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Author :
Publisher :
ISBN 13 :
Total Pages : 244 pages
Book Rating : 4.3/5 (91 download)
Download or read book Mechanics and Materials for Electronic Packaging: Thermal and mechanical behavior and modeling written by and published by . This book was released on 1994 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Juan Cepeda-Rizo
Publisher : CRC Press
ISBN 13 : 1000511081
Total Pages : 278 pages
Book Rating : 4.0/5 (5 download)
Download or read book Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments written by Juan Cepeda-Rizo and published by CRC Press. This book was released on 2021-12-29 with total page 278 pages. Available in PDF, EPUB and Kindle. Book excerpt: Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA’s Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space.
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ISBN 13 :
Total Pages : 410 pages
Book Rating : 4.3/5 (243 download)
Download or read book Applied Mechanics Reviews written by and published by . This book was released on 1989 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : D. T. Read
Publisher :
ISBN 13 :
Total Pages : 96 pages
Book Rating : 4.0/5 ( download)
Download or read book Tensile Testing of Thin Films written by D. T. Read and published by . This book was released on 1997 with total page 96 pages. Available in PDF, EPUB and Kindle. Book excerpt: Five technical papers covering the development of a set of techniques for measuring the tensile properties of thin films are gathered here. Also included are drawings of the mechanical components of the apparatus and listings of two computer programs. Additional necessary parts include a computer, instrumentation, two piezoelectric stacks, and an appropriate platform equipped with a microscope. Piezoelectric stacks are used as actuators. Noncontacting eddy-current displacement sensors measure both the tensile displacement and the force.Closed-loop feedback control allows a variety of test programs. The maximum available displacement is about 50 um, and the maximum available force is about 0.3 N. The resolution of displacement is about 25 nm, and the resolution of force is about 100 uN. Cyclic loading has been demonstrated for cycles as short as 20 s.
Author : Yong Liu
Publisher : Springer Science & Business Media
ISBN 13 : 1461410533
Total Pages : 606 pages
Book Rating : 4.4/5 (614 download)
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author : R. C. Picu
Publisher :
ISBN 13 :
Total Pages : 550 pages
Book Rating : 4.F/5 ( download)
Download or read book Fourth International Conference on Constitutive Laws for Engineering Materials written by R. C. Picu and published by . This book was released on 1999 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Shen Liu
Publisher : John Wiley & Sons
ISBN 13 : 0470828412
Total Pages : 586 pages
Book Rating : 4.4/5 (78 download)
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
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Publisher :
ISBN 13 :
Total Pages : 416 pages
Book Rating : 4.3/5 (91 download)
Download or read book Directory of Published Proceedings written by and published by . This book was released on 1998 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Hengyun Zhang
Publisher : Woodhead Publishing
ISBN 13 : 0081025335
Total Pages : 436 pages
Book Rating : 4.0/5 (81 download)
Download or read book Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore written by Hengyun Zhang and published by Woodhead Publishing. This book was released on 2019-11-14 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging
Author : G.Q. Zhang
Publisher : Springer Science & Business Media
ISBN 13 : 1475731590
Total Pages : 195 pages
Book Rating : 4.4/5 (757 download)
Download or read book Benefiting from Thermal and Mechanical Simulation in Micro-Electronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 195 pages. Available in PDF, EPUB and Kindle. Book excerpt: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
Author : Ephraim Suhir
Publisher : Springer Science & Business Media
ISBN 13 : 0387329897
Total Pages : 1471 pages
Book Rating : 4.3/5 (873 download)
Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
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Publisher :
ISBN 13 :
Total Pages : 1138 pages
Book Rating : 4.3/5 (91 download)
Download or read book Advances in Electronic Packaging written by and published by . This book was released on 1999 with total page 1138 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Chandrakant S. Desai
Publisher : CRC Press
ISBN 13 : 1420041916
Total Pages : 711 pages
Book Rating : 4.4/5 (2 download)
Download or read book Mechanics of Materials and Interfaces written by Chandrakant S. Desai and published by CRC Press. This book was released on 2000-12-20 with total page 711 pages. Available in PDF, EPUB and Kindle. Book excerpt: The disturbed state concept (DSC) is a unified, constitutive modelling approach for engineering materials that allows for elastic, plastic, and creep strains, microcracking and fracturing, stiffening or healing, all within a single, hierarchical framework. Its capabilities go well beyond other available material models yet lead to significant simpl
Author : Michael Pecht
Publisher : CRC Press
ISBN 13 : 1498730868
Total Pages : 120 pages
Book Rating : 4.4/5 (987 download)
Download or read book Electronic Packaging Materials and Their Properties written by Michael Pecht and published by CRC Press. This book was released on 2017-12-19 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Author :
Publisher : World Scientific
ISBN 13 : 9811209642
Total Pages : 1079 pages
Book Rating : 4.8/5 (112 download)
Download or read book Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) written by and published by World Scientific. This book was released on 2019-08-27 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Author : John M. Kennedy
Publisher : ASTM International
ISBN 13 : 0803113854
Total Pages : 260 pages
Book Rating : 4.8/5 (31 download)
Download or read book Thermal and Mechanical Behavior of Metal Matrix and Ceramic Matrix Composites written by John M. Kennedy and published by ASTM International. This book was released on 1990 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: Of interest to researchers and practitioners in materials science, especially in the aerospace industry, 16 papers from a symposium in Atlanta, Georgia, November 1988 discuss the analysis, modeling, and behavior of both continuous and discontinuous ceramic and metal matrix composites, and methods of
Author :
Publisher :
ISBN 13 :
Total Pages : 1796 pages
Book Rating : 4.:/5 (31 download)
Download or read book Proceedings written by and published by . This book was released on 2000 with total page 1796 pages. Available in PDF, EPUB and Kindle. Book excerpt:
