Modeling And Characterization Of Multiple Coupled Lines

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Modeling and Characterization of Multiple Coupled Lines

Author : Alok Tripathi
Publisher :
ISBN 13 :
Total Pages : 210 pages
Book Rating : 4.:/5 (419 download)

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Book Synopsis Modeling and Characterization of Multiple Coupled Lines by : Alok Tripathi

Download or read book Modeling and Characterization of Multiple Coupled Lines written by Alok Tripathi and published by . This book was released on 1999 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt: A configuration-oriented circuit model for multiple coupled lines in an inhomogeneous medium is developed and presented in this thesis. This circuit model consists of a network of uncoupled transmission lines and is readily modeled with simulation tools like LIBRA© and SPICE©. It provides an equivalent circuit representation which is simple and topologically meaningful as compared to the model based on modal decomposition. The configuration-oriented model is derived by decomposing the immittance matrices associated with an n coupled line 2n-port system. Time- and frequency-domain simulations of typical coupled line multiports are included to exemplify the utility of the model. The model is useful for the simulation and design of general single and multilayer coupled line components, such as filters and couplers, and for the investigation of signal integrity issues including crosstalk in interconnects associated with high speed digital and mixed signal electronic modules and packages. It is shown that multiconductor lossless structures in an inhomogeneous medium can be characterized by multiport time-domain reflection (TDR) measurements. A synthesis technique of an equivalent lossless (non-dispersive) uniform multiconductor n coupled lines (UMCL) 2n-port system from the measured discrete time-domain reflection response is presented. This procedure is based on the decomposition of the characteristic immittance matrices of the UMCL in terms of partial mode immittance matrices. The decomposition scheme leads to the discrete transition matrix function of a UMCL 2n-port system. This in turn establishes a relationship between the normal-mode parameters of the UMCL and the measured impulse reflection and transmission response. Equivalence between the synthesis procedure presented in this thesis and the solution of a special form of an algebraic Riccati matrix equation whose solution can lead to the normal-mode parameters and a real termination network is illustrated. In order to demonstrate the procedure, a typical microstrip structure with three lines is synthesized from the time-domain reflection (TDR) data. In order to compliment known field theoretic techniques for characterization of multiconductor structures a network analog method is employed to solve the magnetic vector potential equation to characterize multilayer Metal-Insulator-Semiconductor (MIS) transmission line structures. This approach leads to the frequency dependent distributed inductance and the resistance matrices of a multilayer MIS transmission line structure. It is shown that the frequency dependent transmission line parameters can be modeled by an efficient quasi-static formulation for all propagating modes including the slow-wave and skin-effect modes. To demonstrate the proposed approach for single and multilevel structures, the frequency dependent distributed inductance and resistance matrices corresponding to the propagating modes classified as the slow-wave and skin-effect modes are calculated and validated by comparison with full-wave solutions.

Proceedings of the ... International Symposium on Microelectronics

Author :
Publisher :
ISBN 13 :
Total Pages : 920 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Proceedings of the ... International Symposium on Microelectronics by :

Download or read book Proceedings of the ... International Symposium on Microelectronics written by and published by . This book was released on 2000 with total page 920 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings

Author :
Publisher :
ISBN 13 :
Total Pages : 1072 pages
Book Rating : 4.E/5 ( download)

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Book Synopsis Proceedings by :

Download or read book Proceedings written by and published by . This book was released on 1998 with total page 1072 pages. Available in PDF, EPUB and Kindle. Book excerpt:

CMOS RF Modeling, Characterization and Applications

Author : M. Jamal Deen
Publisher : World Scientific
ISBN 13 : 9789810249052
Total Pages : 426 pages
Book Rating : 4.2/5 (49 download)

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Book Synopsis CMOS RF Modeling, Characterization and Applications by : M. Jamal Deen

Download or read book CMOS RF Modeling, Characterization and Applications written by M. Jamal Deen and published by World Scientific. This book was released on 2002 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMOS technology has now reached a state of evolution, in terms of both frequency and noise, where it is becoming a serious contender for radio frequency (RF) applications in the GHz range. Cutoff frequencies of about 50 GHz have been reported for 0.18 æm CMOS technology, and are expected to reach about 100 GHz when the feature size shrinks to 100 nm within a few years. This translates into CMOS circuit operating frequencies well into the GHz range, which covers the frequency range of many of today's popular wireless products, such as cell phones, GPS (Global Positioning System) and Bluetooth. Of course, the great interest in RF CMOS comes from the obvious advantages of CMOS technology in terms of production cost, high-level integration, and the ability to combine digital, analog and RF circuits on the same chip. This book discusses many of the challenges facing the CMOS RF circuit designer in terms of device modeling and characterization, which are crucial issues in circuit simulation and design.

Journal of Research of the National Institute of Standards and Technology

Author :
Publisher :
ISBN 13 :
Total Pages : 526 pages
Book Rating : 4.:/5 (4 download)

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Book Synopsis Journal of Research of the National Institute of Standards and Technology by :

Download or read book Journal of Research of the National Institute of Standards and Technology written by and published by . This book was released on 1997 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reports NIST research and development in the physical and engineering sciences in which the Institute is active. These include physics, chemistry, engineering, mathematics, and computer sciences. Emphasis on measurement methodology and the basic technology underlying standardization.

Layout Optimization in VLSI Design

Author : Bing Lu
Publisher : Springer Science & Business Media
ISBN 13 : 1475734158
Total Pages : 292 pages
Book Rating : 4.4/5 (757 download)

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Book Synopsis Layout Optimization in VLSI Design by : Bing Lu

Download or read book Layout Optimization in VLSI Design written by Bing Lu and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.

Characterization of Coupled Microstrip Structure Using FDTD

Author : Yoonsuk Kim
Publisher :
ISBN 13 :
Total Pages : 280 pages
Book Rating : 4.:/5 (427 download)

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Book Synopsis Characterization of Coupled Microstrip Structure Using FDTD by : Yoonsuk Kim

Download or read book Characterization of Coupled Microstrip Structure Using FDTD written by Yoonsuk Kim and published by . This book was released on 1999 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: A new CAD-oriented methodology for the full-wave broadband characterization of coupled microstrip structures for RF/microwave and high-speed digital circuits is presented. The characterization methodology is based on the finite difference time domain (FDTD) technique combined with a systematic extraction procedure using the normal mode approach and multiport network concepts. The characterization approach is first applied to uniform coupled lines on a lossless substrate to determine their frequency-dependent propagation characteristics. The 2n-port admittance matrix corresponding to n uniform coupled lines is extracted from the port voltages and currents, which in turn provides the frequency-dependent distributed inductance and capacitance matrices. To illustrate the technique, several typical coupled line structures, including an asymmetric three-line structure, are analyzed. Comparison with results obtained with a full-wave spectral domain method shows good agreement. The new characterization methodology is applied to microstrip lines on lossy silicon substrate. The frequency-dependent propagation characteristics and dis- tributed line parameters for single and symmetric coupled microstrip lines are extracted from FDTD simulation. Results show that the lossy substrate can significantly affect the transmission line characteristics. To reduce the substrate effects on the microstrip characteristics, a new substrate shielding structure consisting of orthogonal grounded lines at the silicon/oxide interface is examined. It is shown for a single and symmetric coupled microstrip lines that the substrate shield leads to a reduction in transmission line loss without significantly changing the characteristic impedance and effective permittivity of the microstrip structure. Using the FDTD approach combined with a new extraction procedure, the characteristics of several discontinuities in single and coupled microstrip lines are determined. The new extraction procedure for characterizing discontinuities is based on successive excitation of each port and determination of the voltages for the incident and reflected waves. The method is applied to several example structures including coupled step and coupled gap discontinuities.

Dissertation Abstracts International

Author :
Publisher :
ISBN 13 :
Total Pages : 834 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Dissertation Abstracts International by :

Download or read book Dissertation Abstracts International written by and published by . This book was released on 2001 with total page 834 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Lumped Elements for RF and Microwave Circuits, Second Edition

Author : Inder J. Bahl
Publisher : Artech House
ISBN 13 : 1630819336
Total Pages : 593 pages
Book Rating : 4.6/5 (38 download)

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Book Synopsis Lumped Elements for RF and Microwave Circuits, Second Edition by : Inder J. Bahl

Download or read book Lumped Elements for RF and Microwave Circuits, Second Edition written by Inder J. Bahl and published by Artech House. This book was released on 2022-12-31 with total page 593 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fully updated and including entirely new chapters, this Second Edition provides in-depth coverage of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. Featuring extensive formulas for lumped elements, design trade-offs, and an updated and current list of references, the book helps you understand the value and usefulness of lumped elements in the design of RF, microwave and millimeter wave components and circuits. You’ll find a balanced treatment between standalone lumped elements and their circuits using MICs, MMICs and RFICs technologies. You’ll also find detailed information on a broader range RFICs that was not available when the popular first edition was published. The book captures – in one consolidated volume -- the fundamentals, equations, modeling, examples, references and overall procedures to design, test and produce microwave components that are indispensable in industry and academia today. With its superb organization and expanded coverage of the subject, this is a must-have, go-to resource for practicing engineers and researchers in industry, government and university and microwave engineers working in the antenna area. Students will also find it a useful reference with its clear explanations, many examples and practical modeling guidelines.

High-Speed VLSI Interconnections

Author : Ashok K. Goel
Publisher : John Wiley & Sons
ISBN 13 : 0470165960
Total Pages : 433 pages
Book Rating : 4.4/5 (71 download)

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Book Synopsis High-Speed VLSI Interconnections by : Ashok K. Goel

Download or read book High-Speed VLSI Interconnections written by Ashok K. Goel and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.

Circular

Author :
Publisher :
ISBN 13 :
Total Pages : 272 pages
Book Rating : 4.:/5 (319 download)

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Book Synopsis Circular by :

Download or read book Circular written by and published by . This book was released on 1989 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Characterization and Modeling of SOI RF Integrated Components

Author : Morin Dehan
Publisher : Presses univ. de Louvain
ISBN 13 : 9782930344393
Total Pages : 238 pages
Book Rating : 4.3/5 (443 download)

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Book Synopsis Characterization and Modeling of SOI RF Integrated Components by : Morin Dehan

Download or read book Characterization and Modeling of SOI RF Integrated Components written by Morin Dehan and published by Presses univ. de Louvain. This book was released on 2003 with total page 238 pages. Available in PDF, EPUB and Kindle. Book excerpt: The boom of mobile communications leads to an increasing request of low cost and low power mixed mode integrated circuits. Maturity of SOI technology, and recent progresses of MOSFET's microwave performances, explain the success of silicon as compared to III-V technologies for low-cost multigigahertz analog applications. The design of efficient circuits requires accurate, wide-band models for both active and passive elements. Within this frame, passive and active components fabricated in SOI technologies have been studied. Various topologies of integrated transmission lines, like Coplanar Waveguides or thin film microstrip lines, have been analyzed. Also, a new physical model of integrated inductors has been developed. This model, based on a coupled line analysis of square spiral inductors, is scalable and independent of the technology used. Inductors with various spacing between strips, conductor widths, or number of turns can be simulated on different multi-layered substrates. Each layer that composes the substrate is defined using its electrical properties (permittivity, permeability, conductivity). The performances of integrated sub-micron MOSFETs are analyzed. New alternative structures of transistor (the Graded Channel MOSFET and the Dynamic Threshold MOSFET) are proposed to increase the performances of a CMOS technology for for analog, low power, low voltage, and microwave applications. They are studied from Low to High frequency. The graded channel MOSFET is an asymmetric doped channel MOSFET's which bring solutions for the problems of premature drain break-down, hot carrier effects, and threshold voltage (Vth) roll-off issues in deep submicrometer devices. The GCMOS processing is fully compatible with the conventional SOI MOSFET process flow, with no additional steps needed. The dynamic threshold voltage MOS is a MOS transistor for which the gate and the body channel are tied together. All DTMOS electrical properties can be deduced from standard MOS theory by introducing Vbs = Vgs. The main advantage of DTMOS over conventional MOS is its higher drive current at low bias conditions. To keep the body to source current as low as possible, the body bias voltage must be kept lower than 0.7 V. It seems obvious that the DTMOS transistor is an attractive component for low voltage applications.

High-Frequency Characterization of Electronic Packaging

Author : Luc Martens
Publisher : Springer Science & Business Media
ISBN 13 : 1461556236
Total Pages : 169 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis High-Frequency Characterization of Electronic Packaging by : Luc Martens

Download or read book High-Frequency Characterization of Electronic Packaging written by Luc Martens and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 169 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

Analysis and Applications of Multiple Coupled Line Structures in an Inhomogeneous Medium

Author : Youn Kang Chin
Publisher :
ISBN 13 :
Total Pages : 260 pages
Book Rating : 4.:/5 (926 download)

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Book Synopsis Analysis and Applications of Multiple Coupled Line Structures in an Inhomogeneous Medium by : Youn Kang Chin

Download or read book Analysis and Applications of Multiple Coupled Line Structures in an Inhomogeneous Medium written by Youn Kang Chin and published by . This book was released on 1982 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: The general expressions for finding the network functions, e.g., the immittance and the scattering parameters, of a general, uniformly coupled n-line structure in an inhomogeneous medium are derived in terms of the normal mode parameters of the system. These are used to compute or to derive the explicit expressions for the elements of the immittance matrix in terms of normal mode parameters. The scattering parameters of a general non-symmetrical directional coupler with arbitrary terminations are derived in terms of the known scattering parameters with a specified set of terminations such as characteristic non-mode converting terminations. The formulation is quite general and can be applied to various coupled guided wave systems, including coupled microstrip lines, slot lines, comb lines, dielectric waveguides and various other uniformly coupled transmission systems. The results obtained are used to present the procedure to determine the optimum terminations for directional couplers and sensitivity of various multiports, including couplers, to changes in terminations. It is shown that the coupler performance can be optimized in terms of the terminating impedances. The analysis and design procedure for both symmetrical and nonsymmetrical four-port coupled structures consisting of the symmetrical three lines in an inhomogeneous medium such as microstrips are presented. Tables and charts for the design of three-line structure are based on the closed form expressions for the immittance parameters. The analysis and design procedure for open-circuited interdigital multiple coupled microstrip line structures for applications as wideband DC blocks and filters are also presented. As in the case of the other microstrip structures, the initial design is based on the TEM assumption and the final geometry is then determined by the exact computation of the frequency response of the two ports. For larger numbers of lines, the design is based on the equivalent even- and odd-mode parameters of the n-line system. For this case, the TEM design equations, derived in terms of even- and odd-mode impedances of a pair of lines, can be translated into a physical configuration by using published results on coupled lines.

1990 IEEE MTT-S International Microwave Symposium Digest

Author :
Publisher :
ISBN 13 :
Total Pages : 656 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis 1990 IEEE MTT-S International Microwave Symposium Digest by :

Download or read book 1990 IEEE MTT-S International Microwave Symposium Digest written by and published by . This book was released on 1990 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Modeling and Simulation of High Speed VLSI Interconnects

Author : Michel S. Nakhla
Publisher : Springer Science & Business Media
ISBN 13 : 146152718X
Total Pages : 104 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Modeling and Simulation of High Speed VLSI Interconnects by : Michel S. Nakhla

Download or read book Modeling and Simulation of High Speed VLSI Interconnects written by Michel S. Nakhla and published by Springer Science & Business Media. This book was released on 2011-06-28 with total page 104 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.

Metamaterial

Author : Xun-Ya Jiang
Publisher : BoD – Books on Demand
ISBN 13 : 9535105914
Total Pages : 630 pages
Book Rating : 4.5/5 (351 download)

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Book Synopsis Metamaterial by : Xun-Ya Jiang

Download or read book Metamaterial written by Xun-Ya Jiang and published by BoD – Books on Demand. This book was released on 2012-05-16 with total page 630 pages. Available in PDF, EPUB and Kindle. Book excerpt: In-depth analysis of the theory, properties and description of the most potential technological applications of metamaterials for the realization of novel devices such as subwavelength lenses, invisibility cloaks, dipole and reflector antennas, high frequency telecommunications, new designs of bandpass filters, absorbers and concentrators of EM waves etc. In order to create a new devices it is necessary to know the main electrodynamical characteristics of metamaterial structures on the basis of which the device is supposed to be created. The electromagnetic wave scattering surfaces built with metamaterials are primarily based on the ability of metamaterials to control the surrounded electromagnetic fields by varying their permeability and permittivity characteristics. The book covers some solutions for microwave wavelength scales as well as exploitation of nanoscale EM wavelength such as visible specter using recent advances of nanotechnology, for instance in the field of nanowires, nanopolymers, carbon nanotubes and graphene. Metamaterial is suitable for scholars from extremely large scientific domain and therefore given to engineers, scientists, graduates and other interested professionals from photonics to nanoscience and from material science to antenna engineering as a comprehensive reference on this artificial materials of tomorrow.