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Investigation Of Self Assembled Monolayers As Diffusion Barriers For Copper Interconnect Technology
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Book Synopsis Investigation of Self-assembled Monolayers as Diffusion Barriers for Copper Interconnect Technology by : Kaushik Chanda
Download or read book Investigation of Self-assembled Monolayers as Diffusion Barriers for Copper Interconnect Technology written by Kaushik Chanda and published by . This book was released on 2001 with total page 62 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Copper Interconnect Technology by : Christoph Steinbruchel
Download or read book Copper Interconnect Technology written by Christoph Steinbruchel and published by SPIE Press. This book was released on 2001 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt: A textbook designed to accompany The Society of Photo-Optical Instrumentation Engineers' short course on improving interconnect performance for increased speed in overall circuit performance authored by Steinbrnchel (materials science and engineering, Renselaer Polytechnic Institute) and Chin (senio
Book Synopsis Investigation of Mn and Ti Based Self-forming Barriers for Future Back-end-of-the-line Interconnects by : Venkateswaran Selvaraju
Download or read book Investigation of Mn and Ti Based Self-forming Barriers for Future Back-end-of-the-line Interconnects written by Venkateswaran Selvaraju and published by . This book was released on 2019 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis focusses on the investigation of the suitability of Mn and Ti-based self-forming barriers for the future generation of interconnects on both thermally grown SiO2 and low-k dielectrics. the self-forming barriers chemically interact with the insulating substrates forming diffusion barriers upon annealing and this fabrication approach has potential application in future generations of interconnect technologies as the resultant barriers can be significantly thinner than the conventionally deposited barrier layers. the principal in-situ characterisation techniques used to study the interface chemistry resulting from the interaction of deposited films with the insulating substrates were soft and hard X-ray photoelectron spectroscopy (XPS and HAXPES). secondary ion mass spectroscopy (SIMS) measurements provided information on the structure of the barriers which could be correlated with the XPS results while electrical measurements (four-point probe and CV measurements) helps in studying the feasibility of the self-forming barriers. Comparison of Mn-based diffusion barriers with and without the incorporation of nitrogen in the film showed that the introduction of nitrogen improved the adhesion of the copper to the dielectric while chemically both had similar interfaces. Cu based alloy films of Mn and Ti were prepared and analysed show that both alloying elements improve the adhesion and electrical characteristics compared to pure copper films. However, while Mn forms a dielectric barrier of manganese silicate, ultrathin films of Ti on SiO2 based dielectrics showed the preferential formation of titanium silicide. Thick cobalt/titanium alloy films were also investigated as a potential interconnect and showed the possibility of using a cobalt-based alloy as a replacement for copper and barrier stack for the future generation of interconnects.
Book Synopsis Nanomaterials by : Sivashankar Krishnamoorthy
Download or read book Nanomaterials written by Sivashankar Krishnamoorthy and published by CRC Press. This book was released on 2017-12-19 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanomaterials are being incorporated into products all around us, having an incredible impact on durability, strength, functionality, and other material properties. There are a vast number of nanomaterials presently available, and new formulations and chemistries are being announced daily. Nanomaterials: A Guide to Fabrication and Applications provides product developers, researchers, and materials scientists with a handy resource for understanding the range of options and materials currently available. Covering a variety of nanomaterials and their applications, this practical reference: Discusses the scale of nanomaterials and nanomachines, focusing on integrated circuits (ICs) and microelectromechanical systems (MEMS) Offers insight into different nanomaterials’ interactions with chemical reactions, biological processes, and the environment Examines the mechanical properties of nanomaterials and potential treatments to enhance the nanomaterials’ performance Details recent accomplishments in the use of nanomaterials to create new forms of electronic devices Explores the optical properties of certain nanomaterials and the nanomaterials’ use in optimizing lasers and optical absorbers Describes an energy storage application as well as how nanomaterials from waste products may be used to improve capacitors Featuring contributions from experts around the globe, Nanomaterials: A Guide to Fabrication and Applications serves as a springboard for the discovery of new applications of nanomaterials.
Book Synopsis Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6 by : Fred Roozeboom
Download or read book Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6 written by Fred Roozeboom and published by The Electrochemical Society. This book was released on with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Ta-based Diffusion Barriers for Cu Interconnects by : René Hübner
Download or read book Advanced Ta-based Diffusion Barriers for Cu Interconnects written by René Hübner and published by . This book was released on 2009 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the last few years, copper has become the standard metallisation material for on-chip interconnects in high-performance microprocessors. Compared to the previously used aluminium, copper shows not only a lower resistivity, but also significantly improved electromigration resistance. Copper ions, however, are very mobile in silicon and many dielectric materials under electrical and thermal bias. Thus, barrier layers are needed to prevent Cu diffusion into the insulating layers surrounding the metallic interconnects. Since Ta-based compounds are characterized by a high thermal stability, pure Ta films or layer stacks consisting of Ta and TaN are used for such barriers. The continuous scaling down of the interconnect dimensions and, therefore, the essential decrease in the barrier layer thickness coupled with the replacement of silicon oxide by advanced low-k dielectrics demand further improvements of the diffusion barrier performance. It is the aim of this book to carry out microstructure and functional property investigations for advanced, high-performance Tabased diffusion barriers (Ta-TaN layer stacks and Ta-Si-N single layers) before and after annealing to compare their thermal stabilities and to probe the corresponding failure mechanisms. For the Ta-TaN barriers, these studies are undertaken for a range of layer sequences, while for the Ta-Si-N barriers a variety of films with different chemical compositions are analysed.
Book Synopsis Nanoelectronic Device Applications Handbook by : James E. Morris
Download or read book Nanoelectronic Device Applications Handbook written by James E. Morris and published by CRC Press. This book was released on 2017-11-22 with total page 940 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoelectronic Device Applications Handbook gives a comprehensive snapshot of the state of the art in nanodevices for nanoelectronics applications. Combining breadth and depth, the book includes 68 chapters on topics that range from nano-scaled complementary metal–oxide–semiconductor (CMOS) devices through recent developments in nano capacitors and AlGaAs/GaAs devices. The contributors are world-renowned experts from academia and industry from around the globe. The handbook explores current research into potentially disruptive technologies for a post-CMOS world. These include: Nanoscale advances in current MOSFET/CMOS technology Nano capacitors for applications such as electronics packaging and humidity sensors Single electron transistors and other electron tunneling devices Quantum cellular automata and nanomagnetic logic Memristors as switching devices and for memory Graphene preparation, properties, and devices Carbon nanotubes (CNTs), both single CNT and random network Other CNT applications such as terahertz, sensors, interconnects, and capacitors Nano system architectures for reliability Nanowire device fabrication and applications Nanowire transistors Nanodevices for spintronics The book closes with a call for a new generation of simulation tools to handle nanoscale mechanisms in realistic nanodevice geometries. This timely handbook offers a wealth of insights into the application of nanoelectronics. It is an invaluable reference and source of ideas for anyone working in the rapidly expanding field of nanoelectronics.
Book Synopsis Development of Alternative Diffusion Barriers for Advanced Copper Interconnects by : Lii-Cherng Leu
Download or read book Development of Alternative Diffusion Barriers for Advanced Copper Interconnects written by Lii-Cherng Leu and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: As the failure temperature for 5 nm iridium barrier was 400 °C, the addition of TaN layer strongly improved the barrier performance. The utilization of Pd as a catalyst for Cu electroless deposition along with TaN to form a bilayer barrier was also investigated. The Pd/TaN bilayer structure was shown to prevent copper diffusion up to 550 °C for 1 h. Ternary refractory metal nitride W-B-N thin films were also studied as a candidate diffusion barrier for Cu metallization on Si. W-B-N thin films were amorphous with low resistivity ranging from 159.92 to 240.4 [mu][Omega]cm. The W-B-N thin films deposited at 5 % N2 flow ratio can block Cu diffusion after 500 °C annealing for 1 h. As one of the interesting refractory metal nitrides for Cu diffusion barrier application, the comparative study between ZrN and Zr-Ge-N thin films as diffusion barriers was also examined.
Book Synopsis Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11 by : Takeshi Hattori
Download or read book Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11 written by Takeshi Hattori and published by The Electrochemical Society. This book was released on 2009-09 with total page 407 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions includes papers presented during the 11th International Symposium on Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing held during the ECS Fall Meeting in Vienna, Austria, October 4-9, 2009.
Book Synopsis Chemistry in Microelectronics by : Yannick Le Tiec
Download or read book Chemistry in Microelectronics written by Yannick Le Tiec and published by John Wiley & Sons. This book was released on 2013-02-28 with total page 261 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics is a complex world where many sciences need to collaborate to create nano-objects: we need expertise in electronics, microelectronics, physics, optics and mechanics also crossing into chemistry, electrochemistry, as well as biology, biochemistry and medicine. Chemistry is involved in many fields from materials, chemicals, gases, liquids or salts, the basics of reactions and equilibrium, to the optimized cleaning of surfaces and selective etching of specific layers. In addition, over recent decades, the size of the transistors has been drastically reduced while the functionality of circuits has increased. This book consists of five chapters covering the chemicals and sequences used in processing, from cleaning to etching, the role and impact of their purity, along with the materials used in “Front End Of the Line” which corresponds to the heart and performance of individual transistors, then moving on to the “Back End Of the Line” which is related to the interconnection of all the transistors. Finally, the need for specific functionalization also requires key knowledge on surface treatments and chemical management to allow new applications. Contents 1. Chemistry in the “Front End of the Line” (FEOL): Deposits, Gate Stacks, Epitaxy and Contacts, François Martin, Jean-Michel Hartmann, Véronique Carron and Yannick Le Tiec. 2. Chemistry in Interconnects, Vincent Jousseaume, Paul-Henri Haumesser, Carole Pernel, Jeffery Butterbaugh, Sylvain Maîtrejean and Didier Louis. 3. The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying, Yannick Le Tiec and Martin Knotter. 4. The Use and Management of Chemical Fluids in Microelectronics, Christiane Gottschalk, Kevin Mclaughlin, Julie Cren, Catherine Peyne and Patrick Valenti. 5. Surface Functionalization for Micro- and Nanosystems: Application to Biosensors, Antoine Hoang, Gilles Marchand, Guillaume Nonglaton, Isabelle Texier-Nogues and Francoise Vinet. About the Authors Yannick Le Tiec is a technical expert at CEA-Leti, Minatec since 2002. He is a CEA-Leti assignee at IBM, Albany (NY) to develop the advanced 14 nm CMOS node and the FDSOI technology. He held different technical positions from the advanced 300 mm SOI CMOS pilot line to different assignments within SOITEC for advanced wafer development and later within INES to optimize solar cell ramp-up and yield. He has been part of the ITRS Front End technical working group at ITRS since 2008.
Book Synopsis Advances in Nanotechnology Research and Application: 2013 Edition by :
Download or read book Advances in Nanotechnology Research and Application: 2013 Edition written by and published by ScholarlyEditions. This book was released on 2013-06-21 with total page 788 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Nanotechnology Research and Application: 2013 Edition is a ScholarlyEditions™ book that delivers timely, authoritative, and comprehensive information about Atomic Layer Deposition. The editors have built Advances in Nanotechnology Research and Application: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Atomic Layer Deposition in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Advances in Nanotechnology Research and Application: 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.
Book Synopsis Chimie en microélectronique by : LE TIEC Yannick
Download or read book Chimie en microélectronique written by LE TIEC Yannick and published by Lavoisier. This book was released on 2013-07-01 with total page 386 pages. Available in PDF, EPUB and Kindle. Book excerpt: La microélectronique est un monde complexe dans lequel plusieurs sciences comme la physique, l’électronique, l’optique ou la mécanique, contribuent à créer des nano-objets fonctionnels. La chimie est particulièrement impliquée dans de nombreux domaines tels que la synthèse des matériaux, la pureté des fluides, des gaz, des sels, le suivi des réactions chimiques et de leurs équilibres ainsi que la préparation de surfaces optimisées et la gravure sélective de couches spécifiques. Au cours des dernières décennies, la taille des transistors s’est considérablement réduite et la fonctionnalité des circuits électroniques s’est accrue. Cette évolution a conduit à une interpénétration de la chimie et de la microélectronique exposée dans cet ouvrage. Chimie en microélectronique présente les chimies et les séquences utilisées lors des procédés de production de la microélectronique, des nettoyages jusqu’aux gravures des plaquettes de silicium, du rôle et de l’impact de leur niveau de pureté jusqu’aux procédés d’interconnexion des millions de transistors composant un circuit électronique. Afin d’illustrer la convergence avec le domaine de la santé, l’ouvrage expose les nouvelles fonctionnalisations spécifiques, tels que les capteurs biologiques ou les capteurs sur la personne.
Book Synopsis Thin Films: Stresses and Mechanical Properties IX: Volume 695 by : Materials Research Society. Meeting
Download or read book Thin Films: Stresses and Mechanical Properties IX: Volume 695 written by Materials Research Society. Meeting and published by . This book was released on 2002-04 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Electrical & Electronics Abstracts by :
Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 2092 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Metallization written by S. P. Murarka and published by Butterworth-Heinemann. This book was released on 1993 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.
Book Synopsis Journal by : American Chemical Society
Download or read book Journal written by American Chemical Society and published by . This book was released on 2004 with total page 1124 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Science Abstracts written by and published by . This book was released on 1995 with total page 1360 pages. Available in PDF, EPUB and Kindle. Book excerpt:
