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Modeling And Application Of Flexible Electronics Packaging
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Book Synopsis Modeling and Application of Flexible Electronics Packaging by : YongAn Huang
Download or read book Modeling and Application of Flexible Electronics Packaging written by YongAn Huang and published by Springer. This book was released on 2019-04-23 with total page 287 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Book Synopsis Manufacturing Challenges in Electronic Packaging by : Y.C. Lee
Download or read book Manufacturing Challenges in Electronic Packaging written by Y.C. Lee and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
Book Synopsis Advanced Materials for Printed Flexible Electronics by : Colin Tong
Download or read book Advanced Materials for Printed Flexible Electronics written by Colin Tong and published by Springer Nature. This book was released on 2021-10-04 with total page 641 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.
Book Synopsis Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces by : Beth Keser
Download or read book Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces written by Beth Keser and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Author :National Research Council (U.S.). Committee on Best Practice in National Innovation Programs for Flexible Electronics Publisher :National Academies Press ISBN 13 :9780309305914 Total Pages :0 pages Book Rating :4.3/5 (59 download)
Book Synopsis The Flexible Electronics Opportunity by : National Research Council (U.S.). Committee on Best Practice in National Innovation Programs for Flexible Electronics
Download or read book The Flexible Electronics Opportunity written by National Research Council (U.S.). Committee on Best Practice in National Innovation Programs for Flexible Electronics and published by National Academies Press. This book was released on 2014 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Flexible electronics describes circuits that can bend and stretch, enabling significant versatility in applications and the prospect of low-cost manufacturing processes. They represent an important technological advance, in terms of their performance characteristics and potential range of applications, ranging from medical care, packaging, lighting and signage, consumer electronics and alternative energy (especially solar energy.) What these technologies have in common is a dependence on efficient manufacturing that currently requires improved technology, processes, tooling, and materials, as well as ongoing research. Seeking to capture the global market opportunity in flexible electronics, major U.S. competitors have initiated dedicated programs that are large in scope and supported with significant government funding to develop and acquire these new technologies, refine them, and ultimately manufacture them within their national borders. These national and regional investments are significantly larger than U.S. investment and more weighted toward later stage applied research and development. The Flexible Electronics Opportunity examines and compares selected innovation programs both foreign and domestic, and their potential to advance the production of flexible electronics technology in the United States. This report reviews the goals, concept, structure, operation, funding levels, and evaluation of foreign programs similar to major U.S. programs, e.g., innovation awards, S&T parks, and consortia. The report describes the transition of flexible electronics research into products and to makes recommendations to improve and to develop U.S. programs. Through an examination of the role of research consortia around the world to advance flexible electronics technology, the report makes recommendations for steps that the U.S. might consider to develop a robust industry in the United States. Significant U.S. expansion in the market for flexible electronics technologies is not likely to occur in the absence of mechanisms to address investment risks, the sharing of intellectual property, and the diverse technology requirements associated with developing and manufacturing flexible electronics technologies. The Flexible Electronics Opportunity makes recommendations for collaboration among industry, universities, and government to achieve the critical levels of investment and the acceleration of new technology development that are needed to catalyze a vibrant flexible electronics industry.
Book Synopsis Flexible Electronic Packaging and EncapsulationTechnology by : Wei Huang
Download or read book Flexible Electronic Packaging and EncapsulationTechnology written by Wei Huang and published by John Wiley & Sons. This book was released on 2024-06-04 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
Book Synopsis Molecular Modeling and Multiscaling Issues for Electronic Material Applications by : Artur Wymyslowski
Download or read book Molecular Modeling and Multiscaling Issues for Electronic Material Applications written by Artur Wymyslowski and published by Springer. This book was released on 2014-11-20 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.
Book Synopsis Manufacturing Challenges in Electronic Packaging by : Y C Lee
Download or read book Manufacturing Challenges in Electronic Packaging written by Y C Lee and published by . This book was released on 1997-12-31 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
Book Synopsis Flexible Electronic Packaging and Encapsulation Technology by : Hong Meng
Download or read book Flexible Electronic Packaging and Encapsulation Technology written by Hong Meng and published by John Wiley & Sons. This book was released on 2024-03-25 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
Book Synopsis Modeling and Simulation for Microelectronic Packaging Assembly by : Shen Liu
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-05-17 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Book Synopsis Power Electronic Packaging by : Yong Liu
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Book Synopsis Organic Flexible Electronics by : Piero Cosseddu
Download or read book Organic Flexible Electronics written by Piero Cosseddu and published by Woodhead Publishing. This book was released on 2020-09-29 with total page 666 pages. Available in PDF, EPUB and Kindle. Book excerpt: Organic Electronics is a novel field of electronics that has gained an incredible attention over the past few decades. New materials, device architectures and applications have been continuously introduced by the academic and also industrial communities, and novel topics have raised strong interest in such communities, as molecular doping, thermoelectrics, bioelectronics and many others.Organic Flexible Electronics is mainly divided into three sections. The first part is focused on the fundamentals of organic electronics, such as charge transport models in these systems and new approaches for the design and synthesis of novel molecules. The first section addresses the main challenges that are still open in this field, including the important role of interfaces for achieving high-performing devices or the novel approaches employed for improving reliability issues.The second part discusses the most innovative devices which have been developed in recent years, such as devices for energy harvesting, flexible batteries, high frequency circuits, and flexible devices for tattoo electronics and bioelectronics.Finally the book reviews the most important applications moving from more standard flexible back panels to wearable and textile electronics and more futuristic applications like ingestible systems. Reviews the fundamental properties and methods for optimizing organic electronic materials including chemical doping and techniques to address stability issues Discusses the most promising organic electronic devices for energy, electronics, and biomedical applications Addresses key applications of organic electronic devices in imagers, wearable electronics, bioelectronics
Book Synopsis Modeling and Prediction of Polymer Nanocomposite Properties by : Vikas Mittal
Download or read book Modeling and Prediction of Polymer Nanocomposite Properties written by Vikas Mittal and published by John Wiley & Sons. This book was released on 2012-12-07 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book series 'Polymer Nano-, Micro- and Macrocomposites' provides complete and comprehensive information on all important aspects of polymer composite research and development, including, but not limited to synthesis, filler modification, modeling, characterization as well as application and commercialization issues. Each book focuses on a particular topic and gives a balanced in-depth overview of the respective subfi eld of polymer composite science and its relation to industrial applications. With the books the readers obtain dedicated resources with information relevant to their research, thereby helping to save time and money. This book lays the theoretical foundations and emphasizes the close connection between theory and experiment to optimize models and real-life procedures for the various stages of polymer composite development. As such, it covers quantum-mechanical approaches to understand the chemical processes on an atomistic level, molecular mechanics simulations to predict the filler surface dynamics, finite element methods to investigate the macro-mechanical behavior, and thermodynamic models to assess the temperature stability. The whole is rounded off by a look at multiscale models that can simulate properties at various length and time scales in one go - and with predictive accuracy.
Book Synopsis Interconnect Technologies for Integrated Circuits and Flexible Electronics by : Yash Agrawal
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Book Synopsis Flexible Electronics by : Vinod Kumar Khanna
Download or read book Flexible Electronics written by Vinod Kumar Khanna and published by IOP Publishing Limited. This book was released on 2019-07-31 with total page 500 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Bio and Nano Packaging Techniques for Electron Devices by : Gerald Gerlach
Download or read book Bio and Nano Packaging Techniques for Electron Devices written by Gerald Gerlach and published by Springer Science & Business Media. This book was released on 2012-07-16 with total page 619 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their application as packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; also ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers.
Book Synopsis Manufacturing Flexible Packaging by : Thomas Dunn
Download or read book Manufacturing Flexible Packaging written by Thomas Dunn and published by William Andrew. This book was released on 2014-09-04 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: Efficiently and profitably delivering quality flexible packaging to the marketplace requires designing and manufacturing products that are both "fit-to-use" and "fit-to-make". The engineering function in a flexible packaging enterprise must attend to these dual design challenges. Flexible Packaging discusses the basic processes used to manufacture flexible packaging products, including rotogravure printing, flexographic printing, adhesive lamination, extrusion lamination/coating; and finishing/slitting. These processes are then related to the machines used to practice them, emphasising the basics of machines’ control systems , and options to minimize wasted time and materials between production jobs. Raw materials are also considered, including the three basic forms: Rollstock (paper, foil, plastic films); Resin; and Wets (inks, varnishes, primers). Guidance is provided on both material selection, and on adding value through enhancement or modification of the materials’ physical features. A ‘measures’ section covers both primary material features – such as tensile, elongation, modulus and elastic and plastic regions – and secondary quality characteristics such as seal and bond strengths, coefficient of friction, oxygen barrier and moisture vapour barrier. Helps engineers improve existing raw material selection and manufacturing processes for manufacturing functional flexible packaging materials. Covers all aspects of delivering high value packaging to the customer – from the raw materials, to the methods of processing them, the machines used to do it, and the measures required to gauge the characteristics of the product. Helps engineers to minimize waste and unproductive time in production.
