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Author : Alfred P. DeFonzo
Publisher :
ISBN 13 :
Total Pages : 692 pages
Book Rating : 4.3/5 (91 download)
Download or read book International Symposium on Advances in Interconnection and Packaging written by Alfred P. DeFonzo and published by . This book was released on 1991 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 322 pages
Book Rating : 4.3/5 (91 download)
Download or read book International Symposium on Advanced Packaging Materials written by and published by . This book was released on 2005 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 224 pages
Book Rating : 4.E/5 ( download)
Download or read book Proceedings, 3rd International Symposium on Advanced Packaging Materials written by and published by . This book was released on 1997 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028640
Total Pages : 463 pages
Book Rating : 4.0/5 (4 download)
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Author : James E. Morris
Publisher : Springer Science & Business Media
ISBN 13 : 0387473262
Total Pages : 553 pages
Book Rating : 4.3/5 (874 download)
Download or read book Nanopackaging written by James E. Morris and published by Springer Science & Business Media. This book was released on 2008-12-30 with total page 553 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author :
Publisher :
ISBN 13 :
Total Pages : 694 pages
Book Rating : 4.F/5 ( download)
Download or read book Microelectronic Interconnects and Packages written by and published by . This book was released on 1991 with total page 694 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : M. Datta
Publisher : CRC Press
ISBN 13 : 020347368X
Total Pages : 564 pages
Book Rating : 4.2/5 (34 download)
Download or read book Microelectronic Packaging written by M. Datta and published by CRC Press. This book was released on 2004-12-20 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811613761
Total Pages : 513 pages
Book Rating : 4.8/5 (116 download)
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Author :
Publisher :
ISBN 13 :
Total Pages : 2410 pages
Book Rating : 4.3/5 (91 download)
Download or read book The Cumulative Book Index written by and published by . This book was released on 1992 with total page 2410 pages. Available in PDF, EPUB and Kindle. Book excerpt: A world list of books in the English language.
Author : Chong Leong, Gan
Publisher : Springer Nature
ISBN 13 : 3031267087
Total Pages : 223 pages
Book Rating : 4.0/5 (312 download)
Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Author : Scott A. Wartenberg
Publisher : Artech House
ISBN 13 : 9781580532730
Total Pages : 256 pages
Book Rating : 4.5/5 (327 download)
Download or read book RF Measurements of Die and Packages written by Scott A. Wartenberg and published by Artech House. This book was released on 2002 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: The recent explosion of the RF wireless integrated circuits (IC), coupled with higher operating speeds in digital IC's has made accurate RF testing of IC's vital. This ground-breaking resource explains the fundamentals of performing accurate RF measurements of die and packages. It offers you practical advice on how to use coplanar probes and test fixtures in the lab for RF on-wafer die and package characterization. It also details how to build separate RF test systems for noise, high-power, and thermal testing as well as de-embed the test system's parasitic effects to get the die's RF performance. This book is a handy, practical resource for RFIC and MMIC designers as well as high-frequency digital IC designers, IC test engineers, and IC manufacturing test engineers.
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Charles A. Harper
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 1112 pages
Book Rating : 4.3/5 (91 download)
Download or read book Electronic Packaging and Interconnection Handbook written by Charles A. Harper and published by McGraw-Hill Professional Publishing. This book was released on 2000 with total page 1112 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.
Author : Ho-Ming Tong
Publisher : Springer Science & Business Media
ISBN 13 : 1441957685
Total Pages : 562 pages
Book Rating : 4.4/5 (419 download)
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
ISBN 13 : 1461513898
Total Pages : 1250 pages
Book Rating : 4.4/5 (615 download)
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author : Sajjan G. Shiva
Publisher : CRC Press
ISBN 13 : 1351992090
Total Pages : 360 pages
Book Rating : 4.3/5 (519 download)
Download or read book Advanced Computer Architectures written by Sajjan G. Shiva and published by CRC Press. This book was released on 2018-10-24 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: Despite the tremendous advances in performance enabled by modern architectures, there are always new applications and demands arising that require ever-increasing capabilities. Keeping up with these demands requires a deep-seated understanding of contemporary architectures in concert with a fundamental understanding of basic principles that allows one to anticipate what will be possible over the system's lifetime. Advanced Computer Architectures focuses on the design of high performance supercomputers with balanced coverage of the hardware, software structures, and application characteristics. This book is a timeless distillation of underlying principles punctuated by real-world implementations in popular current and past commercially available systems. It briefly reviews the basics of uniprocessor architecture before outlining the most popular processing paradigms, performance evaluation, and cost factor considerations. This builds to a discussion of pipeline design and vector processors, data parallel architectures, and multiprocessor systems. Rounding out the book, the final chapter explores some important current and emerging trends such as Dataflow, Grid, biology-inspired, and optical computing. More than 220 figures, tables, and equations illustrate the concepts presented. Based on the author's more than thirty years of teaching and research, Advanced Computer Architectures endows you with the tools necessary to reach the limits of existing technology, and ultimately, to break them.
Author : 国立国会図書館 (Japan)
Publisher :
ISBN 13 :
Total Pages : 1762 pages
Book Rating : 4.:/5 ( download)
Download or read book 国立国会図書館所蔵科学技術関係欧文会議錄目錄 written by 国立国会図書館 (Japan) and published by . This book was released on 1900 with total page 1762 pages. Available in PDF, EPUB and Kindle. Book excerpt:
