bonding technologies, hybrid bonded/bolted joints, non-destructive testing and failure modelling of adhesively bonded joints. Edited by Dr. Alessandro Pegoretti, Professor of Materials Science and Technology at the University of Trento, Italy, Adhesive Joining of Structural Components: New Insights and Technologies is a must-read resource for those interested in the field of adhesive joining of structural components, which will assume an increasingly important role in designing and manufacturing lightweight structures. In fact, recent advancements in adhesives, methods for surface preparation and control, bonding technologies, non-destructive testing and modelling of failure mechanisms will certainly contribute to revitalize this relatively "mature" assembling technique.

Advanced Adhesives in Electronics

Author : M O Alam
Publisher : Elsevier
ISBN 13 : 0857092898
Total Pages : 279 pages
Book Rating : 4.8/5 (57 download)

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Book Synopsis Advanced Adhesives in Electronics by : M O Alam

Download or read book Advanced Adhesives in Electronics written by M O Alam and published by Elsevier. This book was released on 2011-05-25 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Interface Circuits for Microsensor Integrated Systems

Author : Giuseppe Ferri
Publisher : MDPI
ISBN 13 : 3038973769
Total Pages : 171 pages
Book Rating : 4.0/5 (389 download)

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Book Synopsis Interface Circuits for Microsensor Integrated Systems by : Giuseppe Ferri

Download or read book Interface Circuits for Microsensor Integrated Systems written by Giuseppe Ferri and published by MDPI. This book was released on 2018-12-07 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a printed edition of the Special Issue "Interface Circuits for Microsensor Integrated Systems" that was published in Micromachines

Adhesion in Microelectronics

Author : K. L. Mittal
Publisher : John Wiley & Sons
ISBN 13 : 1118831349
Total Pages : 293 pages
Book Rating : 4.1/5 (188 download)

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Book Synopsis Adhesion in Microelectronics by : K. L. Mittal

Download or read book Adhesion in Microelectronics written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2014-08-25 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Scientific and Technical Aerospace Reports

Author :
Publisher :
ISBN 13 :
Total Pages : 836 pages
Book Rating : 4.:/5 (31 download)

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Book Synopsis Scientific and Technical Aerospace Reports by :

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 836 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Author : Karl J. Puttlitz
Publisher : CRC Press
ISBN 13 : 0203021487
Total Pages : 1044 pages
Book Rating : 4.2/5 (3 download)

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Book Synopsis Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by : Karl J. Puttlitz

Download or read book Handbook of Lead-Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif

Testing Adhesive Joints

Author : Lucas F.M. da Silva
Publisher : John Wiley & Sons
ISBN 13 : 9783527329045
Total Pages : 0 pages
Book Rating : 4.3/5 (29 download)

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Book Synopsis Testing Adhesive Joints by : Lucas F.M. da Silva

Download or read book Testing Adhesive Joints written by Lucas F.M. da Silva and published by John Wiley & Sons. This book was released on 2012-10-22 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Joining techniques such as welding, brazing, riveting and screwing are used by industry all over the world on a daily basis. A further method of joining has also proven to be highly successful: adhesive bonding. Adhesive bonding technology has an extremely broad range of applications. And it is difficult to imagine a product - in the home, in industry, in transportation, or anywhere else for that matter - that does not use adhesives or sealants in some manner. The book focuses on the methodology used for fabricating and testing adhesive and bonded joint specimens. The text covers a wide range of test methods that are used in the field of adhesives, providing vital information for dealing with the range of adhesive properties that are of interest to the adhesive community. With contributions from many experts in the field, the entire breadth of industrial laboratory examples, utilizing different best practice techniques are discussed. The core concept of the book is to provide essential information vital for producing and characterizing adhesives and adhesively bonded joints.

Applied Mechanics Reviews

Author :
Publisher :
ISBN 13 :
Total Pages : 348 pages
Book Rating : 4.3/5 (243 download)

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Book Synopsis Applied Mechanics Reviews by :

Download or read book Applied Mechanics Reviews written by and published by . This book was released on 1992 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electrical & Electronics Abstracts

Author :
Publisher :
ISBN 13 :
Total Pages : 2240 pages
Book Rating : 4.3/5 (243 download)

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Book Synopsis Electrical & Electronics Abstracts by :

Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 2240 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Adhesives Technology for Electronic Applications

Author : James J. Licari
Publisher : William Andrew
ISBN 13 : 1437778909
Total Pages : 415 pages
Book Rating : 4.4/5 (377 download)

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Book Synopsis Adhesives Technology for Electronic Applications by : James J. Licari

Download or read book Adhesives Technology for Electronic Applications written by James J. Licari and published by William Andrew. This book was released on 2011-06-24 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: Approx.512 pages Approx.512 pages

Fatigue and Fracture of Adhesively-Bonded Composite Joints

Author : Anastasios P. Vassilopoulos
Publisher : Elsevier
ISBN 13 : 0857098128
Total Pages : 553 pages
Book Rating : 4.8/5 (57 download)

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Book Synopsis Fatigue and Fracture of Adhesively-Bonded Composite Joints by : Anastasios P. Vassilopoulos

Download or read book Fatigue and Fracture of Adhesively-Bonded Composite Joints written by Anastasios P. Vassilopoulos and published by Elsevier. This book was released on 2014-10-21 with total page 553 pages. Available in PDF, EPUB and Kindle. Book excerpt: It is commonly accepted that the majority of engineering failures happen due to fatigue or fracture phenomena. Adhesive bonding is a prevailing joining technique, widely used for critical connections in composite structures. However, the lack of knowledge regarding fatigue and fracture behaviour, and the shortage of tools for credible fatigue design, hinders the potential benefits of adhesively bonded joints. The demand for reliable and safe structures necessitates deep knowledge in this area in order to avoid catastrophic structural failures. This book reviews recent research in the field of fatigue and fracture of adhesively-bonded composite joints. The first part of the book discusses the experimental investigation of the reliability of adhesively-bonded composite joints, current research on understanding damage mechanisms, fatigue and fracture, durability and ageing as well as implications for design. The second part of the book covers the modelling of bond performance and failure mechanisms in different loading conditions. A detailed reference work for researchers in aerospace and engineering Expert coverage of different adhesively bonded composite joint structures An overview of joint failure