Read Books Online and Download eBooks, EPub, PDF, Mobi, Kindle, Text Full Free.
Modeling Based Design Optimization Of Wafer Level And Chip Scale Packaging For Rf Mems Devices
Download Modeling Based Design Optimization Of Wafer Level And Chip Scale Packaging For Rf Mems Devices full books in PDF, epub, and Kindle. Read online Modeling Based Design Optimization Of Wafer Level And Chip Scale Packaging For Rf Mems Devices ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Book Synopsis Modeling-based Design Optimization of Wafer-level and Chip-scale Packaging for RF-MEMS Devices by : Matthew William Kelley
Download or read book Modeling-based Design Optimization of Wafer-level and Chip-scale Packaging for RF-MEMS Devices written by Matthew William Kelley and published by . This book was released on 2004 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Wafer-Level Chip-Scale Packaging by : Shichun Qu
Download or read book Wafer-Level Chip-Scale Packaging written by Shichun Qu and published by Springer. This book was released on 2014-09-10 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Book Synopsis Distributed Intelligent Circuits And Systems by : Balwinder Baj
Download or read book Distributed Intelligent Circuits And Systems written by Balwinder Baj and published by World Scientific. This book was released on 2024-03-06 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main objective of this book is to provide insights into recent advances in distributed intelligent circuits, systems and their applications. Distributed intelligence is the key enabler for innovations in machine-to-machine communications. The innovations are directed towards keeping existing algorithms as the base and developing new intelligent systems by employing smart technologies. Artificial intelligence (AI) and, more specifically, deep learning (DL) are receiving significant attention in assisting doctors in the detection of disease patterns without much human intervention. In agriculture, robots automate slow, repetitive and dull tasks, allowing farmers to focus more on improving overall production yields.The evolving trends point to the interface of artificial intelligence with machines being a factor in enhancing the decision-making capabilities of smart machines. This book provides relevant theoretical frameworks that include basic models, algorithms, circuit designs and the latest developments in experimental aspects in the field of distributed intelligence systems for industrial applications. The challenges encountered in the development of models for distributed intelligence systems for environmental monitoring are mitigated with artificial intelligence, machine learning and deep learning. This book identifies challenges and helps in applying solutions in the development of advanced intelligent systems for environmental monitoring.
Book Synopsis Heterogeneous Integrations by : John H. Lau
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Book Synopsis Electrical Design Modelling and Optimisation of a Low-cost Wafer Level Chip Scale Package (WL-CSP) by : Hong Guan Low
Download or read book Electrical Design Modelling and Optimisation of a Low-cost Wafer Level Chip Scale Package (WL-CSP) written by Hong Guan Low and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis TSV 3D RF Integration by : Shenglin Ma
Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology
Book Synopsis Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering by : Seonho Seok
Download or read book Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering written by Seonho Seok and published by Springer. This book was released on 2019-01-05 with total page 115 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
Book Synopsis Modeling and Reliability Analysis of Wafer-level Chip Scale Packages by : Satish C. Chaparala
Download or read book Modeling and Reliability Analysis of Wafer-level Chip Scale Packages written by Satish C. Chaparala and published by . This book was released on 2002 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Semiconductor Advanced Packaging by : John H. Lau
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Book Synopsis Power Electronic Packaging by : Yong Liu
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Book Synopsis Materials for Advanced Packaging by : Daniel Lu
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer Science & Business Media. This book was released on 2008-12-17 with total page 723 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Book Synopsis Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology by :
Download or read book Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology written by and published by . This book was released on 2002 with total page 594 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book System on Package written by Rao Tummala and published by McGraw Hill Professional. This book was released on 2007-07-22 with total page 807 pages. Available in PDF, EPUB and Kindle. Book excerpt: System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Book Synopsis Materials for Advanced Packaging by : Daniel Lu
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Book Synopsis System-on-Chip Test Architectures by : Laung-Terng Wang
Download or read book System-on-Chip Test Architectures written by Laung-Terng Wang and published by Morgan Kaufmann. This book was released on 2010-07-28 with total page 893 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern electronics testing has a legacy of more than 40 years. The introduction of new technologies, especially nanometer technologies with 90nm or smaller geometry, has allowed the semiconductor industry to keep pace with the increased performance-capacity demands from consumers. As a result, semiconductor test costs have been growing steadily and typically amount to 40% of today's overall product cost. This book is a comprehensive guide to new VLSI Testing and Design-for-Testability techniques that will allow students, researchers, DFT practitioners, and VLSI designers to master quickly System-on-Chip Test architectures, for test debug and diagnosis of digital, memory, and analog/mixed-signal designs. - Emphasizes VLSI Test principles and Design for Testability architectures, with numerous illustrations/examples. - Most up-to-date coverage available, including Fault Tolerance, Low-Power Testing, Defect and Error Tolerance, Network-on-Chip (NOC) Testing, Software-Based Self-Testing, FPGA Testing, MEMS Testing, and System-In-Package (SIP) Testing, which are not yet available in any testing book. - Covers the entire spectrum of VLSI testing and DFT architectures, from digital and analog, to memory circuits, and fault diagnosis and self-repair from digital to memory circuits. - Discusses future nanotechnology test trends and challenges facing the nanometer design era; promising nanotechnology test techniques, including Quantum-Dots, Cellular Automata, Carbon-Nanotubes, and Hybrid Semiconductor/Nanowire/Molecular Computing. - Practical problems at the end of each chapter for students.
Book Synopsis Dissertation Abstracts International by :
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2007 with total page 924 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced RF MEMS by : Stepan Lucyszyn
Download or read book Advanced RF MEMS written by Stepan Lucyszyn and published by Cambridge University Press. This book was released on 2010-08-19 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation
