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Author :
Publisher :
ISBN 13 :
Total Pages : 218 pages
Book Rating : 4.3/5 (91 download)
Download or read book Microelectronic Manufacturing Yield, Reliability, and Failure Analysis written by and published by . This book was released on 1997 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 266 pages
Book Rating : 4.3/5 (91 download)
Download or read book In-line Characterization, Yield Reliability, and Failure Analysis in Microelectronics Manufacturing written by and published by . This book was released on 2001 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Hans-Dieter Hartmann
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 : 9780819426482
Total Pages : 0 pages
Book Rating : 4.4/5 (264 download)
Download or read book Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III written by Hans-Dieter Hartmann and published by SPIE-International Society for Optical Engineering. This book was released on 1997 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Joseph B. Bernstein
Publisher : John Wiley & Sons
ISBN 13 : 1394210930
Total Pages : 404 pages
Book Rating : 4.3/5 (942 download)
Download or read book Reliability Prediction for Microelectronics written by Joseph B. Bernstein and published by John Wiley & Sons. This book was released on 2024-02-20 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt: RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.
Author : Ali Keshavarzi
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 : 9780819422729
Total Pages : 372 pages
Book Rating : 4.4/5 (227 download)
Download or read book Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II written by Ali Keshavarzi and published by SPIE-International Society for Optical Engineering. This book was released on 1996-01-01 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : ASM International
ISBN 13 : 0871708043
Total Pages : 813 pages
Book Rating : 4.8/5 (717 download)
Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Author : Tejinder Gandhi
Publisher : ASM International
ISBN 13 : 1627082468
Total Pages : 719 pages
Book Rating : 4.6/5 (27 download)
Download or read book Microelectronics Fialure Analysis Desk Reference, Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 719 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Author : EDFAS Desk Reference Committee
Publisher : ASM International
ISBN 13 : 1615037268
Total Pages : 673 pages
Book Rating : 4.6/5 (15 download)
Download or read book Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and published by ASM International. This book was released on 2011 with total page 673 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes bibliographical references and index.
Author : Alain C. Diebold
Publisher : CRC Press
ISBN 13 : 0203904540
Total Pages : 703 pages
Book Rating : 4.2/5 (39 download)
Download or read book Handbook of Silicon Semiconductor Metrology written by Alain C. Diebold and published by CRC Press. This book was released on 2001-06-29 with total page 703 pages. Available in PDF, EPUB and Kindle. Book excerpt: Containing more than 300 equations and nearly 500 drawings, photographs, and micrographs, this reference surveys key areas such as optical measurements and in-line calibration methods. It describes cleanroom-based measurement technology used during the manufacture of silicon integrated circuits and covers model-based, critical dimension, overlay
Author : Way Kuo
Publisher : Springer Science & Business Media
ISBN 13 : 1461556716
Total Pages : 407 pages
Book Rating : 4.4/5 (615 download)
Download or read book Reliability, Yield, and Stress Burn-In written by Way Kuo and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 407 pages. Available in PDF, EPUB and Kindle. Book excerpt: The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.
Author : Reza Ghodssi
Publisher : Springer Science & Business Media
ISBN 13 : 0387473181
Total Pages : 1211 pages
Book Rating : 4.3/5 (874 download)
Download or read book MEMS Materials and Processes Handbook written by Reza Ghodssi and published by Springer Science & Business Media. This book was released on 2011-03-18 with total page 1211 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Author : Bernd O. Kolbesen (Chemiker.)
Publisher : The Electrochemical Society
ISBN 13 : 9781566772396
Total Pages : 568 pages
Book Rating : 4.7/5 (723 download)
Download or read book Analytical and Diagnostic Techniques for Semiconductor Materials, Devices and Processes written by Bernd O. Kolbesen (Chemiker.) and published by The Electrochemical Society. This book was released on 1999 with total page 568 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : ASM International
ISBN 13 : 0871707691
Total Pages : 160 pages
Book Rating : 4.8/5 (717 download)
Download or read book Microelectronic Failure Analysis written by and published by ASM International. This book was released on 2002-01-01 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee
Author : Barbara Vasquez
Publisher :
ISBN 13 :
Total Pages : 276 pages
Book Rating : 4.3/5 (91 download)
Download or read book Microelectronics Manufacturing and Reliability written by Barbara Vasquez and published by . This book was released on 1993 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Abraham Landzberg
Publisher : Springer Science & Business Media
ISBN 13 : 1461520290
Total Pages : 663 pages
Book Rating : 4.4/5 (615 download)
Download or read book Microelectronics Manufacturing Diagnostics Handbook written by Abraham Landzberg and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 663 pages. Available in PDF, EPUB and Kindle. Book excerpt: The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
Author : P. Rai-Choudhury
Publisher : The Electrochemical Society
ISBN 13 : 9781566771399
Total Pages : 496 pages
Book Rating : 4.7/5 (713 download)
Download or read book Proceedings of the Electrochemical Society Symposium on Diagnostic Techniques for Semiconductor Materials and Devices written by P. Rai-Choudhury and published by The Electrochemical Society. This book was released on 1997 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Milton Ohring
Publisher : Academic Press
ISBN 13 : 0080575528
Total Pages : 759 pages
Book Rating : 4.0/5 (85 download)
Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
